SQ4917EY
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Vishay Siliconix
Automotive Dual P-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
SO-8 Dual
D1
8
D1
7
D2
6
• TrenchFET® power MOSFET
D2
5
• AEC-Q101 qualified c
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Top View
2
1 G1
S1
4
3 G2
S2
S1
G1
S2
G2
PRODUCT SUMMARY
VDS (V)
-60
RDS(on) (Ω) at VGS = -10 V
0.0480
RDS(on) (Ω) at VGS = -4.5 V
0.0612
ID (A) per leg
-8
Configuration
Dual
D1
D2
P-Channel MOSFET P-Channel MOSFET
ORDERING INFORMATION
Package
SO-8
Lead (Pb)-free and halogen-free
SQ4917EY
(for detailed order number please see www.vishay.com/doc?79771)
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-source voltage
VDS
-60
Gate-source voltage
VGS
± 20
Continuous drain current
TC = 25 °C
TC = 125 °C
IS
Continuous source current (diode conduction)
Pulsed drain
current a
Single pulse avalanche current
Single pulse avalanche energy
Maximum power dissipation a
ID
L = 0.1 mH
TC = 25 °C
TC = 125 °C
-4.75
-4.5
-32
IAS
-22.4
EAS
25
TJ, Tstg
Operating junction and storage temperature range
V
-8
IDM
PD
UNIT
5
1.67
-55 to +175
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-ambient
Junction-to-foot (drain)
PCB
mount b
SYMBOL
LIMIT
RthJA
110
RthJF
30
UNIT
°C/W
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
b. When mounted on 1" square PCB (FR-4 material)
c. Parametric verification ongoing
S21-0375-Rev. C, 23-Apr-2021
Document Number: 62785
1
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4917EY
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Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
VDS
VGS = 0 V, ID = -250 μA
-60
-
-
VGS(th)
VDS = VGS, ID = -250 μA
-1.5
-2.0
-2.5
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
± 100
-1
UNIT
Static
Drain-source breakdown voltage
Gate-source threshold voltage
Gate-source leakage
Zero gate voltage drain current
On-state drain current a
Drain-source on-state resistance a
Forward
transconductance b
IDSS
ID(on)
RDS(on)
gfs
VGS = 0 V
VDS = -60 V
-
-
VGS = 0 V
VDS = -60 V, TJ = 125 °C
-
-
-50
VGS = 0 V
VDS = -60 V, TJ = 175 °C
-
-
-150
VGS = -10 V
VDS ≤ -5 V
-30
-
-
VGS = -10 V
ID = -4.3 A
-
0.0400
0.0480
VGS = -10 V
ID = -4.3 A, TJ = 125 °C
-
-
0.0780
VGS = -10 V
ID = -4.3 A, TJ = 175 °C
-
-
0.0960
VGS = -4.5 V
ID = -3.8 A
-
0.0510
0.0612
-
13
-
-
1530
1910
VDS = -15 V, ID = -4.3 A
V
nA
μA
A
Ω
S
Dynamic b
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Total gate charge c
Qg
Gate-source charge c
Qgs
Gate-drain charge c
Qgd
Gate resistance
Rg
Turn-on delay time c
Rise time c
Turn-off delay
Fall time c
VGS = -10 V
VDS = -30 V, f = 1 MHz
VDS = -30 V, ID = -5 A
f = 1 MHz
td(on)
tr
time c
VGS = 0 V
td(off)
VDD = -30 V, RL = 8.8 Ω
ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω
tf
Source-Drain Diode Ratings and Characteristics
-
334
417
-
114
142
-
43.4
65
-
4.7
-
-
9
-
1.3
2.5
4
-
11
17
pF
nC
Ω
-
11
17
-
35
52
-
6
9
-
-
-32
A
-
-0.8
-1.2
V
ns
b
Pulsed current a
ISM
Forward voltage
VSD
IF = -2.8 A, VGS = 0 V
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S21-0375-Rev. C, 23-Apr-2021
Document Number: 62785
2
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4917EY
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
30
30
24
VGS = 10 V thru 4 V
ID - Drain Current (A)
ID - Drain Current (A)
24
18
12
6
18
TC = 25 °C
12
6
VGS = 3 V
TC = 125 °C
TC = - 55 °C
0
0
0
2
4
6
8
0
10
2
VDS - Drain-to-Source Voltage (V)
4
6
10
25
8
20
gfs - Transconductance (S)
TC = 25 °C
ID - Drain Current (A)
10
Transfer Characteristics
Output Characteristics
