Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
Infrared Transceiver Module (SIR, 115.2 kbit/s)
for IrDA® Applications
DESCRIPTION
TFDU4301 is an infrared transceiver that supports data rates
up to 115 kbit/s per the IrDA standard. The link distance is
up to 1 meter. The transceiver includes a PIN photodiode,
an infrared emitter, and a low-power control IC. These
components have not been qualified according to
automotive specifications.
FEATURES
• Compliant to the IrDA physical layer
specification
• Standard IrDA link distance of 1 m
• Low power consumption, typically less than
70 μA
• Less than 1 μA in shutdown mode
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
20101
APPLICATIONS
• Short-distance wireless communication and data transfer
• Use in environments where RF is problematic
LINKS TO ADDITIONAL RESOURCES
Product Page
Related
Documents
DESIGN SUPPORT TOOLS
•
•
•
•
•
3D model
Window size calculator
Symbols and terminology
IRDC protocol
Reference layouts and circuit diagrams
FUNCTIONAL BLOCK DIAGRAM
VCC1
Tri-state
driver
PD
Amplifier
RXD
Comparator
VCC2
(IRED anode)
SD
Mode
control
TXD
IRED driver
IRED
IREDC
ASIC
19283-2
GND
Rev. 1.7, 28-Oct-2022
Document Number: 81965
1
For technical questions within your region: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
PRODUCT SUMMARY
PART NUMBER
DATA RATE
(kbit/s)
DIMENSIONS H x L x W
(mm x mm x mm)
LINK DISTANCE
(m)
OPERATING VOLTAGE
(V)
IDLE SUPPLY CURRENT
(mA)
115.2
3.1 x 8.5 x 2.5
0 to ≥ 1
2.4 to 5.5
0.07
TFDU4301
PARTS TABLE
PART
DESCRIPTION
QTY/REEL
TFDU4301-TR1
Oriented in carrier tape for side view surface mounting
750 pcs
TFDU4301-TR3
Oriented in carrier tape for side view surface mounting
2500 pcs
TFDU4301-TT1
Oriented in carrier tape for top view surface mounting
750 pcs
TFDU4301-TT3
Oriented in carrier tape for top view surface mounting
2500 pcs
PIN DESCRIPTION
PIN NUMBER
FUNCTION
DESCRIPTION
1
VCC2
IRED anode
Connect IRED anode directly to the power supply (VCC2). IRED current can
be decreased by adding a resistor in series between the power supply and
IRED anode. A separate unregulated power supply can be used at this pin
I/O
ACTIVE
2
IRED cathode
TXD
This Schmitt-Trigger input is used to transmit serial data when SD is low.
An on-chip protection circuit disables the LED driver if the TXD pin is
asserted for longer than 100 μs. The input threshold voltage adapts to and
follows the logic voltage swing defined by the applied supply voltage
IRED cathode, internally connected to the driver transistor
I
High
4
RXD
Received data output, push-pull CMOS driver output capable of driving
standard CMOS or TTL loads. During transmission the RXD output is active
and mirrors the transmit signal. No external pull-up or pull-down resistor is
required. Floating with a weak pull-up of 500 kΩ (typ.) in shutdown mode.
