SQM50034E
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Vishay Siliconix
Automotive N-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
TO-263
• TrenchFET® power MOSFET
• Package with low thermal resistance
• 100 % Rg and UIS tested
• AEC-Q101 qualified
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
S
D
Top View
G
D
PRODUCT SUMMARY
VDS (V)
RDS(on) () at VGS = 10 V
60
0.0039
ID (A)
Configuration
Package
G
100
Single
N-Channel MOSFET
TO-263
S
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-source voltage
VDS
60
Gate-source voltage
VGS
± 20
Continuous drain current
TC = 25 °C a
TC = 125 °C
Continuous source current (diode conduction) a
Pulsed drain current b
Single pulse avalanche current
Single pulse avalanche energy
Maximum power dissipation b
L = 0.1 mH
TC = 25 °C
TC = 125 °C
Operating junction and storage temperature range
ID
V
100
80
IS
100
IDM
320
IAS
50
EAS
125
PD
UNIT
150
50
A
mJ
W
TJ, Tstg
-55 to +175
°C
SYMBOL
LIMIT
UNIT
RthJA
40
RthJC
1
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-ambient
Junction-to-case (drain)
PCB mount c
°C/W
Notes
a. Package limited
b. Pulse test; pulse width 300 μs, duty cycle 2 %
c. When mounted on 1" square PCB (FR4 material)
S18-1076-Rev. A, 22-Oct-2018
Document Number: 76971
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For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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SQM50034E
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SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-source breakdown voltage
Gate-source threshold voltage
Gate-source leakage
VDS
VGS = 0 V, ID = 250 μA
60
-
-
VGS(th)
VDS = VGS, ID = 250 μA
2.5
3.0
3.5
VDS = 0 V, VGS = ± 20 V
IGSS
-
-
± 100
VGS = 0 V
VDS = 60 V
-
-
1
-
-
50
V
nA
μA
Zero gate voltage drain current
IDSS
VGS = 0 V
VDS = 60 V, TJ = 125 °C
VGS = 0 V
VDS = 60 V, TJ = 175 °C
-
-
300
μA
On-state drain current a
ID(on)
VGS = 10 V
VDS 5 V
100
-
-
A
VGS = 10 V
ID = 20 A
-
0.0032
0.0039
VGS = 10 V
ID = 20 A, TJ = 125 °C
-
-
0.0062
VGS = 10 V
ID = 20 A, TJ = 175 °C
-
-
0.0075
-
135
-
-
4841
6600
-
2243
3100
-
60
85
Drain-source on-state resistance a
Forward transconductance b
RDS(on)
gfs
VDS = 15 V, ID = 20 A
S
Dynamic b
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Total gate charge c
Qg
Gate-source charge c
Qgs
Gate-drain charge c
Qgd
Gate resistance
Turn-on delay time c
Rise time c
Turn-off delay time c
Fall time c
Rg
VGS = 0 V
VGS = 10 V
VDS = 25 V, f = 1 MHz
VDS = 30 V, ID = 50 A
f = 1 MHz
td(on)
tr
td(off)
VDD = 30 V, RL = 0.6
ID 50 A, VGEN = 10 V, Rg = 1
tf
-
58
90
-
24
-
-
5
-
0.6
1.26
1.9
-
19
30
-
10
20
-
30
50
-
8
15
pF
nC
ns
Source-Drain Diode Ratings and Characteristics b
Pulsed current a
ISM
Forward voltage
VSD
Body diode reverse recovery time
trr
Body diode reverse recovery charge
Qrr
IF = 25 A, VGS = 0 V
IF = 30 A, di/dt = 100 A/μs
-
-
320
-
0.83
1.5
V
-
50
100
ns
-
55
110
nC
Reverse recovery fall time
ta
-
24
-
Reverse recovery rise time
tb
-
26
-
IRM(REC)
-
-1.92
-
Body diode peak reverse recovery current
A
ns
A
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S18-1076-Rev. A, 22-Oct-2018
Document Number: 76971
2
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQM50034E
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Axis Title
Axis Title
300
VGS = 10 V thru 6 V
1st line
2nd line
VGS = 5 V
100
60
1000
108
1st line
2nd line
1000
180
120
10000
144
2nd line
ID - Drain Current (A)
240
2nd line
ID - Drain Current (A)
180
10000
72
100
TC = 25 °C
TC = 125 °C
36
TC = -55 °C
0
0
10
0
2
4
6
8
10
10
0
VDS - Drain-to-Source Voltage (V)
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
Output Characteristics
Axis Title
Axis Title
300
0.010
10000
10000
1000
TC = 125 °C
180
120
100
60
0
15
30
45
60
1000
0.006
VGS = 10 V
0.004
100
0.002
0.000
10
0
0.008
75
10
0
20
ID - Drain Current (A)
40
Axis Title
Axis Title
100
100
Crss
10
10
36
48
VDS - Drain-to-Source Voltage (V)
Capacitance
S18-1076-Rev. A, 22-Oct-2018
60
10000
ID = 50 A
VDS = 30 V
8
1000
6
1st line
2nd line
1000
2nd line
VGS - Gate-to-Source Voltage (V)
Coss
1st line
2nd line
2nd line
C - Capacitance (pF)
Ciss
24
100
10
10000
12
80
On-Resistance vs. Drain Current
10 000
0
60
ID - Drain Current (A)
Transconductance
1000
1st line
2nd line
TC = 25 °C
2nd line
RDS(on) - On-Resistance (Ω)
240
1st line
2nd line
2nd line
gfs - Transconductance (S)
TC = -55 °C
4
100
2
0
10
0
12
24
36
48
60
