SQS140ENW
www.vishay.com
Vishay Siliconix
Automotive N-Channel 40 V (D-S) 175 °C MOSFET
FEATURES
PowerPAK®
• TrenchFET® Gen IV power MOSFET
1212-8SLW
D
D
D 7 8
D 6
5
• AEC-Q101 qualified
• 100 % Rg and UIS tested
• Wettable flank terminals
• Low thermal resistance with 0.75 mm profile
3.
3
m
m
1
3.3
mm
Top View
3
4 S
G
Bottom View
2
S
1
S
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
D
Marking code: Q042
PRODUCT SUMMARY
VDS (V)
RDS(on) () at VGS = 10 V
G
40
0.00253
ID (A) e
152
Configuration
Single
S
N-Channel MOSFET
ORDERING INFORMATION
Package
PowerPAK ® 1212-8SLW
Lead (Pb)-free and halogen-free
SQS140ENW
(for detailed order number please see www.vishay.com/doc?79771)
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-source voltage
VDS
40
Gate-source voltage
VGS
± 20
TC = 25 °C
Continuous drain current e
Continuous source current (diode conduction)
TC = 125 °C
e
Pulsed drain current a, e
Single pulse avalanche current
Single pulse avalanche energy
Maximum power dissipation a, e
L = 0.1 mH
TC = 25 °C
TC = 125 °C
Operating junction and storage temperature range
ID
87
IS
108
350
IAS
31.5
EAS
49.6
TJ, Tstg
Soldering recommendations (peak temperature) c
V
152
IDM
PD
UNIT
119
39
-55 to +175
260
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-ambient
Junction-to-case (drain) d
PCB mount b
SYMBOL
LIMIT
RthJA
54
RthJC
1.26
UNIT
°C/W
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %
b. When mounted on 1" square PCB (FR4 material)
c. See solder profile (www.vishay.com/doc?73257). A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection
d. As per JESD51-14
e. Values based on RthJC and TC of 25 °C. Actual values achievable will be dependent on the thermal characteristics of the complete system
S23-0317-Rev.B, 15-May-2023
Document Number: 63038
1
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQS140ENW
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Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-source breakdown voltage
VDS
VGS = 0, ID = 250 μA
40
-
-
VGS(th)
VDS = VGS, ID = 250 μA
2.5
3.0
3.5
Gate-source leakage
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
± 100
VGS = 0 V
VDS = 40 V
-
-
1
Zero gate voltage drain current
IDSS
VGS = 0 V
VDS = 40 V, TJ = 125 °C
-
-
50
VGS = 0 V
VDS = 40 V, TJ = 175 °C
-
-
150
On-state drain current a
ID(on)
VGS = 10 V
VDS 5 V
20
-
-
VGS = 10 V
ID = 10 A
-
0.0021
0.00253
VGS = 10 V
ID = 10 A, TJ = 125 °C
-
-
0.0038
VGS = 10 V
ID = 10 A, TJ = 175 °C
-
-
0.0043
-
55
-
-
2222
3111
Gate-source threshold voltage
Drain-source on-state
resistance a
Forward transconductance b
Dynamic
RDS(on)
gfs
VDS = 15 V, ID = 10 A
V
nA
μA
A
S
b
Input capacitance
Ciss
Output capacitance
Coss
-
923
1295
Reverse transfer capacitance
Crss
-
37
52
Total gate charge c
Qg
-
38
57
-
11
-
-
8
-
f = 1 MHz
0.5
1.1
1.7
td(on)
-
13
20
tr
VDD = 20 V, RL = 1.33
ID 15 A, VGEN = 10 V, Rg = 1
-
5
9
-
22
33
-
8
12
Gate-source
charge c
Qgs
Gate-drain charge c
Qgd
Gate resistance
Rg
Turn-on delay
time c
Rise time c
Turn-off delay
time c
Fall time c
td(off)
VGS = 0 V
VGS = 10 V
VDS = 25 V, f = 1 MHz
VDS = 20 V, ID = 5 A
tf
Source-Drain Diode Ratings and Characteristic
ISM
Forward voltage
VSD
trr
IF = 10 A, VGS = 0 V
ns
-
-
350
A
-
0.82
1.1
V
-
38
78
ns
-
34
70
nC
-
19
-
Body diode reverse recovery charge
Qrr
Reverse recovery fall time
ta
Reverse recovery rise time
tb
-
20
-
IRM(REC)
-
-1.6
-3.2
Body diode peak reverse recovery current
nC
b
Pulsed current a
Body diode reverse recovery time
pF
IF = 5 A, di/dt = 100 A/μs
ns
A
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S23-0317-Rev.B, 15-May-2023
Document Number: 63038
2
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQS140ENW
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Axis Title
Axis Title
450
275
10000
10000
VGS = 10 V thru 7 V
VGS = 6 V
180
100
VGS = 5 V
90
1000
165
1st line
2nd line
1000
270
2nd line
ID - Drain Current (A)
220
1st line
2nd line
110
55
VGS = 4 V
TC = 125 °C
0
2
4
6
8
10
10
0
2
4
6
8
10
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
Axis Title
Axis Title
140
50
10000
TC = 25 °C
10000
TC = -55 °C
1000
TC = 125 °C
70
100
35
2nd line
ID - Drain Current (A)
40
105
1st line
2nd line
2nd line
gfs - Transconductance (S)