The voltage swing is defined by the applied supply voltage
O
Low
5
SD
Shutdown. The input threshold voltage adapts to and follows the logic
voltage swing defined by the applied supply voltage
I
High
3
6
VCC1
Supply voltage
7
NC
Not connected
8
GND
Ground
I
PINOUT
TFDU4301
weight 77 mg
5
6
1
2
3
4
7
IRED A IRED C TXD RXD SD Vcc NC
8
GND
18101-1
Rev. 1.7, 28-Oct-2022
Document Number: 81965
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range, transceiver
-0.3 V < VCC2 < 6 V
VCC1
-0.5
-
+6
V
Supply voltage range, transmitter
-0.5 V < VCC1 < 6 V
VCC2
-0.5
-
+6
V
RXD output voltage
-0.5 V < VCC1 < 6 V
VRXD
-0.5
-
VCC1 + 0.5
V
Voltage at all inputs
Note: Vin ≥ VCC1 is allowed
VIN
-0.5
-
+6
V
Input current
For all pins, except IRED anode pin
Output sinking current
-
-
10
mA
-
-
25
mA
Power dissipation
PD
-
-
250
mW
Junction temperature
TJ
-
-
125
°C
Tamb
-25
-
+85
°C
Tstg
-25
-
+85
°C
-
-
260
°C
IIRED(DC)
-
-
85
mA
t < 90 μs, ton < 20 %
IIRED(RP)
-
-
430
mA
JESD22-A114
VESD
Ambient temperature range (operating)
Storage temperature range
Soldering temperature
See recommended solder profile
Average output current, pin 1
Repetitive pulsed output current, pin 1
to pin 2
ESD protection
Latchup
JESD78
Thermal resistance junction to ambient
JESD51
RthJA
2
-
-
kV
|± 100|
-
-
mA
-
300
-
K/W
Note
• Reference point ground (pin 8) unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing
EYE SAFETY INFORMATION
STANDARD
CLASSIFICATION
IEC/EN 60825-1 (2007-03), DIN EN 60825-1 (2008-05) “SAFETY OF LASER PRODUCTS Part 1: equipment classification and requirements”, simplified method
Class 1
IEC 62471 (2006), CIE S009 (2002) “Photobiological Safety of Lamps and Lamp Systems”
Exempt
DIRECTIVE 2006/25/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 5th April 2006 on the
minimum health and safety requirements regarding the exposure of workers to risks arising from physical agents
(artificial optical radiation) (19th individual directive within the meaning of article 16(1) of directive 89/391/EEC)
Exempt
Note
• Vishay transceivers operating inside the absolute maximum ratings are classified as eye safe according the above table
Rev. 1.7, 28-Oct-2022
Document Number: 81965
3
For technical questions within your region: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 5.5 V unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
VCC1
2.4
-
5.5
V
9.6
-
115.2
kbit/s
TRANSCEIVER
Supply voltage
Data rates
Idle supply current at VCC1
(receive mode, no signal)
Average dynamic supply current,
transmitting
Standby (SD) (1) supply current
RXD to VCC1 impedance
SD = low, Tamb = -25 °C to +85 °C
independent of ambient light,
VCC1 = VCC2 = 2.4 V to 5.5 V
ICC1
40
70
110
μA
IIRED = 300 mA, 20 % duty cycle
ICC1
-
0.6
2
mA
SD = high, Tamb = -25 °C to +85 °C
independent of ambient light
ISD
-
0.01
1
μA
SD = high
RRXD
400
500
600
kΩ
VILo
-0.3
-
0.4
V
VIHi
VCC1 - 0.3
-
6
V
VIHi
VCC1 - 0.5
-
6
V
-
0.5 x VCC1
-
Input voltage low (TXD, SD)
Input voltage high (SD)
For compliance with ISD spec.
