SQD50N06-09L
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Vishay Siliconix
Automotive N-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Halogen-free According to IEC 61249-2-21
Definition
60
RDS(on) () at VGS = 10 V
0.009
RDS(on) () at VGS = 4.5 V
0.013
ID (A)
• TrenchFET® Power MOSFET
• 100 % Rg and UIS Tested
50
Configuration
• Compliant to RoHS Directive 2002/95/EC
Single
• AEC-Q101 Qualifiedd
D
TO-252
G
Drain Connected to Tab
G
D
S
S
Top View
N-Channel MOSFET
ORDERING INFORMATION
Package
TO-252
Lead (Pb)-free and Halogen-free
SQD50N06-09L-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
VDS
60
Gate-Source Voltage
VGS
± 20
TC = 25 °Ca
Continuous Drain Current
Continuous Source Current (Diode
ID
TC = 125 °C
Conduction)a
Pulsed Drain Currentb
Single Pulse Avalanche Energy
Single Pulse Avalanche Current
Maximum Power Dissipationb
L = 0.1 mH
TC = 25 °C
Operating Junction and Storage Temperature Range
V
50
49
IS
50
IDM
200
IAS
48
EAS
115
PD
TC = 125 °C
UNIT
136
45
A
mJ
W
TJ, Tstg
- 55 to + 175
°C
SYMBOL
LIMIT
UNIT
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
PCB
Mountc
Junction-to-Case (Drain)
RthJA
50
RthJC
1.1
°C/W
Notes
a. Package limited.
b. Pulse test; pulse width 300 μs, duty cycle 2 %.
c. When mounted on 1" square PCB (FR-4 material).
d. Parametric verification ongoing.
S11-2065-Rev. B, 24-Oct-11
1
Document Number: 68901
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD50N06-09L
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Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
Gate-Source Threshold Voltage
Gate-Source Leakage
VGS = 0 V, ID = 250 μA
60
-
-
VDS = VGS, ID = 250 μA
1.5
2.0
2.5
VDS = 0 V, VGS = ± 20 V
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductanceb
VDS
VGS(th)
RDS(on)
-
-
± 100
VGS = 0 V
VDS = 60 V
-
-
1.0
VGS = 0 V
VDS = 60 V, TJ = 125 °C
-
-
50
VGS = 0 V
VDS = 60 V, TJ = 175 °C
-
-
250
VGS = 10 V
VDS5 V
50
-
-
VGS = 10 V
ID = 20 A
-
0.0071
0.0090
VGS = 10 V
ID = 20 A, TJ = 125 °C
-
-
0.016
VGS = 10 V
ID = 20 A, TJ = 175 °C
-
-
0.019
VGS = 4.5 V
ID = 10 A
-
0.0094
0.013
-
62
-
-
2451
3065
gfs
VDS = 15 V, ID = 20 A
V
nA
μA
A
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
-
435
545
Reverse Transfer Capacitance
Crss
-
192
240
Total Gate Chargec
Qg
-
48
72
-
7.1
-
-
13.5
-
0.85
1.7
2.6
-
10
15
-
11
17
-
27
41
-
8
12
-
-
200
A
-
0.82
1.5
V
Gate-Source
Chargec
Gate-Drain Chargec
Gate Resistance
Turn-On Delay Timec
Rise Timec
Turn-Off Delay
Qgs
Fall Timec
Source-Drain Diode Ratings and
VGS = 10 V
VDS = 25 V, f = 1 MHz
VDS = 30 V, ID = 50 A
Qgd
f = 1 MHz
Rg
td(on)
tr
Timec
VGS = 0 V
td(off)
VDD = 30 V, RL = 0.6
ID 50 A, VGEN = 10 V, Rg = 1
tf
pF
nC
ns
Characteristicsb
Pulsed Currenta
ISM
Forward Voltage
VSD
IF = 20 A, VGS = 0 V
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S11-2065-Rev. B, 24-Oct-11
2
Document Number: 68901
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD50N06-09L
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
100
100
V GS = 10 V thru 5 V
80
ID - Drain Current (A)
ID - Drain Current (A)
80
V GS = 4 V
60
40
60
40
T C = 25 °C
20
20
V GS = 3 V
T C = 125 °C
V GS = 2 V
0
4
8
12
16
0
20
4
6
8
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
10
120
100
6
g fs - Transconductance (S)
8
ID - Drain Current (A)
2
VDS - Drain-to-Source Voltage (V)
10
T C = 25 °C
4
2
T C = - 55 °C
0
0
1
2
T C = - 55 °C
80
T C = 25 °C
60
40
T C = 125 °C
20
T C = 125 °C
3
4
0
0
5
10
20
30
40
VGS - Gate-to-Source Voltage (V)
ID - Drain Current (A)
Transfer Characteristics
