TFBS6711-TT3

Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors Low Profile Fast Infrared Transceiver (FIR, 4 Mbit/s) for IrDA® Applications FEATURES • Lowest profile: 1.9 mm • Smallest footprint: 6 mm x 3.05 mm • Surface mount package • IrDA transmit distance: 50 cm typical • Best remote control distance:  6.5 m on-axis 20208 • Fast data rates: from 9.6 kbit/s to 4 Mbit/s • Low shutdown current: 0.01 μA DESCRIPTION • Operating voltage: 2.4 V to 3.6 V The TFBS6711 is the smallest FIR transceiver available. It is a low profile and low-power IrDA transceiver. Compliant to IrDA’s physical layer specification, the TFBS6711 supports data transmission rates from 9.6 kbit/s to 4 Mbit/s with a typical link distance of 50 cm. It also enables mobile phones and PDAs to function as universal remote controls for televisions, DVDs and other home appliances. The TFBS6711 emitter covers a range of 6.5 m with common remote control receivers. Integrated within the transceiver module is a pin photodiode, an infrared emitter, and a low-power control IC. The TFBS6711 can be completely shutdown, achieving very low power consumption. The TFBS6711 has an I/O voltage related to the supply voltage. • Reduced pin count: 6 pins • I/O voltage equal to the supply voltage • Pin compatibility: TFBS4711 • Integrated EMI protection - no external shield required • IEC 60825-1 class 1, eye safe • Qualified for lead (Pb)-free and Sn/Pb processing • Compliant to IrDA physical layer specification • Split power supply, transmitter and receiver can be operated from two power supplies with relaxed requirements saving costs, US patent no. 6,157,476 • Qualified for lead (Pb)-free and Sn/Pb processing (MSL4) • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • High-speed data communication transfer using infrared wireless • Mobile phones • Camera phones • PDAs • MP3 players • Digital cameras • IrDA adapters or dongles PRODUCT SUMMARY PART NUMBER TFBS6711 DATA RATE (kbit/s) DIMENSIONS HxLxW (mm x mm x mm) LINK DISTANCE (m) OPERATING VOLTAGE (V) IDLE SUPPLY CURRENT (mA) 4000 1.9 x 6 x 3.1 0 to 0.3 2.4 to 3.6 1.9 PARTS TABLE PART NUMBER DESCRIPTION AND REMARKS TFBS6711-TR1 Oriented in carrier tape for side view surface mounting QTY/REEL OR TUBE 1000 pcs TFBS6711-TR3 Oriented in carrier tape for side view surface mounting 2500 pcs TFBS6711-TT1 Oriented in carrier tape for top view surface mounting 1000 pcs TFBS6711-TT3 Oriented in carrier tape for top view surface mounting 2500 pcs Rev. 2.0, 06-Sep-13 Document Number: 84676 1 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors FUNCTIONAL BLOCK DIAGRAM VCC1 Tri-state driver Amplifier RXD Comparator VCC2 SD Logic Controlled driver and Control TXD GND 19298 Fig. 1 - Functional Block Diagramm PIN DESCTIPTION PIN NUMBER FUNCTION DESCRIPTION 1 VCC2, IRED anode IRED anode to be externally connected to VCC2. For higher voltages as 3.6 V an external resistor might be necessary for reducing the internal power dissipation. See derating curves. This pin is allowed to be supplied from an uncontrolled power supply separated from the controlled VCC1 - supply 2 TXD 3 I/O ACTIVE Transmit data input I High RXD Received data output, push-pull CMOS driver output capable of driving a standard CMOS load. No external pull-up or pull-down resistor is required. Floating with a weak pull-up of 500 k (typ.) in shutdown mode. The RXD output echos the TXD input during transmission. O Low 4 SD Shutdown, also used for dynamic mode switching I High 5 VCC1 Supply voltage 6 GND Ground PINOUT TFBS6711 Weight: 50 mg Definitions: In the Vishay transceiver datasheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s PIN 1 Fig. 2 - Pinning Rev. 2.0, 06-Sep-13 19428 IrDA, the infrared data association, implemented MIR and FIR with IrPHY 1.1, followed by IrPhY 1.2, adding the SIR low power standard. IrPhY 1.3 extended the low power option to MIR and FIR and VFIR was added with IrPhY 1.4. A new version of the standard in any case obsoletes the former version. Document Number: 84676 2 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITIONS SYMBOL MIN. Supply voltage range, transceiver 0 V < VCC2 < 6 V VCC1 Supply voltage range, transmitter 0 V < VCC1 < 6 V VCC2 Input currents TYP. MAX. UNIT - 0.5 6 V - 0.5 6.5 V 10 mA For all pins, except IRED anode pin Output sinking current 25 mA Power dissipation PD 500 mW Junction temperature TJ 125 °C Ambient temperature range (operating) Tamb - 25 + 85 °C Storage temperature range Tstg - 25 + 85 °C 260 °C Soldering temperature (1) Average output current Repetitive pulse output current < 90 μs, ton < 20 % IRED anode voltage Voltage at all inputs and outputs VIN > VCC1 is allowed IIRED (DC) 125 mA IIRED (RP) 600 mA IIREDA - 0.5 6.5 V VIN - 0.5 5.5 V Notes • Reference point pin 8 (ground) unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. (1) Sn/lead (Pb)-free soldering. The product passed Vishay’s standard convection reflow profile soldering test. EYE SAFETY INFORMATION STANDARD CLASSIFICATION IEC/EN 60825-1 (2007-03), DIN EN 60825-1 (2008-05) “SAFETY OF LASER PRODUCTS Part 1: equipment classification and requirements”, simplified method Class 1 IEC 62471 (2006), CIE S009 (2002) “Photobiological Safety of Lamps and Lamp Systems” Exempt DIRECTIVE 2006/25/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 5th April 2006 on the minimum health and safety requirements regarding the exposure of workers to risks arising from physical agents (artificial optical radiation) (19th individual directive within the meaning of article 16(1) of directive 89/391/EEC) Exempt Note • Vishay transceivers operating inside the absolute maximum ratings are classified as eye safe according the above table. Rev. 2.0, 06-Sep-13 Document Number: 84676 3 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors ELECTRICAL CHARACTERISTICS PARAMETERS TEST CONDITIONS SYMBOL MIN. VCC 2.4 TYP. MAX. UNIT 3.6 V TRANSCEIVER Supply voltage Dynamic supply current Receive mode only. In transmit mode, add additional 85 mA (typ.) for IRED current. Add RXD output current depending on RXD load. SD = low, SIR mode ICC 1.7 3 mA SD = low, MIR/FIR mode ICC 1.9 3.3 mA Shutdown supply current SD = high T = 25 °C, not ambient light sensitive, detector is disabled in shutdown mode ISD 1 μA Shutdown supply current SD = high T = 85 °C, not ambient light sensitive ISD 5 μA + 85 °C 0.4 V Operating temperature range TA Output voltage low IOL = 1 mA CLOAD = 15 pF VOL Output voltage high IOH = - 250 μA CLOAD = 15 pF VOH Internal RXD pull-up - 25 0.9 x VCC V RRXD 400 Input voltage low (TXD, SD) VIL - 0.5 0.5 V Input voltage high (TXD, SD) VIH VCC - 0.5 VCC + 0.5 V Input leakage current (TXD, SD) (1) IICH -1 +1 μA 5 pF Input capacitance (TXD, SD) 500 600 0.05 CI k Notes • Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. (1) The typical threshold level is 0.5 x V CC (VCC = 3 V). It is recommended to use the specified min./max. values to avoid increased operating/shutdown current. OPTOELECTRONIC CHARACTERISTICS PARAMETER TEST CONDITIONS SYMBOL Minimum irradiance Ee in angular range (2) 9.6 kbit/s to 115.2 kbit/s  = 850 nm to 900 nm, VCC = 2.4 V Minimum irradiance Ee in angular range MIR mode MIN. TYP. MAX. UNIT Ee 50 (5) 80 (8) mW/m2 (μW/cm2) 1.152 