Input voltage high (TXD)
Timing logic decision level
Input leakage current low
VILo ≤ 0.3 V
IILo
-
0.01
10
μA
Input leakage current high
VIHi ≥ VCC1 - 0.3 V
IIHi
-
0.01
10
μA
CIN
-
-
5
pF
V
V
Input capacitance (TXD, SD)
Output voltage low, RXD
Cload = 8 pF, IOLo ≤ |+500 μA|
VOLo
-
-
0.15 x
VCC1
Output voltage high, RXD
IOH = 200 μA
VOHi
0.8 x VCC1
-
-
Notes
• Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing
(1) SD mode becomes active when SD is set high for more than 0.2 μs. In SD mode the detector is disabled and the output disconnected
Rev. 1.7, 28-Oct-2022
Document Number: 81965
4
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
OPTOELECTRONIC CHARACTERISTICS (Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 5.5 V unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
9.6 kbit/s to 115.2 kbit/s,
λ = 850 nm to 900 nm; α = 0°, 15°
Ee
-
20
50
mW/m2
λ = 850 nm to 900 nm
Ee
2
5
-
kW/m2
λ = 850 nm to 900 nm,
tr, tf < 40 ns, tpo = 1.6 μs at f = 115 kHz,
no output signal allowed
Ee
4
(0.4)
-
-
mW/m2
(μW/cm2)
Rise time of output signal
10 % to 90 %, CL = 8 pF
tr(RXD)
10
30
80
ns
Fall time of output signal
90 % to 10 %, CL = 8 pF
tf(RXD)
10
30
80
ns
Input pulse length > 1.2 μs
tPW
1.7
2.2
3
μs
Input irradiance = 100 mW/m2,
≤ 115.2 kbit/s
-
-
350
ns
After shutdown active or power-on
-
100
500
μs
tL
-
50
150
μs
RECEIVER
Minimum irradiance Ee in angular
range (2)
Maximum irradiance Ee In
Angular Range (3)
Maximum no detection
irradiance (1)
RXD pulse width of output signal
Stochastic jitter, leading edge
Standby/shutdown delay,
receiver startup time
Latency
TRANSMITTER
IRED operating current limitation
No external resistor for current limitation (4)
ID
200
300
430
mA
Forward voltage of built-in IRED
If = 300 mA
Vf
1.4
1.8
1.9
V
Output leakage IRED current
Output radiant intensity
TXD = 0 V, 0 < VCC1 < 5.5 V
IIRED
-1
0.01
1
μA
α = 0°, 15°, TXD = high, SD = low
Ie
50
200
400
mW/sr
VCC1 = 5 V, α = 0°, 15°,
TXD = low or SD = high
(receiver is inactive as long as SD = high)
Ie
-
-
0.04
mW/sr
α
-
± 30
-
°
Output radiant intensity, angle of
half intensity
Peak - emission
wavelength (5)
Spectral bandwidth
λp
870
-
910
nm
Δλ
-
45
-
nm
tropt, tfopt
10
50
100
ns
μs
TRANSMITTER
Optical rise time, fall time
Optical output pulse duration
Optical overshoot
Input pulse width 1.6 < tTXD < 23 μs
topt
tTXD - 0.15
-
tTXD +
0.15
Input pulse width tTXD ≥ 23 μs
topt
23
50
100
μs
-
-
25
%
Notes
• Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing
(1) Equivalent to IrDA background light and electromagnetic field test: fluorescent lighting immunity
(2) IrDA sensitivity definition: minimum irradiance E in angular range, power per unit area. The receiver must meet the BER specification while
e
the source is operating at the minimum intensity in angular range into the minimum half-angular range at the maximum link length
(3) Maximum irradiance E in angular range, power per unit area. The optical delivered to the detector by a source operating at the maximum
e
intensity in angular range at minimum link length must not cause receiver overdrive distortion and possible ralated link errors. If placed at
the active output interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER). For more definitions see the
document “Symbols and Terminology” on the Vishay website
(4) Using an external current limiting resistor is allowed and recommended to reduce IRED intensity and operating current when current
reduction is intended to operate at the IrDA low power conditions. E.g. for VCC2 = 3.3 V a current limiting resistor of RS = 56 Ω will allow a
power minimized operation at IrDA low power conditions
(5) Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the
standard remote control applications with codes as e.g. Phillips RC5/RC6® or RECS 80
Rev. 1.7, 28-Oct-2022
Document Number: 81965
5
For technical questions within your region: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
RECOMMENDED CIRCUIT DIAGRAM
TABLE 1 - RECOMMENDED
APPLICATION CIRCUIT COMPONENTS
Operated with a clean low impedance power supply the
TFDU4301 needs no additional external components.
However, depending on the entire system design and board
layout, additional components may be required (see Fig. 1).
VIRED
R1 (1)
VCC2, IRED A
VCC
R2
VCC1
GND
C1
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
IRED C
19295-1
Fig. 1 - Recommended Application Circuit
Note
(1) R1 is optional when reduced intensity is used
The capacitor C1 is buffering the supply voltage and
eliminates the inductance of the power supply line. This one
should be a tantalum or other fast capacitor to guarantee the
fast rise time of the IRED current. The resistor R1 is the
current limiting resistor, which may be used to reduce the
operating current to levels below the specified controlled
values for saving battery power.
