SUD45P03-10
Vishay Siliconix
P-Channel 30-V (D-S), MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) (:)
ID (A)a
0.010 at VGS = - 10 V
- 15
0.018 at VGS = - 4.5 V
- 12
VDS (V)
- 30
• TrenchFET® Power MOSFETs
RoHS
COMPLIANT
S
TO-252
G
Drain Connected to Tab
G
D
S
D
Top View
P-Channel MOSFET
Ordering Information: SUD45P03-10-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
- 30
Gate-Source Voltage
VGS
± 20
Continuous Drain Currentb
TA = 25 °C
TA = 100 °C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Maximum Power Dissipationb
Operating Junction and Storage Temperature Range
TC = 25 °C
TA = 25 °C
V
- 15
ID
-8
IDM
- 100
IS
- 15
A
70
PD
TJ, Tstg
Unit
W
4b
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Maximum Junction-to-Ambientb
RthJA
30
Maximum Junction-to-Case
RthJC
1.8
Unit
°C/W
Notes:
a. Calculated Rating for TA = 25 °C, for comparison purposes only. This cannot be used as continuous rating (see Absolute Maximum Ratings
and Typical Characteristics).
b. Surface Mounted on FR4 board, t d 10 s.
Document Number: 70766
S-81734-Rev. E, 04-Aug-08
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1
SUD45P03-10
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = - 250 μA
- 30
VGS(th)
VDS = VGS, ID = - 250 μA
- 1.0
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistance
a
RDS(on)
- 3.0
± 100
VDS = - 30 V, VGS = 0 V
-1
VDS = - 30 V, VGS = 0 V, TJ = 125 °C
- 50
VDS = -5 V, VGS = - 10 V
- 50
VDS = -5 V, VGS = - 4.5 V
- 20
VGS = - 10 V, ID = - 15 A
0.010
VGS = - 10 V, ID = - 15 A, TJ = 125 °C
0.015
gfs
VDS = - 15 V, ID = - 15 A
nA
μA
A
VGS = - 4.5 V, ID = - 15 A
Forward Transconductancea
V
:
0.018
20
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
6000
VGS = 0 V, VDS = - 25 V, f = 1 MHz
pF
1100
700
90
VDS = - 15 V, VGS = - 10 V, ID = - 45 A
150
nC
20
Gate-Drain Charge
Qgd
16
Turn-On Delay Timec
td(on)
15
25
375
550
100
200
140
250
Rise Timec
tr
Turn-Off Delay Timec
td(off)
Fall Timec
VDD = - 15 V, RL = 0.33 :
ID # - 45 A, VGEN = - 10 V, RG = 2.4 :
tf
ns
Source-Drain Diode Ratings and Characteristic TC = 25 °C
ISM
Pulsed Current
Diode Forward Voltage
a
Source-Drain Reverse Recovery Time
100
A
VSD
IF = - 45 A, VGS = 0 V
1.0
1.5
V
trr
IF = - 45 A, dI/dt = 100 A/μs
55
100
ns
Notes:
a. Pulse test; pulse width d 300 μs, duty cycle d 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 70766
S-81734-Rev. E, 04-Aug-08
SUD45P03-10
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
250
VGS = 10, 9, 8, 7 V
80
200
I D - Drain Current (A)
I D - Drain Current (A)
6V
150
5V
100
4V
60
40
TC = 125 °C
20
50
25 °C
3V
- 55 °C
0
0
0
2
4
6
8
0
10
1
2
3
4
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
5
0.05
80
60
R DS(on) - On-Resistance (Ω)
g fs - Transconductance (S)
TC = - 55 °C
25 °C
125 °C
40
20
0.04
0.03
VGS = 4.5 V
0.02
VGS = 10 V
0.01
0.00
0
0
10
20
30
40
0
50
20
40
80
100
ID - Drain Current (A)
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
8000
20
VDS = 15 V
ID = 45 A
VGS - Gate-to-Source Voltage (V)
Ciss
6000
C - Capacitance (pF)
60
4000
Coss
2000
16
12
8
4
Crss
0
0
0
5
10
15
20
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 70766
S-81734-Rev. E, 04-Aug-08
25
30
0
30
60
90
120
Qg - Total Gate Charge (nC)
Gate Charge
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SUD45P03-10
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
2.0
VGS = 10 V
ID = 45 A
I S - Source Current (A)
R DS(on) - On-Resistance
(Normalized)
1.6
1.2
0.8
TJ = 150 °C
TJ = 25 °C
10
0.4
0.0
- 50
- 25
0
25
50
75
100
TJ - Junction Temperature (°C)
125
1
150
0
0.3
0.6
0.9
1.2
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
1.5
Source-Drain Diode Forward Voltage
20
500
16
100
I D - Drain Current (A)
I D - Drain Current (A)
THERMAL RATINGS
12
8
10, 100 μs
Limited
by R DS(on)*
1 ms
10
10 ms
100 ms
1s
1
TA = 25 °C
Single Pulse
4
DC
0
0
25
50
75
100
TA - Ambient Temperature (°C)
Maximum Drain Current
vs. Ambient Temperature
125
150
0.1
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
500
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?70766.
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Document Number: 70766
S-81734-Rev. E, 04-Aug-08
Legal Disclaimer Notice
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Vishay
Disclaimer
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Revision: 08-Feb-17
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Document Number: 91000