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 76971
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For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQM50034E
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Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Axis Title
100
10000
10000
ID = 20 A
1000
1.5
VGS = 10 V
1.2
100
TJ = 150 °C
10
1000
1
TJ = 25 °C
100
0.1
0.9
0.6
0.01
10
-50 -25
0
25
50
75
10
0
100 125 150 175
0.3
TJ - Junction Temperature (°C)
0.6
0.9
1.2
1.5
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source Drain Diode Forward Voltage
Axis Title
Axis Title
0.025
0.9
10000
10000
0.4
1000
0.015
0.010
100
TJ = 150 °C
0.005
1000
-0.1
1st line
2nd line
2nd line
VGS(th) - Variance (V)
0.020
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Ω)
1st line
2nd line
2nd line
IS - Source Current (A)
1.8
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Normalized)
Axis Title
2.1
ID = 5 mA
-0.6
100
-1.1
ID = 250 μA
TJ = 25 °C
0.000
-1.6
10
0
2
4
6
8
10
-50 -25
10
VGS - Gate-to-Source Voltage (V)
0
25
50
75
100 125 150 175
TJ - Junction Temperature (°C)
On-Resistance vs. Gate-to-Source Voltage
Threshold Voltage
Axis Title
10000
ID = 1 mA
73
1000
71
1st line
2nd line
2nd line
VDS - Drain-to-Source Voltage (V)
75
69
100
67
65
10
-50 -25
0
25
50
75
100 125 150 175
TJ - Junction Temperature (°C)
Drain Source Breakdown vs. Junction Temperature
S18-1076-Rev. A, 22-Oct-2018
Document Number: 76971
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For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQM50034E
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
Axis Title
1000
10000
IDM limited
100 μs
1000
ID limited
10
1 ms
10 ms
100 ms, 1 s, 10 s, DC
Limited by RDS(on) a
1
1st line
2nd line
2nd line
ID - Drain Current (A)
100
100
BVDSS limited
0.1
TC = 25 °C,
single pulse
0.01
0.01
10
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Safe Operating Area
Note
a. VGS > minimum VGS at which RDS(on) is specified
Normalized Effective Transient
Thermal Impedance
1
0.1
0.01
0.001
0.0001
10-4
10-3
10-2
10-1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
S18-1076-Rev. A, 22-Oct-2018
Document Number: 76971
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For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQM50034E
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Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Case (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?76971.
S18-1076-Rev. A, 22-Oct-2018
Document Number: 76971
6
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
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Vishay Siliconix
TO-263 (D2PAK): 3-LEAD
-B-
L2
6
E1
K
D4
-A-
c2
D2
D3
A
E
L3
L
D
D1
E3
A
A
b2
b
e
c
Detail “A”
E2
0.010 M A M
2 PL
0°
L4
-5
°
INCHES
L1
DETAIL A (ROTATED 90°)
c*
c
c1
c1
M
b
b1
SECTION A-A
MIN.
MAX.
MIN.
MAX.
A
0.160
0.190
4.064
4.826
b
0.020
0.039
0.508
0.990
b1
0.020
0.035
0.508
0.889
1.397
b2
0.045
0.055
1.143
Thin lead
0.013
0.018
0.330
0.457
Thick lead
0.023
0.028
0.584
0.711
Thin lead
0.013
0.017
0.330
0.431
Thick lead
0.023
0.027
0.584
0.685
c2
0.045
0.055
1.143
1.397
D
0.340
0.380
8.636
9.652
D1
0.220
0.240
5.588
6.096
D2
0.038
0.042
0.965
1.067
D3
0.045
0.055
1.143
1.397
D4
0.044
0.052
1.118
1.321
E
0.380
0.410
9.652
10.414
E1
0.245
-
6.223
-
E2
0.355
0.375
9.017
9.525
E3
0.072
0.078
1.829
1.981
e
Notes
1. Plane B includes maximum features of heat sink tab and plastic.
2. No more than 25 % of L1 can fall above seating plane by
max. 8 mils.
3. Pin-to-pin coplanarity max. 4 mils.
4. *: Thin lead is for SUB, SYB.
Thick lead is for SUM, SYM, SQM.
5. Use inches as the primary measurement.
6. This feature is for thick lead.
Revison: 30-Sep-13
MILLIMETERS
DIM.
0.100 BSC
2.54 BSC
K
0.045
0.055
1.143
1.397
L
0.575
0.625
14.605
15.875
L1
0.090
0.110
2.286
2.794
L2
0.040
0.055
1.016
1.397
L3
0.050
0.070
1.270
1.778
L4
M
0.010 BSC
-
0.254 BSC
0.002
-
0.050
ECN: T13-0707-Rev. K, 30-Sep-13
DWG: 5843
1
Document Number: 71198
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AN826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead
0.420
0.355
0.635
(16.129)
(9.017)
(10.668)
0.145
(3.683)
0.135
(3.429)
0.200
0.050
(5.080)
(1.257)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Document Number: 73397
11-Apr-05
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1
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Revision: 01-Jan-2023
1
Document Number: 91000