Transconductance
50
4000
0.025
0.020
3000
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
T C = - 55 °C
0
0
0.015
V GS = 4.5 V
0.010
V GS = 10 V
Ciss
2000
1000
Coss
0.005
0
Crss
0
0
20
40
60
80
0
100
ID - Drain Current (A)
20
30
40
50
60
VDS - Drain-to-Source Voltage (V)
Capacitance
On-Resistance vs. Drain Current
S11-2065-Rev. B, 24-Oct-11
10
3
Document Number: 68901
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD50N06-09L
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
10
2.5
ID = 20 A
8
2.1
6
4
V GS = 10 V
(Normalized)
V DS = 30 V
RDS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
ID = 50 A
2
1.7
V GS = 4.5 V
1.3
0.9
0
0
10
20
30
40
0.5
- 50
50
- 25
0
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Qg - Total Gate Charge (nC)
Gate Charge
On-Resistance vs. Junction Temperature
100
0.05
10
0.04
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
25
T J = 150 °C
1
T J = 25 °C
0.1
0.03
0.02
T J = 125 °C
T J = 25 °C
0.01
0.01
0
0.001
0
0.2
0.4
0.6
0.8
1.0
0
1.2
2
4
6
8
10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
75
0.5
VDS - Drain-to-Source Voltage (V)
ID = 10 mA
VGS(th) Variance (V)
0.1
- 0.3
ID = 5 mA
- 0.7
ID = 250 μA
- 1.1
- 1.5
- 50
- 25
0
25
50
75
100
125
150
69
66
63
60
- 50
175
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
TJ - Temperature (°C)
Drain Source Breakdown vs. Junction Temperature
Threshold Voltage
S11-2065-Rev. B, 24-Oct-11
72
4
Document Number: 68901
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD50N06-09L
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
1000
IDM Limited
I D - Drain Current (A)
100
100 µs
Limited by
RDS(on)*
ID Limited
10
1 ms
10 ms
100 ms, 1 s, 10 s, DC
1
0.1
TC = 25 °C
Single Pulse
0.01
0.01
* VGS
BVDSS Limited
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which R DS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
S11-2065-Rev. B, 24-Oct-11
5
Document Number: 68901
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQD50N06-09L
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Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
100
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Case (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?68901.
S11-2065-Rev. B, 24-Oct-11
6
Document Number: 68901
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
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Vishay Siliconix
TO-252AA Case Outline
E
MILLIMETERS
A
C2
e
b2
D1
e1
E1
L
gage plane height (0.5 mm)
L4
b
L5
H
D
L3
b3
C
A1
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
2.18
2.38
0.086
0.094
A1
-
0.127
-
0.005
b
0.64
0.88
0.025
0.035
b2
0.76
1.14
0.030
0.045
b3
4.95
5.46
0.195
0.215
0.024
C
0.46
0.61
0.018
C2
0.46
0.89
0.018
0.035
D
5.97
6.22
0.235
0.245
D1
4.10
-
0.161
-
E
6.35
6.73
0.250
0.265
E1
4.32
-
0.170
-
H
9.40
10.41
0.370
0.410
e
2.28 BSC
e1
0.090 BSC
4.56 BSC
0.180 BSC
L
1.40
1.78
0.055
0.070
L3
0.89
1.27
0.035
0.050
L4
-
1.02
-
0.040
L5
1.01
1.52
0.040
0.060
ECN: T13-0592-Rev. A, 02-Sep-13
DWG: 6019
Note
• Dimension L3 is for reference only.
Revision: 02-Sep-13
Document Number: 64424
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
0.243
0.087
(2.202)
0.090
(2.286)
(10.668)
0.420
(6.180)
(5.690)
0.180
0.055
(4.572)
(1.397)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Return to Index
APPLICATION NOTE
Document Number: 72594
Revision: 21-Jan-08
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Revision: 01-Jan-2022
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Document Number: 91000