Mbit/s  = 850 nm to 900 nm, VCC = 2.4 V Ee 100 (10) Minimum irradiance Ee in angular range FIR mode 4 Mbit/s  = 850 nm to 900 nm, VCC = 2.4 V Ee 120 (12) Maximum irradiance Ee in angular range (3)  = 850 nm to 900 nm Ee 5 (500) RECEIVER No detection receiver input irradiance (fluorescent light noise suppression) Ee 4 (0.4) mW/m2 (μW/cm2) 200 (20) mW/m2 (μW/cm2) kW/m2 (mW/cm2) mW/m2 (μW/cm2) Rise time of output signal 10 % to 90 %, CL = 15 pF tr (RXD) 10 50 ns Fall time of output signal 90 % to 10 %, CL = 15 pF tf (RXD) 10 50 ns RXD pulse width of output signal, 50 %, SIR mode Input pulse length 1.4 μs < PWopt < 25 μs tPW 1.4 1.8 2.6 μs RXD pulse width of output signal, 50 %, MIR mode Input pulse length PWopt = 217 ns, 1.152 Mbit/s tPW 110 250 270 ns RXD pulse width of output signal, 50 %, FIR mode Input pulse length PWopt = 125 ns, 4 Mbit/s tPW 110 140 ns Rev. 2.0, 06-Sep-13 Document Number: 84676 4 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors OPTOELECTRONIC CHARACTERISTICS PARAMETER TEST CONDITIONS SYMBOL MIN. Input pulse length PWopt = 250 ns, 4 Mbit/s tPW 225 TYP. MAX. UNIT 275 ns 20 40 350 ns 500 μs 100 μs 600 mA 1 μA RECEIVER RXD pulse width of output signal, 50 %, FIR mode RXD output jitter, leading edge Input irradiance = 150 mW/m2, 4 Mbit/s 1.152 Mbit/s  115.2 kbit/s Receiver start up time After completion of shutdown programming sequence power on delay Latency (1) tL TRANSMITTER IRED operating current, switched current control For 3.3 V operation no external resistor is needed ID 330 Output leakage IRED current VCC = VIRED = 3.3 V, TXD = low IIRED -1 Output radiant intensity, see figure 3, recommended application circuit VCC = VIRED = 3.3 V, a = 0° TXD = high, SD = low, R1 = 1  Ie 45 115 300 mW/sr Output radiant intensity, see figure 3, recommended application circuit VCC = VIRED = 3.3 V, a = 0°, 15° TXD = high, SD = low, R1 = 1  Ie 25 75 300 mW/sr VCC1 = 3.6 V, a = 0°, 15° TXD = low or SD = high (receiver is inactive as long as SD = high) Ie 0.04 mW/sr Output radiant intensity Output radiant intensity, angle of half intensity a Optical overshoot ± 24 deg p 880 900 nm tropt, tfopt 10 40 ns Input pulse width 217 ns, 1.152 Mbit/s topt 200 217 230 ns Input pulse width 125 ns, 4 Mbit/s topt 116 125 134 ns Input pulse width 250 ns, 4 Mbit/s topt 241 250 259 ns Input pulse width t < 80 μs Input pulse width t 3 80 μs topt topt Peak - emission wavelength Optical rise time, optical fall time Optical output pulse duration 440 t 20 85 25 μs % Notes • For more definitions see the document “Symbols and Terminology” on the Vishay website. • Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production testing. All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 μs after starting the preamble. (1) IrDA latency definition: receiver latency allowance (milliseconds or microseconds) is the maximum time after a node ceases transmitting before the node’s receiver recovers its specified sensitivity. During this period and also during the receiver start up time (after power on or shutdown) the RXD output may be in an undefined state. (2) IrDA sensitivity definition: minimum irradiance Ee in angular range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum link length. (3) Maximum irradiance E in angular range, power per unit area. The optical delivered to the detector by a source operating at the maximum e intensity in angular range at minimum link length must not cause receiver overdrive distortion and possible related link errors. If placed at the active output interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification. Rev. 2.0, 06-Sep-13 