SUM50020E-GE3

SUM50020E-GE3

  • 厂商:

    TFUNK(威世)

  • 封装:

    TO-263(D²Pak)

  • 描述:

    MOSFET N-CH 60V 120A TO263

  • 数据手册
  • 价格&库存
SUM50020E-GE3 数据手册
SUM50020E www.vishay.com Vishay Siliconix N-Channel 60 V (D-S) MOSFET FEATURES TO-263 • TrenchFET® power MOSFET • Maximum 175 °C junction temperature • Qgd/Qgs ratio < 0.25 • Operable with logic-level gate drive • 100 % Rg and UIS tested • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 S D Top View G APPLICATIONS D • Power supply - Secondary synchronous rectification PRODUCT SUMMARY VDS (V) • DC/DC converter 60 RDS(on) max. () at VGS = 10 V • Power tools 0.0022 RDS(on) max. () at VGS = 7.5 V 0.0024 Qg typ. (nC) • DC/AC inverter 128 ID (A) 120 d Configuration Single G • Motor drive switch • Battery management S N-Channel MOSFET ORDERING INFORMATION Package TO-263 Lead (Pb)-free and halogen-free SUM50020E-GE3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT Drain-source voltage VDS 60 Gate-source voltage VGS ± 20 Continuous drain current (TJ = 150 °C) TC = 25 °C TC = 70 °C Pulsed drain current (t = 100 μs) ID IDM Avalanche current L = 0.1 mH Single avalanche energy a TC = 25 °C Maximum power dissipation a TC = 125 °C Operating junction and storage temperature range V 120 d 120 d 300 IAS 75 EAS 281 PD UNIT 375 A mJ b 125 b W TJ, Tstg -55 to +175 °C SYMBOL LIMIT UNIT THERMAL RESISTANCE RATINGS PARAMETER Junction-to-ambient (PCB mount) c Junction-to-case (drain) RthJA 40 RthJC 0.4 °C/W Notes a. Duty cycle  1 % b. See SOA curve for voltage derating c. When mounted on 1" square PCB (FR4 material) d. Package limited S17-1310-Rev. B, 21-Aug-17 Document Number: 75403 1 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SUM50020E www.vishay.com Vishay Siliconix SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT VDS VGS = 0 V, ID = 250 μA 60 - - VGS(th) VDS = VGS, ID = 250 μA 2 - 4 IGSS VDS = 0 V, VGS = ± 20 V - - ± 250 VDS = 60 V, VGS = 0 V - - 1 VDS = 60 V, VGS = 0 V, TJ = 125 °C - - 150 VDS = 60 V, VGS = 0 V, TJ = 175 °C - - 5 mA VDS  10 V, VGS = 10 V 120 - - A Static Drain-source breakdown voltage Gate threshold voltage Gate-body Leakage Zero gate voltage drain current On-state drain current a Drain-source on-state resistance a Forward transconductance a IDSS ID(on) VGS = 10 V, ID = 30 A - 0.0018 0.0022 VGS = 7.5 V, ID = 20 A - 0.0020 0.0024 VDS = 15 V, ID = 30 A - 145 - - 11 150 - VGS = 0 V, VDS = 30 V, f = 1 MHz - 4255 - - 420 - RDS(on) gfs V nA μA  S Dynamic b Input capacitance Ciss Output capacitance Coss Reverse transfer capacitance Crss Total gate charge c Gate-source charge c Gate-drain charge c Gate resistance Turn-on delay time c Qg Qgs - 44 - - 9 - f = 1 MHz 0.32 1.6 3.2 - 18 36 Rg td(on) tr Turn-off delay time c td(off) Fall time c 128 - Qgd c Rise time VDS = 30 V, VGS = 10 V, ID = 20 A VDD = 30 V, RL = 5  ID  10 A, VGEN = 10 V, Rg = 1  tf - 20 40 - 55 100 - 23 35 pF nC  ns Drain-Source Body Diode Ratings and Characteristics b (TC = 25 °C) Pulsed current (t = 100 μs) ISM Forward voltage a VSD Reverse recovery time Peak reverse recovery charge Reverse recovery charge IF = 10 A, VGS = 0 V trr IRM(REC) Qrr IF = 39 A, di/dt = 100 A/μs - - 300 A - 0.8 1.5 V - 120 180 ns - 5.5 11 A - 0.320 0.480 μC Notes a. Pulse test; pulse width  300 μs, duty cycle  2 % b. Guaranteed by design, not subject to production testing c. Independent of operating temperature   Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S17-1310-Rev. B, 21-Aug-17 Document Number: 75403 2 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SUM50020E www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) Axis Title Axis Title 100 10000 200 10000 100 100 50 0 10 0.5 1 1.5 TC = 125 °C 40 100 TC = -55 °C 20 VGS = 4 V 0 0 10 0 2 1 2 3 4 5 VDS - Drain-to-Source Voltage (V) 2nd line VGS - Gate-to-Source Voltage (V) 2nd line Output Characteristics Transfer Characteristics 0.0035 TC = 25 °C 1st line 2nd line 1000 90 TC = 125 °C 100 45 0 0 6.0 12.0 18.0 24.0 10 30.0 10000 0.003 1000 0.0025 1st line 2nd line TC = -55 °C 2nd line RDS(on) - On-Resistance (Ω) 10000 135 6 Axis Title Axis Title 180 2nd line gfs - Transconductance (S) 1000 TC = 25 °C 60 1st line 2nd line 1000 2nd line ID - Drain Current (A) 80 150 1st line 2nd line 2nd line ID - Drain Current (A) VGS = 10 V thru 5 V VGS = 7.5 V 0.002 100 VGS = 10 V 0.0015 0.001 10 0 20 40 60 80 ID - Drain Current (A) 2nd line ID - Drain Current (A) 2nd line Transconductance On-Resistance vs. Drain Current Axis Title 100 Axis Title 13000 10 10000 10000 Coss 5200 100 2600 Crss 0 10 0 15 30 45 60 ID = 20 A VDS = 30 V 8 1000 6 1st line 2nd line 1000 7800 1st line 2nd line 2nd line C - Capacitance (pF) 10400 2nd line VGS - Gate-to-Source Voltage (V) Ciss 4 100 2 0 10 0 35 70 105 VDS - Drain-to-Source Voltage (V) 2nd line Qg - Total Gate Charge (nC) 2nd line Capacitance Gate Charge S17-1310-Rev. B, 21-Aug-17 140 Document Number: 75403 3 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SUM50020E www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted) Axis Title Axis Title 3.2 10000 ID = 30 A 10000 VGS = 10 V 2.8 VGS = 7.5 V 1.1 1000 2.4 1st line 2nd line 1000 1.3 2nd line VGS(th) (V) 1.5 1st line 2nd line 2nd line RDS(on) - On-Resistance (Normalized) 1.7 ID = 5 mA 2.0 100 100 ID = 250 μA 0.9 1.6 0.7 1.2 10 -50 -25 0 25 50 75 100 125 150 175 10 -50 -25 0 25 50 75 100 125 150 175 TJ - Junction Temperature (°C) 2nd line TJ - Temperature (°C) 2nd line On-Resistance vs. Junction Temperature Threshold Voltage Axis Title VDS (V) Drain-to-Source Voltage ID = 250 μA 0.005 1000 0.004 TJ = 25 °C 1st line 2nd line 2nd line RDS(on) - On-Resistance (Ω) 74 10000 0.006 0.003 TJ = 150 °C 0.002 100 0.001 0 10 2 4 6 8 72 70 68 66 64 - 50 10 - 25 0 25 50 75 100 TJ - Temperature (°C) VGS - Gate-to-Source Voltage (V) 2nd line Axis Title 100 0.01 0.001 10 0.2 0.4 0.6 0.8 1.0 1.2 255 1000 1st line 2nd line 0.1 2nd line ID - Drain Current (A) 1000 1st line 2nd line 2nd line IS - Source Current (A) TJ = 150 °C TJ = 25 °C 10000 340 10000 0 170 100 Package limited 85 0 10 0 25 50 75 100 125 VSD - Source-to-Drain Voltage (V) 2nd line TC - Case Temperature (°C) 2nd line Source Drain Diode Forward Voltage Current De-rating S17-1310-Rev. B, 21-Aug-17 175 Axis Title 100 1 150 Drain Source Breakdown vs. Junction Temperature On-Resistance vs. Gate-to-Source Voltage 10 125 150 175 Document Number: 75403 4 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SUM50020E www.vishay.com Vishay Siliconix THERMAL RATINGS (TA = 25 °C, unless otherwise noted) 1000 100 IDM Limited 100 us ID Limited 10 1 ms 10 ms Limited by RDS(on)* 