Vishay’s transceivers integrate a sensitive receiver and a
built-in power driver. The combination of both needs a
careful circuit board layout. The use of thin, long, resistive
and inductive wiring should be avoided. The shutdown input
must be grounded for normal operation, also when the
shutdown function is not used.
COMPONENT
RECOMMENDED VALUE
C1
4.7 μF
C2
0.1 μF, ceramic
R1
Depends on current to be adjusted
R2
47 Ω
The inputs (TXD, SD) and the output RXD should be directly
connected (DC - coupled) to the I/O circuit. The capacitor
C2 combined with the resistor R2 is the low pass filter for
smoothing the supply voltage. R2, C1 and C2 are optional
and dependent on the quality of the supply voltages VCC1
and injected noise. An unstable power supply with dropping
voltage during transmision may reduce the sensitivity (and
transmission range) of the transceiver.
The placement of these parts is critical. It is strongly
recommended to position C2 as close as possible to the
transceiver pins.
When extended wiring is used as in bench tests the
inductance of the power supply can cause dynamically a
voltage drop at VCC2. Often some power supplies are not
able to follow the fast current rise time. In that case another
4.7 μF (type, see table under C1) at VCC2 will be helpful.
Under extreme EMI conditions as placing an
RF-transmitter antenna on top of the transceiver, we
recommend to protect all inputs by a low-pass filter, as a
minimum a 12 pF capacitor, especially at the RXD port.
Vbatt 3 V to 3.6 V
VS = 3.3 V
Vdd
IRED Anode (1)
IRED Cathode (2)
IRTX
TXD (3)
IRRX
RXD (4)
IR MODE
SD (5)
R2
C2
VCC1 (6)
NC (7)
GND (8)
19296-1
Fig. 2 - Typical Application Circuit
Figure 2 shows an example of a typical application for to
work with a separate supply voltage VS and using the
transceiver with the IRED Anode connected to the
unregulated battery Vbatt. This method reduces the peak
load of the regulated power supply and saves therefore
costs. Alternatively all supplies can also be tied to only one
voltage source. R1 and C1 are not used in this case and are
depending on the circuit design in most cases not
necessary.
Rev. 1.7, 28-Oct-2022
Document Number: 81965
6
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
I/O AND SOFTWARE
In the description, already different I/Os are mentioned.
Different combinations are tested and the function verified
with the special drivers available from the I/O suppliers. In
special cases refer to the I/O manual, the Vishay application
notes, or contact directly Vishay Sales, Marketing or
Application.
For operating at RS232 ports we recommend to use an
encoder / decoder-module.
Note
• TFDU4301 echoes the TXD signal at the RXD output during
transmission. For communication this signal is to be correctly
ignored by the controller or the software. The echo signal is
implemented for test purposes in mass production
TABLE 2 - TRUTH TABLE
INPUTS
OUTPUTS
REMARK
SD
TXD
OPTICAL INPUT IRRADIANCE mW/m2
RXD
TRANSMITTER
OPERATION
High > 1 ms
x
x
Weakly pulled
(500 kΩ) to VCC1
0
Shutdown
Low
High
x
Low (active)
Ie
Transmitting
Low
High > 100 μs
x
High inactive
0
Protection is active
Low
Low
min. detection threshold irradiance
< max. detection threshold irradiance
Low (active)
0
Response to an IrDA
compliant optical input signal
Low
Low
> max. detection threshold irradiance
Undefined
0
Overload conditions can
cause unexpected outputs
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER
PROFILE
Axis Title
10000
300
max. 260 °C
255 °C
240 °C
250
245 °C
217 °C
200
1000
max. 20 s
150
max. 120 s
max. 100 s
100
100
Max. ramp up 3 °C/s
50
Max. ramp down 6 °C/s
Max. 2 cycles allowed
0
0
19800
1st line
2nd line
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
2nd line
Temperature (°C)
ASSEMBLY INSTRUCTIONS
50
100
150
200
250
10
300
Time (s)
Rev. 1.7, 28-Oct-2022
Document Number: 81965
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
Tolerance ± 0.2 mm if not otherwise mentioned
20627
Footprint
Mounting Center
Mounting Center
7 x 0.95 = 6.65
Top View
1.2
Side View
(0.25)
0.7
0.7 (8 x)