Document Number: 84676 5 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors RECOMMENDED CIRCUIT DIAGRAM Operated at a clean low impedance power supply the TFBS6711 needs no additional external components. However, depending on the entire system design and board layout, additional components may be required (see fig. 3). VCC2 VCC1 GND VCC C3 COMPONENT RECOMMENDED VALUE C1 4.7 μF, 16 V Vishay part#: 293D 475X9 016B C2 0.1 μF, ceramic Vishay part#: VJ1206 Y 104 J XXMT R1 3.3 V supply voltage: no resistor is necessary, the internal controller is able to control the current R2 4.7 , 0.125 W IRED anode R1 R2 C1 TABLE 1 - RECOMMENDED APPLICATION CIRCUIT COMPONENTS C2 Ground SD SD TXD TXD RXD RXD I/O AND SOFTWARE 19299 Fig. 3 - Recommended Application Circuit The capacitor C1 is buffering the supply voltage and eliminates the inductance of the power supply line. This one should be a tantalum or other fast capacitor to guarantee the fast rise time of the IRED current. Vishay transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (RXD, SD) and the output RXD should be directly (DC) coupled to the I/O circuit. The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage. R2, C1 and C2 are optional and dependent on the quality of the supply voltages VCCx and injected noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C2 as close as possible to the transceiver power supply pins. In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases refer to the I/O manual, the Vishay application notes, or contact directly Vishay Sales, Marketing, or Application. MODE SWITCHING The TFBS6711 is in the SIR mode after power on as a default mode, therefore the FIR data transfer rate has to be set by a programming sequence using the TXD and SD inputs as described below. The low frequency mode covers speeds up to 115.2 kbit/s. Signals with higher data rates should be detected in the high frequency mode. Lower frequency data can also be received in the high frequency mode but with reduced sensitivity. To switch the transceivers from low frequency mode to the high frequency mode and vice versa, the programming sequences described below are required. SETTING TO THE HIGH BANDWIDTH MODE (0.576 Mbit/s to 4 Mbit/s) 1. Set SD input to logic “high”. 2. Set TXD input to logic “high”. Wait ts  200 ns. A tantalum capacitor should be used for C1 while a ceramic capacitor is used for C2. 3. Set SD to logic “low” (this negative edge latches state of TXD, which determines speed setting). In addition, when connecting the described circuit to the power supply, low impedance wiring should be used. 4. After waiting th  200 ns TXD can be set to logic “low”. The hold time of TXD is limited by the maximum allowed pulse length. When extended wiring is used the inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not able to follow the fast current rise time. In that case another 4.7 μF (type, see table under C1) at VCC2 will be helpful. TXD is now enabled as normal TXD input for the high bandwidth mode. Keep in mind that basic RF-design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. See e.g. “The Art of Electronics” Paul Horo-witz, Winfield Hill, 1989, Cambridge University Press, ISBN: 0521370957. Rev. 2.0, 06-Sep-13 Document Number: 84676 6 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors SETTING TO THE LOWER BANDWIDTH MODE (2.4 kbit/s to 115.2 kbit/s) 50 % SD 1. Set SD input to logic “high”. 2. Set TXD input to logic “low”. Wait ts  200 ns. ts th High: FIR 3. Set SD to logic “low” (this negative edge latches state of TXD, which determines speed setting). 