SUM09N20-270
Vishay Siliconix
N-Channel 200 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
200
RDS(on) (Ω)
ID (A)
0.270 at VGS = 10 V
9
0.300 at VGS = 6 V
8.5
• TrenchFET® Power MOSFETS
• 175 °C Junction Temperature
• Low Thermal Resistance Package
• Compliant to RoHS Directive 2002/95/EC
D
TO-263
G
G
D S
Top View
S
Ordering Information: SUM09N20-270-E3 (Lead (Pb) free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
200
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 125 °C
ID
IDM
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energya
L = 0.1 mH
TC = 25 °C
Maximum Power Dissipationa
TA = 25 °Cc
V
9
5.2
10
IAR
7
EAR
2.45
PD
Unit
60b
3.75
A
mJ
W
TJ, Tstg
- 55 to 175
°C
Symbol
Limit
Unit
Junction-to-Ambient (PCB Mount)
RthJA
40
Junction-to-Case (Drain)
RthJC
2.5
Operating Junction and Storage Temperature Range
THERMAL RESISTANCE RATINGS
Parameter
c
°C/W
Notes:
a. Duty cycle ≤ 1 %.
b. See SOA curve for voltage derating.
c. When mounted on 1" square PCB (FR-4 material).
Document Number: 72158
S11-2308-Rev. B, 21-Nov-11
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THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUM09N20-270
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
VDS
VDS = 0 V, ID = 250 µA
200
VGS(th)
VDS = VGS, ID = 250 µA
2
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
1
VDS = 160 V, VGS = 0 V, TJ = 125 °C
50
VDS = 160 V, VGS = 0 V, TJ = 175 °C
250
VDS ≥ 5 V, VGS = 10 V
VGS = 10 V, ID = 5 A
a
Forward Transconductance
± 100
VDS = 160 V, VGS = 0 V
ID(on)
Drain-Source On-State Resistancea
4
RDS(on)
gfs
10
V
nA
µA
A
0.216
0.270
VGS = 10 V, ID = 5 A, TJ = 125 °C
0.54
VGS = 10 V, ID = 5 A, TJ = 175 °C
0.71
VGS = 6 V, ID = 5 A
0.240
VDS = 15 V, ID = 5 A
15
Ω
0.300
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
c
580
VGS = 0 V, VDS = 25 V, f = 1 MHz
30
11
Gate-Source Charge
Qgs
Gate-Drain Chargec
Qgd
4
RG
4
Gate Resistance
Turn-On Delay Time
c
Rise Timec
Turn-Off Delay Timec
Fall Timec
VDS = 100 V, VGS = 10 V, ID = 10 A
td(on)
tr
td(off)
pF
75
VDD = 100 V, RL = 10 Ω
ID ≅ 10 A, VGEN = 10 V, RG = 2.5 Ω
tf
17
nC
2.7
Ω
10
15
35
55
25
40
40
60
ns
Source-Drain Diode Ratings and Characteristics (TC = 25 °C)b
IS
9
Pulsed Current
ISM
10
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Charge
Reverse Recovery Charge
IF = 10 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 10 A, dI/dt = 100 A/µs
A
0.9
1.5
V
100
150
ns
5
8
A
0.25
0.6
µC
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72158
S11-2308-Rev. B, 21-Nov-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUM09N20-270
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C unless noted)
10
10
VGS = 10 thru 6 V
8
I D - Drain Current (A)
I D - Drain Current (A)
8
5V
6
4
2
6
4
TC = 125 °C
2
25 °C
4V
- 55 °C
0
0
0
2
4
6
8
10
0
VDS - Drain-to-Source Voltage (V)
1
2
3
4
5
6
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
30
0.5
TC = - 55 °C
RDS(on) - On-Resistance ()
g fs - Transconductance (S)
25
25 °C
20
125 °C
15
10
5
0
0.4
0.3
VGS = 6 V
0.2
VGS = 10 V
0.1
0.0
0
2
4
6
ID - Drain Current (A)
8
10
0
4
6
8
10
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
800
20
V GS - Gate-to-Source Voltage (V)
700
C - Capacitance (pF)
2
Ciss
600
500
400
300
200
Crss
100
Coss
0
VDS = 100 V
ID = 10 A
16
12
8
4
0
0
40
80
120
160
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 72158
S11-2308-Rev. B, 21-Nov-11
200
0
4
8
12
16
Qg - Total Gate Charge (nC)
20
Gate Charge
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUM09N20-270
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C unless noted)
100
2.5
VGS = 10 V
ID = 5 A
I S - Source Current (A)
R DS(on) - On-Resistance (Normalized)
3.0
2.0
1.5
1.0
TJ = 150 °C
TJ = 25 °C
10
0.5
0.0
- 50
- 25
0
25
50
75
100
125
150
1
0
175
0.3
0.6
0.9
1.2
TJ - Junction Temperature (°C)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
1.5
240
230
ID = 1.0 mA
V DS (V)
220
210
200
190
180
- 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Drain Source Breakdown vs. Junction Temperature
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Document Number: 72158
S11-2308-Rev. B, 21-Nov-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUM09N20-270
Vishay Siliconix
THERMAL RATINGS
100
10
I D - Drain Current (A)
I D - Drain Current (A)
8
6
4
10 µs
10
100 µs
Limited
by R DS(on) *
1 ms
1
10 ms
TC = 25 °C
Single Pulse
2
DC, 100 ms
0
0
25
50
75
100
125
150
175
TC - Ambient Temperature (°C)
0.1
0.1
1
10
1000
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Maximum Avalanche and Drain Current
vs. Case Temperature
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72158.
Document Number: 72158
S11-2308-Rev. B, 21-Nov-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2022
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Document Number: 91000