SUM110N04-03P-E3

SUM110N04-03P-E3

  • 厂商:

    TFUNK(威世)

  • 封装:

    SOT404

  • 描述:

    MOSFET N-CH 40V 110A D2PAK

  • 数据手册
  • 价格&库存
SUM110N04-03P-E3 数据手册
SUM110N04-03P Vishay Siliconix N-Channel 40-V (D-S) 175 °C MOSFET FEATURES PRODUCT SUMMARY V(BR)DSS (V) rDS(on) (Ω) ID (A) 40 0.0031 at VGS = 10 V 110a TrenchFET® Power MOSFET 175 °C Junction Temperature Package with Low Thermal Resistance Extremely Low Qgd WFETTM Technology for Low Switching Losses • 100 % Rg Tested • • • • Available RoHS* COMPLIANT D TO-263 G G D S Top View S Ordering Information: SUM110N04-03P-E3 (Lead (Pb)-free) N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted Parameter Symbol Limit Drain-Source Voltage VDS 40 Gate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 175 °C) TC = 25 °C TC = 125 °C Pulsed Drain Current Avalanche Current Single Pulse Avalanche Energyb Maximum Power Dissipationb L = 0.1 mH TC = 25 °C TA = 25 °C Operating Junction and Storage Temperature Range ID V 110a 110a IDM 440 IAS 70 EAS 211 PD Unit 375c 3.75 A mJ W TJ, Tstg - 55 to 175 °C Symbol Limit Unit THERMAL RESISTANCE RATINGS Parameter Junction-to-Ambient PCB Mountd Junction-to-Case (Drain) RthJA 40 RthJC 0.4 °C/W Notes: a. Package limited. b. Duty cycle ≤ 1 %. c. See SOA curve for voltage derating. d. When Mounted on 1" square PCB (FR-4 material). * Pb containing terminations are not RoHS compliant, exemptions may apply. Document Number: 72346 S-80274-Rev. C, 11-Feb-08 www.vishay.com 1 SUM110N04-03P Vishay Siliconix SPECIFICATIONS TJ = 25 °C, unless otherwise noted Parameter Symbol Test Conditions Min. V(BR)DSS VDS = 0 V, ID = 250 µA 40 VGS(th) VDS = VGS, ID = 250 µA 2.5 IGSS VDS = 0 V, VGS = ± 20 V Typ. Max. Unit Static Drain-Source Breakdown Voltage Gate-Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta IDSS 100 VDS = 40 V, VGS = 0 V 1 VDS = 40 V, VGS = 0 V, TJ = 125 °C 50 VDS = 40 V, VGS = 0 V, TJ = 175 °C 250 VDS ≥ 5 V, VGS = 10 V ID(on) 120 VGS = 10 V, ID = 30 A Drain-Source On-State Resistancea Forward Transconductancea 4 rDS(on) gfs nA µA A 0.0025 0.0031 VGS = 10 V, ID = 30 A, TJ = 125 °C 0.0049 VGS = 10 V, ID = 30 A, TJ = 175 °C 0.0059 VDS = 15 V, ID = 30 A V 30 Ω S b Dynamic Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Total Gate Chargec Qg Gate-Source Chargec Qgs c Gate-Drain Charge Qgd Gate Resistance Rg Turn-On Delay Time c td(on) c td(off) Rise Timec Turn-Off Delay Time tr Fall Timec 6500 VGS = 0 V, VDS = 25 V, f = 1 MHz pF 1400 570 90 VDS = 30 V, VGS = 10 V, ID = 110 A 150 nC 35 22 f = 1 MHz VDD = 30 V, RL = 0.27 Ω ID ≅ 110 A, VGEN = 10 V, RG = 2.5 Ω tf 0.5 1.1 1.9 145 220 35 55 20 30 55 85 Ω ns Source-Drain Diode Ratings and Characteristics TC = 25 °Cb IS 110 Pulsed Current ISM 240 Forward Voltagea VSD Continuous Current Reverse Recovery Time Peak Reverse Recovery Charge Reverse Recovery Charge IF = 85 A, VGS = 0 V 1.1 1.5 V 60 90 ns IF = 85 A, di/dt = 100 A/µs 2.5 5 A 0.075 0.22 µC trr IRM(REC) Qrr A Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com 2 Document Number: 72346 S-80274-Rev. C, 11-Feb-08 SUM110N04-03P Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 250 250 VGS = 10 thru 7 V 200 6V I D - Drain Current (A) I D - Drain Current (A) 200 150 100 50 150 100 TC = 125 °C 50 5V 25 °C - 55 °C 0 0 0 2 4 6 8 0 10 1 2 3 4 5 6 7 VGS - Gate-to-Source Voltage (V) VDS - Drain-to-Source Voltage (V) Output Characteristics Transfer Characteristics 240 0.005 TC = - 55 °C r DS(on) - On-Resistance (Ω) g fs - Transconductance (S) 200 25 °C 160 125 °C 120 80 40 0 0.004 0.003 VGS = 10 V 0.002 0.001 0.000 0 15 30 45 60 75 90 0 20 40 ID - Drain Current (A) 80 100 120 I D - Drain Current (A) Transconductance On-Resistance vs. Drain Current 20 8000 VGS - Gate-to-Source Voltage (V) Ciss C - Capacitance (pF) 60 6000 4000 Coss 2000 Crss VDS = 30 V ID = 110 A 16 12 8 4 0 0 0 8 16 24 32 VDS - Drain-to-Source Voltage (V) Capacitance Document Number: 72346 S-80274-Rev. C, 11-Feb-08 40 0 20 40 60 80 100 120 140 160 Qg - Total Gate Charge (nC) Gate Charge www.vishay.com 3 SUM110N04-03P Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted 2.0 100 VGS = 10 V ID = 30 A I S - Source Current (A) (Normalized) r DS(on) - On-Resistance 1.6 1.2 0.8 TJ = 150 °C TJ = 25 °C 10 0.4 1 0.0 - 50 - 25 0 25 50 75 100 125 150 175 0.3 0 0.6 0.9 1.2 TJ - Junction Temperature (°C) VSD - Source-to-Drain Voltage (V) On-Resistance vs. Junction Temperature Source-Drain Diode Forward Voltage 56 1000 54 ID = 10 mA 52 IAV (A) at TA = 25 °C V(BR)DSS (V) I Dav (A) 100 10 50 48 IAV (A) at TA = 150 °C 1 46 0.1 0.00001 0.0001 0.001 0.01 0.1 tin (s) Avalanche Current vs. Time www.vishay.com 4 1 44 - 50 - 25 0 25 50 75 100 125 150 175 TJ - Junction Temperature (°C) Drain Source Breakdown vs. Junction Temperature Document Number: 72346 S-80274-Rev. C, 11-Feb-08 SUM110N04-03P Vishay Siliconix THERMAL RATINGS 1000 300 10 µs Limited by rDS(on)* 250 100 µs I D - Drain Current (A) I D - Drain Current (A) 100 200 150 100 1 Package Limited 50 25 50 75 100 125 150 TC = 25 °C Single Pulse 0.1 0.1 0 0 1 ms 10 ms DC, 100 ms 10 175 TC - Case Temperature (°C) 1 * VGS Maximum Avalanche and Drain Current vs. Case Temperature 10 100 VDS - Drain-to-Source Voltage (V) minimum VGS at which rDS(on) is specified Safe Operating Area 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10- 4 10- 3 10- 2 10- 1 1 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Case Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?72346. Document Number: 72346 S-80274-Rev. C, 11-Feb-08 www.vishay.com 5 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein. Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2022 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2022 1 Document Number: 91000
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