50 % TXD 50 % Low: SIR 4. TXD must be held for th  200 ns. TXD is now enabled as normal TXD input for the lower bandwidth mode. 14873 Fig. 4 - Mode Switching Timing Diagram TRUTH TABLE INPUTS OUTPUTS SD TXD INPUT IRRADIANCE mW/m2 RXD High x x Weakly pulled (500 k) high 0 Low High x Low active (echo) Ie Low High > 80μs x High 0 Low Low min. irradiance Ee in angular range < max. irradiance Ee in angular range Low (active) 0 Low Low > max. irradiance Ee in angular range x 0 TRANSMITTER RECOMMENDED SOLDER PROFILES Manual Soldering Solder Profile for Sn/Pb Soldering 260 Manual soldering is the standard method for lab use. However, for a production process it cannot be recommended because the risk of damage is highly dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering. 10 s max. at 230 °C 240 °C max. 240 220 2 °C/s to 4 °C/s 200 Temperature (°C) 180 160 °C max. 160 140 120 s to 180 s 120 90 s max. Storage 100 80 The storage and drying processes for all Vishay transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4. 2 °C/s to 4 °C/s 60 40 20 0 0 50 19431 100 150 200 250 300 350 Time (s) The data for the drying procedure is given on labels on the packing and also in the application note “Taping, Labeling, Storage and Packing”. Fig. 5 - Recommended Solder Profile for Sn/Pb Soldering 280 Wave Soldering T peak = 260 °C max. 240 T ≥ 217 °C for 50 s max 220 200 180 Temperature (°C) The TFBS6711 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu, there are two standard reflow profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-Soak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-To-Spike profile is used increasingly. Shown in figure 5 and 6 are Vishay’s recommended profiles for use with the TFBS6711 transceivers. For more details please refer to the application note “SMD Assembly Instructions”. T ≥ 255 °C for 20 s max 260 Lead (Pb)-free, Recommended Solder Profile 160 20 s 140 120 90 s...120 s 100 50 s max. 2 °C...4 °C/s 80 60 2 °C...4 °C/s 40 20 0 0 50 100 150 200 250 300 350 19261 Time (s) Fig. 6 - Solder Profile, RSS Recommendation For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended. Rev. 2.0, 06-Sep-13 Document Number: 84676 7 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors TFBS6711 PACKAGE DIMENSIONS in millimeters 19612 Fig. 7 - Package Drawing, Tolerances: Height + 0.1, - 0.2 mm, otherwise ± 0.2 mm if not indicated Recommended Footprint Top View Application Recommended Footprint Side View Application 5 x 0.95 = 4.75 0.95 0.64 Emitter 4 5 Detector 6 1.27 1.27 3 0.6 2 0.4 1 1 2 3 4 0.95 19728 Emitter 5 6 0.64 5 x 0.95 = 4.75 Detector 19301 Fig. 8 - Soldering Footprints Design Rules for Optical Windows For optical windows see the application note on the web. Rev. 2.0, 06-Sep-13 Document Number: 84676 8 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters Drawing-No.: 9.800-5090.01-4 Issue: 1; 29.11.05 14017 TAPE WIDTH (mm) A MAX. (mm) N (mm) W1 MIN. (mm) W2 MAX. (mm) W3 MIN. (mm) W3 MAX. (mm) 16 330 50 16.4 22.4 15.9 19.4 Rev. 2.0, 06-Sep-13 Document Number: 84676 9 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors TAPE DIMENSIONS in millimeters 19613 Fig. 9 - Tape Drawing, TFBS6711 for Side View Mounting, Tolerance ± 0.1 mm Rev. 2.0, 06-Sep-13 Document Number: 84676 10 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Not for New Designs TFBS6711 www.vishay.com Vishay Semiconductors TAPE DIMENSIONS in millimeters 20416 Fig. 10 - Tape Drawing, TFBS6711 for Top View Mounting, Tolerance ± 0.1 mm Rev. 2.0, 06-Sep-13 Document Number: 84676 11 For technical questions, contact: irdasupportAM@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000