SUM110N03-03P
Vishay Siliconix
N-Channel 30-V (D-S) 175_C MOSFET
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
30
rDS(on) (W)
ID
D
D
D
D
(A)a
0.0026 @ VGS = 10 V
110a
0.004 @ VGS = 4.5 V
110a
TrenchFETr Power MOSFET
175_C Junction Temperature
Optimized for Low-Side Synchronous Rectifier
100% Rg Tested
APPLICATIONS
D Desktop or Server CPU Core
D
TO-263
DRAIN connected to TAB
G
G
D S
Top View
Ordering Information: SUM110N03-03P
SUM110N03-03P-E3 (Lead Free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage
Gate-Source Voltage
TC = 25_C
Continuous Drain Current (TJ = 175_C)
TC = 100_C
Pulsed Drain Current
Limit
VDS
30
VGS
"20
ID
IDM
Avalanche Current
Repetitive Avalanche Energyb
Maximum Power Dissipationb
Symbol
L = 0.1 mH
TC = 25_C (TO-220AB and TO-263)
TA = 25_C (TO-263)d
Operating Junction and Storage Temperature Range
V
110a
110a
400
IAR
65
EAR
211
PD
Unit
375c
3.75
A
mJ
W
TJ, Tstg
−55 to 175
_C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
PCB Mount (TO-263)d
J
Junction-to-Ambient
ti t A bi t
Junction-to-Case
Free Air (TO-220AB)
40
RthJA
RthJC
62.5
_C/W
C/W
0.4
Notes
a. Package limited.
b. Duty cycle v 1%.
c. See SOA curve for voltage derating.
d. When mounted on 1” square PCB (FR-4 material).
Document Number: 71964
S-32523—Rev. B, 08-Dec-03
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SUM110N03-03P
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VDS = 0 V, ID = 250 mA
30
VGS(th)
VDS = VGS, ID = 250 mA
1
2
3
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 30 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage
g Drain Current
On-State Drain Currenta
IDSS
ID(on)
VDS = 30 V, VGS = 0 V, TJ = 125_C
50
VDS = 30 V, VGS = 0 V, TJ = 175_C
250
VDS w 5 V, VGS = 10 V
120
VGS = 10 V, ID = 30 A
Drain Source On-State
Drain-Source
On State Resistancea
rDS(on)
Forward Transconductancea
gfs
0.002
mA
m
0.0026
0.004
VGS = 10 V, ID = 30 A, TJ = 175_C
0.005
VDS = 15 V, ID = 30 A
nA
A
VGS = 10 V, ID = 30 A, TJ = 125_C
0.0031
VGS = 4.5 V, ID = 20 A
V
W
0.004
20
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
1250
Total Gate Chargeb
Qg
172
Gate-Source Chargeb
Qgs
40
Gate-Drain Chargeb
Qgd
Gate Resistance
Rg
Turn-On Delay Timeb
Rise
Timeb
Turn-Off Delay Timeb
Fall Timeb
12100
VDS = 15 V,, VGS = 10 V,, ID = 110 A
tr
pF
250
nC
22
0.3
td(on)
td(off)
1910
VGS = 0 V, VDS = 25 V, f = 1 MHz
VDD = 15 V, RL = 0.18 W
ID ^ 110 A, VGEN = 10 V, Rg = 2.5 W
tf
1.3
1.9
20
35
20
35
90
140
25
40
W
ns
Source-Drain Diode Ratings and Characteristics (TC = 25_C)c
Continuous Current
IS
85
Pulsed Current
ISM
440
Forward Voltagea
VSD
Reverse Recovery Time
IF = 110 A, VGS = 0 V
trr
Peak Reverse Recovery Current
IRM
Reverse Recovery Charge
Qrr
IF = 85 A, di/dt = 100 A/ms
m
A
1.1
1.5
V
60
120
ns
3.5
5
A
0.1
0.3
mC
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Independent of operating temperature.
c. Guaranteed by design, not subject to production testing.
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Document Number: 71964
S-32523—Rev. B, 08-Dec-03
SUM110N03-03P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
250
Transfer Characteristics
200
VGS = 10 thru 5 V
160
150
I D − Drain Current (A)
I D − Drain Current (A)
200
4V
100
50
120
80
TC = 125_C
40
25_C
3V
0
0
2
4
6
8
0
10
0
VDS − Drain-to-Source Voltage (V)
1
2
3
4
5
VGS − Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
250
0.0060
r DS(on) − On-Resistance ( W )
200
g fs − Transconductance (S)
−55_C
25_C
TC = −55_C
150
125_C
100
50
0
0.0045
VGS = 4.5 V
0.0030
VGS = 10 V
0.0015
0.0000
0
10
20
30
40
50
60
70
80
0
90
20
40
ID − Drain Current (A)
80
100
120
150
180
ID − Drain Current (A)
Capacitance
15000
60
Gate Charge
10
V GS − Gate-to-Source Voltage (V)
Ciss
C − Capacitance (pF)
12000
9000
6000
Coss
3000
Crss
0
VDS = 15 V
ID = 85 A
8
6
4
2
0
0
6
12
18
24
VDS − Drain-to-Source Voltage (V)
Document Number: 71964
S-32523—Rev. B, 08-Dec-03
30
0
30
60
90
120
Qg − Total Gate Charge (nC)
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SUM110N03-03P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
1.6
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 30 A
1.2
0.8
0.4
0.0
−50
Source-Drain Diode Forward Voltage
100
I S − Source Current (A)
r DS(on) − On-Resistance (W)
(Normalized)
2.0
−25
0
25
50
75
100
125
150
TJ = 150_C
10
TJ = 25_C
1
0
175
0.3
TJ − Junction Temperature (_C)
V(BR)DSS (V)
0.9
1.2
VSD − Source-to-Drain Voltage (V)
Drain Source Breakdown vs.
Junction Temperature
40
38
0.6
ID = 10 mA
36
34
32
30
−50
−25
0
25
50
75
100
125
150
175
TJ − Junction Temperature (_C)
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Document Number: 71964
S-32523—Rev. B, 08-Dec-03
SUM110N03-03P
Vishay Siliconix
THERMAL RATINGS
Maximum Avalanche and Drain Current
vs. Case Temperature
100
I D − Drain Current (A)
I D − Drain Current (A)
100
80
60
40
0
10 ms
100 ms
dc
10
1
TC = 25_C
Single Pulse
0.1
0
25
50
75
100
125
150
175
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
TC − Ambient Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
10 ms
100 ms
Limited
by rDS(on)
1 ms
20
1
Safe Operating Area
1000
120
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
10−3
10−2
10−1
1
10
Square Wave Pulse Duration (sec)
Document Number: 71964
S-32523—Rev. B, 08-Dec-03
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Document Number: 91000
Revision: 18-Jul-08
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