SUB75P03-07, SUP75P03-07
Vishay Siliconix
P-Channel 30 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 30
a
• Compliant to RoHS Directive 2002/95/EC
RDS(on) ()
ID (A)
0.007 at VGS = - 10 V
± 75
RoHS*
0.010 at VGS = - 4.5 V
± 75
COMPLIANT
Available
TO-263
TO-220AB
S
G
DRAIN connected to TAB
D S
Top View
SUB75P03-07
G
G D S
Top View
SUP75P03-07
Ordering Information: SUB75P03-07 (TO-263)
SUB75P03-07-E3 (TO-263, Lead (Pb)-free)
SUP75P03-07 (TO-220AB)
SUP75P03-07-E3 (TO-220AB, Lead (Pb)-free)
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
Parameter
Gate-Source Voltage
TC = 25 °C
Continuous Drain Current (TJ = 175 °C)
TC = 125 °C
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energyb
Power Dissipation
L = 0.1 mH
TC = 25 °C (TO-220AB and TO-263)
TA = 25 °C (TO-263)c
Operating Junction and Storage Temperature Range
Symbol
Limit
Unit
VGS
± 20
V
ID
-
75a
- 65
IDM
- 240
IAR
- 60
EAR
180
PD
187d
3.75
A
mJ
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient
PCB Mount (TO-263)c
Free Air (TO-220AB)
Junction-to-Case
RthJA
RthJC
40
62.5
°C/W
0.8
Notes:
a. Package limited.
b. Duty cycle 1 %.
c. When mounted on 1" square PCB (FR-4 material).
d. See SOA curve for voltage derating.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 71109
S10-2429-Rev. E, 25-Oct-10
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1
SUB75P03-07, SUP75P03-07
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
VDS
VGS = 0 V, ID = - 250 µA
- 30
VGS(th)
VDS = VGS, ID = - 250 µA
-1
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
VDS = - 30 V, VGS = 0 V
-1
Zero Gate Voltage Drain Current
IDSS
VDS = - 30 V, VGS = 0 V, TJ = 125 °C
- 50
VDS = - 30 V, VGS = 0 V, TJ = 175 °C
- 250
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
On-State Drain Currenta
ID(on)
VDS = -5 V, VGS = - 10 V
± 100
- 120
VGS = - 10 V, ID = - 30 A
Drain-Source On-State Resistancea
RDS(on)
Forward Transconductance
VGS = - 10 V, ID = - 30 A, TJ = 125 °C
0.010
0.013
VDS = - 15 V, ID = - 75 A
nA
µA
0.007
VGS = - 10 V, ID = - 30 A, TJ = 175 °C
gfs
V
A
0.0055
VGS = - 4.5 V, ID = - 20 A
a
-3
0.008
0.010
20
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reversen Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
Gate-Drain Charge
Qgd
Turn-On Delay Timec
td(on)
Rise Timec
Turn-Off Delay Timec
Fall Timec
Source-Drain Diode Ratings and
tr
td(off)
9000
VGS = 0 V, VDS = - 25 V, f = 1 MHz
pF
715
160
VDS = - 15 V, VGS = - 10 V, ID = - 75 A
240
32
nC
30
VDD = - 15 V, RL = 0.2
ID - 75 A, VGEN = - 10 V, Rg = 2.5
tf
Characteristicsb
1565
25
40
225
360
150
240
210
340
(TC = 25 °C)
IS
- 75
Pulsed Current
ISM
- 240
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
ns
IF = - 75 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = - 75 A, dI/dt = 100 A/µs
A
- 1.2
- 1.5
V
55
100
ns
2.5
5
A
0.07
0.25
µC
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 71109
S10-2429-Rev. E, 25-Oct-10
SUB75P03-07, SUP75P03-07
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
200
250
TC = - 55 °C
VGS = 10 V thru 6 V
160
I D - Drain Current (A)
I D - Drain Current (A)
200
5V
150
100
4V
25 °C
125 °C
120
80
40
50
3V
0
0
0
2
4
6
8
0
10
1
2
3
4
5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
6
0.030
150
TC = - 55 °C
RDS(on) - On-Resistance ()
g fs - Transconductance (S)
0.025
120
25 °C
125 °C
90
60
30
0.015
VGS = 4.5 V
0.010
VGS = 10 V
0.005
0
0
0
20
40
60
80
0
100
20
40
60
80
100
ID - Drain Current (A)
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
120
20
10 000
VGS - Gate-to-Source Voltage (V)
12 000
C - Capacitance (pF)
0.020
Ciss
8000
6000
4000
Coss
2000
Crss
0
0
VDS = 15 V
ID = 75 A
16
12
8
4
0
6
12
18
24
30
0
50
100
150
200
250
VDS - Drain-to-Source Voltage (V)
Qg - Total Gate Charge (nC)
Capacitance
Gate Charge
Document Number: 71109
S10-2429-Rev. E, 25-Oct-10
300
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SUB75P03-07, SUP75P03-07
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.8
100
VGS = 10 V
ID = 30 A
TJ = 150 °C
I S - Source Current (A)
1.2
(Normalized)
RDS(on) - On-Resistance
1.5
0.9
0.6
10
TJ = 25 °C
0.3
0
- 50
1
- 25
0
25
50
75
100
125
150
175
0
0.2
0.4
0.6
0.8
1.0
TJ - Junction Temperature (°C)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
1000
45
ID = 250 µA
IAV (A) at TA = 25 °C
40
V DS (V)
I Dav (a)
100
10
IAV (A) at TA = 150 °C
1
30
0.1
0.00001
0.0001
0.001
0.01
0.1
tin (s)
Avalanche Current vs. Time
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35
1
25
- 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Drain Source Breakdown
vs. Junction Temperature
Document Number: 71109
S10-2429-Rev. E, 25-Oct-10
SUB75P03-07, SUP75P03-07
Vishay Siliconix
THERMAL RATINGS
1000
90
75
100 µs
I D - Drain Current (A)
I D - Drain Current (A)
100
60
45
30
Limited
by RDS(on)*
10
10 ms
100 ms
DC
1
TC = 25 °C
Single Pulse
15
0
0
25
50
75
100
125
150
175
0.1
0.1
TC - Case Temperature (°C)
1
* VGS
Maximum Avalanche and Drain Current
vs. Case Temperature
1 ms
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which RDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71109.
Document Number: 71109
S10-2429-Rev. E, 25-Oct-10
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Vishay
Disclaimer
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Revision: 01-Jan-2022
1
Document Number: 91000