TC = -55 °C
0
10
0
1000
30
TC = 25 °C
20
100
10
TC = 125 °C
0
20
40
60
80
TC = -55 °C
0
10
0
10
0
100
1
2
3
4
5
ID - Drain Current (A)
VGS - Gate-to-Source Voltage (V)
Transconductance
Transfer Characteristics
0.008
Coss
1st line
2nd line
1000
Crss
100
100
10000
0.006
1000
1st line
2nd line
Ciss
2nd line
RDS(on) - On-Resistance (Ω)
10000
1000
6
Axis Title
Axis Title
10 000
2nd line
C - Capacitance (pF)
100
TC = 25 °C
1st line
2nd line
2nd line
ID - Drain Current (A)
360
0.004
VGS = 7.5 V
100
0.002
VGS = 10 V
10
10
0
8
16
24
32
40
0
10
0
20
40
60
80
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
Capacitance
On-Resistance vs. Drain Current
S23-0317-Rev.B, 15-May-2023
100
Document Number: 63038
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For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQS140ENW
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Axis Title
Axis Title
100
1000
6
4
100
10000
10
1
100
0.1
2
TJ = 25 °C
0
0.01
10
8
16
24
32
10
0
40
0.2
0.4
VSD - Source-to-Drain Voltage (V)
Gate Charge
Source Drain Diode Forward Voltage
Axis Title
1.0
Axis Title
0.7
10000
ID = 10 A
10000
1.4
1000
VGS = 7.5 V
1.2
1.0
100
2nd line
VGS(th) - Variance (V)
0.3
VGS = 10 V
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Normalized)
0.8
Qg - Total Gate Charge (nC)
1.8
1.6
0.6
0.8
-0.1
1000
ID = 5 mA
1st line
2nd line
0
-0.5
-0.9
100
ID = 250 μA
-1.3
0.6
-1.7
10
-50 -25
0
25
50
75
100 125 150 175
10
-50 -25
0
25
50
75
100 125 150 175
TJ - Junction Temperature (°C)
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Threshold Voltage
Axis Title
Axis Title
57
0.006
1000
1st line
2nd line
TJ = 150 °C
0.004
100
TJ = 125 °C
0.002
TJ = 25 °C
0
10
0
2
4
6
8
10
2nd line
VDS - Drain-to-Source Voltage (V)
10000
10000
56
ID = 1 mA
55
1000
54
1st line
2nd line
0.008
2nd line
RDS(on) - On-Resistance (Ω)
1000
TJ = 150 °C
1st line
2nd line
ID = 5 A
VDS = 20 V
8
2nd line
IS - Source Current (A)
10000
1st line
2nd line
2nd line
VGS - Gate-to-Source Voltage (V)
10
53
52
100
51
50
49
10
-50 -25
0
25
50
75
100 125 150 175
VGS - Gate-to-Source Voltage (V)
TJ - Junction Temperature (°C)
On-Resistance vs. Gate-to-Source Voltage
Drain Source Breakdown vs. Junction Temperature
S23-0317-Rev.B, 15-May-2023
Document Number: 63038
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For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQS140ENW
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
Axis Title
1000
10000
IDM limited
ID limited
1000
10
1st line
2nd line
2nd line
ID - Drain Current (A)
100
100 μs
1 ms
1
Limited by RDS(on)
10ms, 100 ms,
100
1 s, 10 s, DC
BVDSS limited
0.1
TC = 25 °C,
single pulse
0.01
0.01
0.1
1
10
100
10
1000
VDS - Drain-to-Source Voltage (V)
Safe Operating Area
Note
a. VGS > minimum VGS at which RDS(on) is specified
S23-0317-Rev.B, 15-May-2023
Document Number: 63038
5
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQS140ENW
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
Axis Title
1
Duty Cycle = 0.5
1000
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
10000
0.2
0.1
0.1
100
0.05
0.02
Single pulse
0.01
1.00E-06
1.00E-05
1.00E-04
1.00E-03
1.00E-02
1.00E-01
10
1.00E+00
Square Wave Pulse Duration (s)
2nd line
Normalized Thermal Transient Impedance, Junction-to-Case
Axis Title
Duty Cycle = 0.5
1000
0.2
0.1
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
10000
1
0.1
0.05
0.02
100
0.01
Single pulse
0.001
1.00E-06
1.00E-05
1.00E-04
1.00E-03
1.00E-02
1.00E-01
1.00E+00
1.00E+01
1.00E+02
10
1.00E+03
Square Wave Pulse Duration (s)
2nd line
Normalized Thermal Transient Impedance, Junction-to-Ambient
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Case (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63038.
S23-0317-Rev.B, 15-May-2023
Document Number: 63038
6
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR PowerPAK® 1212-8 Single
0.152
(3.860)
0.039
0.068
(0.990)
(1.725)
0.010
(0.255)
(2.390)
0.094
0.088
(2.235)
0.016
(0.405)
0.026
(0.660)
0.025
0.030
(0.635)
(0.760)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Return to Index
APPLICATION NOTE
Document Number: 72597
Revision: 21-Jan-08
www.vishay.com
7
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Revision: 01-Jan-2023
1
Document Number: 91000