6
TC = 25 °C
4
2
8
VGS - Gate-to-Source Voltage (V)
TC = 125 °C
TC = - 55 °C
15
TC = 125 °C
10
5
TC = - 55 °C
0
0
0
1
2
3
4
0
5
2
4
3000
0.12
2400
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
0.15
0.09
VGS = 4.5 V
0.03
8
10
Transconductance
Transfer Characteristics
0.06
6
ID - Drain Current (A)
VGS - Gate-to-Source Voltage (V)
1800
Ciss
1200
600
VGS = 10 V
Coss
Crss
0.00
0
0
6
12
18
24
ID - Drain Current (A)
On-Resistance vs. Drain Current
S21-0375-Rev. C, 23-Apr-2021
30
0
12
24
36
48
60
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 62785
3
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4917EY
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
2.0
10
RDS(on) - On-Resistance (Normalized)
VGS - Gate-to-Source Voltage (V)
ID = 5 A
VDS = 30 V
8
6
4
2
9
18
27
36
45
VGS = 4.5 V
1.1
0.8
0
Qg - Total Gate Charge (nC)
50
75
100
125
150
175
On-Resistance vs. Junction Temperature
100
0.5
10
0.4
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
25
TJ - Junction Temperature (°C)
Gate Charge
TJ = 150 °C
1
TJ = 25 °C
0.1
VGS = 10 V
1.4
0.5
- 50 - 25
0
0
ID = 3.5 A
1.7
0.3
0.2
0.01
0.1
0.001
0.0
TJ = 150 °C
TJ = 25 °C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
VSD - Source-to-Drain Voltage (V)
6
8
10
On-Resistance vs. Gate-to-Source Voltage
- 60
0.9
VDS - Drain-to-Source Voltage (V)
ID = 1 mA
0.7
VGS(th) Variance (V)
4
VGS - Gate-to-Source Voltage (V)
Source Drain Diode Forward Voltage
ID = 250 μA
0.5
0.3
ID = 5 mA
0.1
- 0.1
- 0.3
- 50 - 25
2
0
25
50
75
100
TJ - Temperature (°C)
Threshold Voltage
S21-0375-Rev. C, 23-Apr-2021
125
150
175
- 65
- 70
- 75
- 80
- 50 - 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Drain Source Breakdown vs. Junction Temperature
Document Number: 62785
4
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4917EY
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
100
IDM Limited
ID - Drain Current (A)
10
100 μs
a
Limited by RDS(on)
1 ms
1
10 ms
100 ms
0.1
TC = 25 °C
Single Pulse
0.01
0.01
0.1
BVDSS Limited
1
10
1s
10 s, DC
100
VDS - Drain-to-Source Voltage (V)
Safe Operating Area
Note
a. VGS > minimum VGS at which RDS(on) is specified
S21-0375-Rev. C, 23-Apr-2021
Document Number: 62785
5
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4917EY
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 105 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Foot (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?62785.
S21-0375-Rev. C, 23-Apr-2021
Document Number: 62785
6
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
SOIC (NARROW): 8-LEAD
JEDEC Part Number: MS-012
8
6
7
5
E
1
3
2
H
4
S
h x 45
D
C
0.25 mm (Gage Plane)
A
e
B
All Leads
q
A1
L
0.004"
MILLIMETERS
INCHES
DIM
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.20
0.004
0.008
B
0.35
0.51
0.014
0.020
C
0.19
0.25
0.0075
0.010
D
4.80
5.00
0.189
0.196
E
3.80
4.00
0.150
e
0.101 mm
1.27 BSC
0.157
0.050 BSC
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.50
0.93
0.020
0.037
q
0°
8°
0°
8°
S
0.44
0.64
0.018
0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
Document Number: 71192
11-Sep-06
www.vishay.com
1
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR SO-8
0.172
(4.369)
0.028
0.022
0.050
(0.559)
(1.270)
0.152
(3.861)
0.047
(1.194)
0.246
(6.248)
(0.711)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
APPLICATION NOTE
Return to Index
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Document Number: 72606
Revision: 21-Jan-08
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Revision: 01-Jan-2022
1
Document Number: 91000