1 IDAV (A) ID - Drain Current (A) 100 25 °C 100 ms DC 0.1 150 °C TC = 25 °C Single Pulse BVDSS Limited 0.01 0.1 10 0.00001 1 10 100 VDS - Drain- to- Source Voltage (V) * VGS > minimum VGS at which R DS(on) is specified 0.0001 0.001 0.01 Time (s) Safe Operating Area Single Pulse Avalanche Current Capability vs. Time Normalized Effective Transient Thermal Impedance 1 0.1 0.01 0.001 0.0001 10-4 10-3 10-2 10-1 1 10 100 1000 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Ambient S17-1310-Rev. B, 21-Aug-17 Document Number: 75403 5 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SUM50020E www.vishay.com Vishay Siliconix THERMAL RATINGS (TA = 25 °C, unless otherwise noted) 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-4 10-3 10-2 10-1 1 10 Square Wave Pulse Duration (s) Normalized Thermal Transient Impedance, Junction-to-Case Note • The characteristics shown in the two graphs - Normalized Transient Thermal Impedance Junction to Ambient (25 °C) - Normalized Transient Thermal Impedance Junction to Case (25 °C) are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities can widely vary depending on actual application parameters and operating conditions                                    Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?75403. S17-1310-Rev. B, 21-Aug-17 Document Number: 75403 6 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information www.vishay.com Vishay Siliconix TO-263 (D2PAK): 3-LEAD -B- L2 6 E1 K D4 -A- c2 D2 D3 A E L3 L D D1 E3 A A b2 b e c Detail “A” E2 0.010 M A M 2 PL 0° L4 -5 ° INCHES L1 DETAIL A (ROTATED 90°) c* c c1 c1 M b b1 SECTION A-A MIN. MAX. MIN. MAX. A 0.160 0.190 4.064 4.826 b 0.020 0.039 0.508 0.990 b1 0.020 0.035 0.508 0.889 1.397 b2 0.045 0.055 1.143 Thin lead 0.013 0.018 0.330 0.457 Thick lead 0.023 0.028 0.584 0.711 Thin lead 0.013 0.017 0.330 0.431 Thick lead 0.023 0.027 0.584 0.685 c2 0.045 0.055 1.143 1.397 D 0.340 0.380 8.636 9.652 D1 0.220 0.240 5.588 6.096 D2 0.038 0.042 0.965 1.067 D3 0.045 0.055 1.143 1.397 D4 0.044 0.052 1.118 1.321 E 0.380 0.410 9.652 10.414 E1 0.245 - 6.223 - E2 0.355 0.375 9.017 9.525 E3 0.072 0.078 1.829 1.981 e Notes 1. Plane B includes maximum features of heat sink tab and plastic. 2. No more than 25 % of L1 can fall above seating plane by max. 8 mils. 3. Pin-to-pin coplanarity max. 4 mils. 4. *: Thin lead is for SUB, SYB. Thick lead is for SUM, SYM, SQM. 5. Use inches as the primary measurement. 6. This feature is for thick lead. Revison: 30-Sep-13 MILLIMETERS DIM. 0.100 BSC 2.54 BSC K 0.045 0.055 1.143 1.397 L 0.575 0.625 14.605 15.875 L1 0.090 0.110 2.286 2.794 L2 0.040 0.055 1.016 1.397 L3 0.050 0.070 1.270 1.778 L4 M 0.010 BSC - 0.254 BSC 0.002 - 0.050 ECN: T13-0707-Rev. K, 30-Sep-13 DWG: 5843 1 Document Number: 71198 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AN826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead 0.420 0.355 0.635 (16.129) (9.017) (10.668) 0.145 (3.683) 0.135 (3.429) 0.200 0.050 (5.080) (1.257) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index Document Number: 73397 11-Apr-05 www.vishay.com 1 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein. Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 09-Jul-2021 1 Document Number: 91000
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