* min 0.2 Photoimageable
solder mask recommended
between pads to prevent bridgeing
1.4
1.4
0.4
0.95
(1.82)
0.2*
20626
Rev. 1.7, 28-Oct-2022
Document Number: 81965
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
TAPE DIMENSIONS FOR TT1 AND TT3 in millimeters
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
19855
Fig. 3 - Tape Drawing, TFDU4301 for Top View Mounting
Rev. 1.7, 28-Oct-2022
Document Number: 81965
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Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
TAPE DIMENSIONS FOR TR1 AND TR3 in millimeters
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
19856
Fig. 4 - Tape Drawing, TFDU4301 for Side View Mounting
Rev. 1.7, 28-Oct-2022
Document Number: 81965
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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TFDU4301
www.vishay.com
Vishay Semiconductors
REEL DIMENSIONS in millimeters
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
TAPING
VARIANT
TAPE WIDTH
(mm)
A MAX.
(mm)
N
(mm)
W1 MIN.
(mm)
W2 MAX.
(mm)
W3 MIN.
(mm)
W3 MAX.
(mm)
TT1 / TR1
TT3 / TR3
16
180
60
16.4
22.4
15.9
19.4
16
330
50
16.4
22.4
15.9
19.4
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
LABEL
According to DIN EN 60286-3
0.1 N to 1.3 N
300 ± 10 mm/min.
165° to 180° peel angle
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
Rev. 1.7, 28-Oct-2022
Document Number: 81965
11
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Aluminum bag
Label
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
Reel
CAUTION
15973
This bag contains
MOISTURE-SENSITIVE DEVICES
FINAL PACKING
LEVEL
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
The sealed reel is packed into a cardboard box.
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
RECOMMENDED METHOD OF STORAGE
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
22522
EIA JEDEC standard J-STD-020 level 4 label is included
on all dry bags
OUTER PACKAGING
The sealed reel is packed into a pizza box.
CARTON BOX DIMENSIONS in millimeters
Length
Thickness
22127
ORDER CODE
Width
BOXING
THICKNESS
WIDTH
LENGTH
TT3 / TR3
Pizza box (taping in reels)
50
340
340
TT1 / TR1
Pizza box (taping in reels)
32
190
190
Rev. 1.7, 28-Oct-2022
Document Number: 81965
12
For technical questions within your region: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Datasheet Values Refer to PCN-OPT-1234-2022
TFDU4301
www.vishay.com
Vishay Semiconductors
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
LOT-/serial-number
Mixed code indicator
MIXED CODE
-
xxxxxxx+
Company logo
Origin
Long bar code top
Type
Length
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
-
21
Type
Length
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
Total length
Short bar code bottom
The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and
contain Vishay Semiconductors specific data.
Lead (Pb)-free category
e3 Sn
Lot 1: lot number or identification
Lot 2: 1920031A91
19 – plant code
20 – year
03 – workweek
1 – weekday: 1 Mon, 2 Tue, …
A – shift
91 – printer number
QA acceptance seal
and signature
Device type
Quantity
Plant location
Plant location code
Batch number
YYYYWW
+ country
+ plant code
RoHS compliance
logo
Lead (Pb)-free
logo
Fig. 5 - 2D Bar Code Label (according the bar code standard for 2D label PDF 417)
for a Lead (Pb)-Free Device Made in Philippines, Detailed Description
ESD PRECAUTION
Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are
removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging.
Rev. 1.7, 28-Oct-2022
Document Number: 81965
13
For technical questions within your region: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of
any of the products, services or opinions of the corporation, organization or individual associated with the third-party website.
Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website
or for that of subsequent links.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
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© 2022 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 01-Jan-2022
1
Document Number: 91000