New Product
SUM90P10-19
Vishay Siliconix
P-Channel 100-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
rDS(on) (Ω)
ID (A)a
Qg (Typ)
- 100
0.019 at VGS = - 10 V
- 90
128 nC
• TrenchFET® Power MOSFET
RoHS
COMPLIANT
TO-263
S
G
Drain Connected to Tab
G
D
S
Top View
D
P-Channel MOSFET
Ordering Information: SUM90P10-19-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
- 100
Gate-Source Voltage
VGS
± 20
TC = 25 °C
Continuous Drain Current (TJ = 175 °C)
TC = 125 °C
TA = 25 °C
Continuous Source-Drain Diode Current
- 52
ID
- 17b, c
- 9.9b, c
IDM
Avalanche Current
Single-Pulse Avalanche Energy
TC = 25 °C
TA = 25 °C
L = 0.1 mH
TC = 125 °C
TA = 25 °C
- 90
IS
- 9b, c
IAS
- 75
EAS
281
mJ
375
125
PD
W
13.6b, c
4.5b, c
TA = 125 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
A
- 90
TC = 25 °C
Maximum Power Dissipation
V
- 90
TA = 125 °C
Pulsed Drain Current
Unit
- 55 to 175
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Case (Drain)
Symbol
Typical
Maximum
t ≤ 10 s
RthJA
8
11
Steady State
RthJC
0.33
0.4
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 Board.
c. t = 10 s.
d. Maximum under Steady State conditions is 40 °C/W.
Document Number: 73473
S-72337-Rev. D, 05-Nov-07
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1
New Product
SUM90P10-19
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
VDS
VGS = 0 V, ID = - 250 µA
- 100
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
ID = - 250 µA
VGS(th)
VDS = VGS, ID = - 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State
Resistancea
Forward Transconductancea
V
- 111
mV/°C
7
-2
- 4.5
V
± 100
nA
VDS = - 100 V, VGS = 0 V
-1
VDS = - 100 V, VGS = 0 V, TJ = 175 °C
- 500
VDS ≥ 10 V, VGS = - 10 V
- 90
µA
A
rDS(on)
VGS = - 10 V, ID = - 20 A
0.0155
gfs
VDS = - 15 V, ID = - 20 A
70
0.019
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
1670
Total Gate Charge
Qg
218
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
12000
VDS = - 50 V, VGS = 0 V, f = 1 MHz
VDS = - 50 V, VGS = - 10 V, ID = - 90 A
tr
Rise Time
td(off)
Turn-Off Delay Time
nC
55
Ω
f = 1 MHz
3.5
30
50
VDD = - 50 V, RL = 0.56 Ω
ID ≅ - 90 A, VGEN = - 10 V, Rg = 1 Ω
720
1100
125
190
610
920
tf
Fall Time
330
55
td(on)
Turn-On Delay Time
pF
700
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward
Currenta
Body Diode Voltage
IS
TC = 25 °C
- 90
ISM
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
- 250
IS = - 20 A
IF = - 20 A, di/dt = 100 A/µs, TJ = 25 °C
A
- 0.8
- 1.5
V
80
120
ns
230
350
nC
62
18
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 73473
S-72337-Rev. D, 05-Nov-07
New Product
SUM90P10-19
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
180
40
VGS = 10
5V
I D - Drain Current (A)
I D - Drain Current (A)
150
120
90
60
30
25 °C
20
TC = 125 °C
10
4V
30
- 55 °C
3V
0
0.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
3
4
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
5
15000
C - Capacitance (pF)
0.020
VGS = 6 V
VGS = 10 V
Ciss
12000
9000
6000
0.010
3000
Coss
Crss
0
0.000
0
20
40
60
80
0
100
20
40
60
80
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
10.0
2.5
8.0
2.1
100
ID = 20 A
VDS = 50 V
rDS(on) - (Normalized)
V GS - Gate-to-Source Voltage (V)
2
VGS - Gate-to-Source Voltage (V)
0.030
rDS(on) - On-Resistance (Ω)
1
6.0
VDS = 80 V
4.0
1.3
VGS = 10 V
0.9
2.0
0.0
0.0
VGS = 6 V
1.7
40.0
80.0
120.0
160.0
200.0
240.0
0.5
- 50
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 73473
S-72337-Rev. D, 05-Nov-07
175
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3
New Product
SUM90P10-19
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.10
TJ = 150 °C
rDS(on) - Drain-to-Source on-Resistance (Ω)
I S - Source Current (A)
100
25 °C
10
1
0.0
0.08
0.06
150 °C
0.04
0.02
25 °C
0.00
0.3
0.6
0.9
1.2
1.5
1
2
3
4
5
6
7
8
9
10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
6000
1.3
5000
1.0
ID = 1 mA
4000
Power (W)
VGS(th) (V)
0.7
0.4
3000
0.1
2000
- 0.2
1000
- 0.5
- 50
- 25
0
25
50
75
100
125
150
0
0.0001
175
0.001
0.01
0.10
1
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power, Junction-to-Case (TC = 25 °C)
400
1000
350
I D - Drain Current (A)
Power (W)
300
250
200
150
100
100
Limited by rDS(on)*
10 µs
100 µs
10
1 ms
10 ms
DC
1
Single Pulse
TC = 25 °C
50
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Power Derating, Junction-to-Case
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175
0.1
0.1
100
1
10
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which rDS(on) is specified
Safe Operating Area
Document Number: 73473
S-72337-Rev. D, 05-Nov-07
New Product
SUM90P10-19
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
120
IDav - Peak Avalanche Current (A)
1000
I D - Drain Current (A)
90
60
30
100
10
1
0.1
0
0
25
75
50
100
125
150
175
0.00001
0.001
0.01
0.1
1.0
TA - Time in Avalanche (s)
TC - (°C)
Avalanche Current vs. Time
Max Avalanche and Drain Current
vs. Case Temperature
Normalized Effective Transient Thermal Impedance
0.0001
1
0.5
0.2
0.1
0.05
0.1
0.02
Single
0.01
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73473.
Document Number: 73473
S-72337-Rev. D, 05-Nov-07
www.vishay.com
5
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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Document Number: 91000
Revision: 18-Jul-08
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