SUP60N06-12P
Vishay Siliconix
N-Channel 60-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
RDS(on) ()
ID (A)
Qg (Typ.)
60
0.012 at VGS = 10 V
60d
33
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg Tested
• 100 % UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
TO-220AB
• Synchronous Rectifier
• Power Supplies
D
G
G D S
Top View
S
Ordering Information: SUP60N06-12P-E3 (Lead (Pb)-free)
SUP60N06-12P-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
60
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 70 °C
Pulsed Drain Current
Avalanche Current
a
L = 0.1 mH
Single Avalanche Energy
TC = 25 °C
Maximum Power Dissipationa
TA = 25 °Cc
Operating Junction and Storage Temperature Range
ID
V
60d
54d
IDM
80
IAS
40
EAS
80
PD
Unit
100b
3.25
A
mJ
W
TJ, Tstg
- 55 to 150
°C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount)
c
Junction-to-Case (Drain)
RthJA
40
RthJC
1.25
°C/W
Notes:
a. Duty cycle 1 %.
b. See SOA curve for voltage derating.
c. When Mounted on 1" square PCB (FR-4 material).
d. Package limited.
Document Number: 69070
S10-1475-Rev. C, 05-Jul-10
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1
SUP60N06-12P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
VDS
VDS = 0 V, ID = 250 µA
60
VGS(th)
VDS = VGS, ID = 250 µA
2.5
IGSS
VDS = 0 V, VGS = ± 20 V
± 250
VDS = 60 V, VGS = 0 V
1
VDS = 60 V, VGS = 0 V, TJ = 125 °C
50
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
4.5
VDS = 60 V, VGS = 0 V, TJ = 150 °C
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
VDS 10 V, VGS = 10 V
V
nA
µA
250
80
A
VGS = 10 V, ID = 30 A
0.0098
0.012
VGS = 10 V, ID = 30 A, TJ = 125 °C
0.0155
0.019
VDS = 15 V, ID = 15 A
37
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
Gate-Drain Charge
Qgd
Gate Resistance
Rg
c
td(on)
Turn-Off Delay Timec
td(off)
Turn-On Delay Time
Rise Timec
Fall Timec
tr
1970
VGS = 0 V, VDS = 30 V, f = 1 MHz
pF
310
110
33
VDS = 30 V, VGS = 10 V, ID = 20 A
55
nC
11
9
f = 1 MHz
VDD = 30 V, RL = 1.53
ID 20 A, VGEN = 10 V, Rg = 1
tf
0.3
1.4
2.8
11
20
11
20
16
30
8
15
ns
Source-Drain Diode Ratings and Characteristics TC = 25 °Cb
IS
60
Pulsed Current
ISM
80
Forward Voltagea
VSD
Continuous Current
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 10 A, VGS = 0 V
0.84
IF = 10 A, dI/dt = 100 A/µs
64
trr
IRM(REC)
Qrr
A
1.5
V
40
80
ns
3.2
5.0
A
120
nC
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 69070
S10-1475-Rev. C, 05-Jul-10
SUP60N06-12P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
80
10
VGS =10 V thru 8 V
8
I D - Drain Current (A)
I D - Drain Current (A)
60
VGS = 7 V
40
20
VGS = 6 V
6
4
TC = 25 °C
2
TC = 125 °C
0
0.0
0
0.5
1.0
1.5
2.0
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Transfer Characteristics
Output Characteristics
0.020
0.05
R DS(on) - On-Resistance (Ω)
R DS(on) - On-Resistance (Ω)
TC = - 55 °C
0.015
VGS = 10 V
0.010
0.005
0.04
0.03
0.02
TJ = 125 °C
0.01
TJ = 25 °C
0.000
0.00
0
20
40
60
80
4
6
ID - Drain Current (A)
8
10
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
On-resistance vs. Gate-to-Source Voltage
10
2800
Ciss
2100
C - Capacitance (pF)
VGS - Gate-to-Source Voltage (V)
ID = 20 A
1400
700
Coss
Crss
0
0
8
VDS = 15 V
VDS = 30 V
6
VDS = 45 V
4
2
0
15
30
45
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 69070
S10-1475-Rev. C, 05-Jul-10
60
0
10
20
30
40
Qg - Total Gate Charge (nC)
Gate Charge
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SUP60N06-12P
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
2.0
ID = 15 A
I S - Source Current (A)
(Normalized)
R DS(on) - On-Resistance
1.4
VGS = 10 V
1.1
TJ = 25 °C
1
0.1
0.8
TJ = - 50 °C
0.01
0.5
- 50
- 25
0
25
50
75
100
125
0.001
0.0
150
0.2
0.4
0.6
0.8
1.0
TJ - Junction Temperature (°C)
VSD - Source-to-Drain Voltage (V)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
1.2
0.8
74
ID = 1 mA
0.4
VGS(th) Variance (V)
BVDSS (normalized)
TJ = 150 °C
10
1.7
70
66
0.0
- 0.4
ID = 1 mA
- 0.8
ID = 250 µA
- 1.2
62
- 50
- 25
0
25
50
75
100
125
- 1.6
- 50
150
- 25
0
25
50
75
100
125
150
TJ - Temperature (°C)
TJ - Temperature (°C)
Threshold Voltage
Drain-Source Breakdown vs. Junction Temperature
75
I D - Drain Current (A)
60
Package Limited
45
30
15
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Maximum Drain Current vs. Case Temperature
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Document Number: 69070
S10-1475-Rev. C, 05-Jul-10
SUP60N06-12P
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.1
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?69070.
Document Number: 69070
S10-1475-Rev. C, 05-Jul-10
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Revision: 01-Jan-2022
1
Document Number: 91000