Not for New Designs
TFDU6300
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Vishay Semiconductors
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for IrDA Application
FEATURES
• Compliant to the latest IrDA physical layer
specification (up to 4 Mbit/s) with an extended
low power range of > 70 cm (typ. 1 m) and TV
remote control (> 9 m)
• Operates from 2.4 V to 3.6 V within specification
• Low power consumption (1.8 mA typ. supply
current)
20101
DESCRIPTION
• Power shutdown mode (0.01 μA typ. shutdown current)
The TFDU6300 transceiver is an infrared transceiver module
compliant to the latest IrDA® physical layer low-power
standard for fast infrared data communication, supporting
IrDA speeds up to 4 Mbit/s (FIR), HP-SIR®, Sharp ASK® and
carrier based remote control modes up to 2 MHz. Integrated
within the transceiver module is a photo PIN diode, an
infrared emitter (IRED), and a low-power control IC to
provide a total front-end solution in a single package.
• Surface mount package
- universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
This new Vishay FIR transceiver is built in a new smaller
package using the experiences of the lead frame BabyFace
technology. The transceivers are capable of directly
interfacing with a wide variety of I/O devices, which perform
the modulation/demodulation function. At a minimum, a VCC
bypass capacitor is the only external component required
implementing a complete solution. TFDU6300 has a tri-state
output and is floating in shutdown mode with a weak
pull-up.
• Tri-state-receiver output, floating in shutdown with a weak
pull-up
• Low profile (universal) package capable of surface mount
soldering to side and top view orientation
• Directly interfaces with various super I/O and controller
devices
• Only one external component required
• Split power supply, transmitter and receiver can be
operated from two power supplies with relaxed
requirements saving costs
• Qualified for lead (Pb)-free and Sn/Pb processing (MSL4)
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Notebook computers, desktop PCs, tablet PC
• Digital cameras and video cameras
• Printers, fax machines, photocopiers, screen projectors
• Telecommunication products (cellular phones, pagers)
• Internet TV boxes, video conferencing systems
• External infrared adapters (dongles)
• Medical and industrial data collection
PRODUCT SUMMARY
PART NUMBER
TFDU6300
DATA RATE
(kbit/s)
DIMENSIONS
HxLxW
(mm x mm x mm)
LINK DISTANCE
(m)
OPERATING
VOLTAGE
(V)
IDLE SUPPLY
CURRENT
(mA)
4000
2.5 x 8.5 x 3.1
0 to 0.7
2.4 to 3.6
2
PARTS TABLE
PART
DESCRIPTION
QTY/REEL OR TUBE
TFDU6300-TR3
Oriented in carrier tape for side view surface mounting
2500 pcs
TFDU6300-TT3
Oriented in carrier tape for top view surface mounting
2500 pcs
TFDU6300-TR1
Oriented in carrier tape for side view surface mounting
750 pcs
TFDU6300-TT1
Oriented in carrier tape for top view surface mounting
750 pcs
Rev. 2.2, 06-Sep-13
Document Number: 84763
1
For technical questions, contact: irdasupportAM@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
TFDU6300
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Vishay Semiconductors
FUNCTIONAL BLOCK DIAGRAM
VCC1
Tri-State
Driver
Amplifier
RXD
Comparator
VCC2
SD
Logic
and
Control
Controlled
Driver
TXD
GND
18468_1
Fig. 1 - Functional Block Diagram
PIN DESCRIPTION
PIN
NUMBER
SYMBOL
DESCRIPTION
1
VCC2
IRED anode
IRED anode to be externally connected to VCC2 (VIRED). For higher voltages
than 3.6 V an external resistor might be necessary for reducing the internal
power dissipation. This pin is allowed to be supplied from an uncontrolled
power supply separated from the controlled VCC1 - supply
2
IRED cathode
IRED cathode, internally connected to driver transistor
3
I/O
ACTIVE
TXD
This input is used to transmit serial data when SD is low. An on-chip
protection circuit disables the IRED driver if the TXD pin is asserted for
longer than 100 μs. When used in conjunction with the SD pin, this pin is also
used to control the receiver mode. Logic reference: VCC1
I
High
4
RXD
Received data output, push-pull CMOS driver output capable of driving
standard CMOS. No external pull-up or pull-down resistor is required.
Floating with a weak pull-up of 500 k (typ.) in shutdown mode.
High/low levels related to VCC1. RXD echoes the TXD signal
O
Low
5
SD
Shutdown, also used for dynamic mode switching. Setting this pin active
places the module into shutdown mode. On the falling edge of this signal,
the state of the TXD pin is sampled and used to set receiver low bandwidth
(TXD = low: SIR) or high bandwidth (TXD = high: MIR and FIR) mode
I
High
6
VCC1
Supply voltage
7
NC
Internally not connected
8
GND
Ground
I
PINOUT
Definitions:
Weight 0.075 g
In the Vishay transceiver datasheets the following
nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial
infrared standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
19531
Fig. 2 - Pinning
Rev. 2.2, 06-Sep-13
MIR and FIR were implemented with IrPhy 1.1, followed by
IrPhy 1.2, adding the SIR low power standard. IrPhy 1.3
extended the low power option to MIR and FIR and VFIR
was added with IrPhy 1.4. A new version of the standard in
any case obsoletes the former version. With introducing the
updated versions the old versions are obsolete. Therefore
the only valid IrDA standard is the actual version IrPhy 1.4 (in
Oct. 2002).
Document Number: 84763
2
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Not for New Designs
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Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
Supply voltage range,
transceiver
0 V < VCC2 < 6 V
VCC1
Supply voltage range,
transmitter
0 V < VCC1 < 6 V
VCC2
Voltage at all I/O pins
Input currents
Vin < VCC1 is allowed
TYP.
MAX.
UNIT
- 0.5
6
V
- 0.5
6.5
V
- 0.5
For all pins, except IRED anode pin
Output sinking current
6
V
10
mA
25
mA
Power dissipation
PD
500
mW
Junction temperature
TJ
125
°C
Ambient temperature range
(operating)
Storage temperature range
Soldering temperature
Tamb
- 25
+ 85
°C
Tstg
- 25
+ 85
°C
260
°C
IIRED (DC)
150
mA
IIRED (RP)
700
mA
See section
“Recommended Solder Profiles”
Average output current
Repetitive pulse output current
< 90 μs, ton < 20 %
ESD protection
Human body model
1
kV
Note
• Reference point pin 8, (ground) unless otherwise noted.
Typical values are for design aid only, not guaranteed nor subject to production testing.
EYE SAFETY INFORMATION
STANDARD
CLASSIFICATION
IEC/EN 60825-1 (2007-03), DIN EN 60825-1 (2008-05) “SAFETY OF LASER PRODUCTS Part 1: equipment classification and requirements”, simplified method
Class 1
IEC 62471 (2006), CIE S009 (2002) “Photobiological Safety of Lamps and Lamp Systems”
Exempt
DIRECTIVE 2006/25/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 5th April 2006
on the minimum health and safety requirements regarding the exposure of workers to risks arising from
physical agents (artificial optical radiation) (19th individual directive within the meaning of article 16(1)
of directive 89/391/EEC)
Exempt
Note
• Vishay transceivers operating inside the absolute maximum ratings are classified as eye safe according the above table.
ELECTRICAL CHARACTERISTICS
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
VCC
2.4
TYP.
MAX.
UNIT
3.6
V
TRANSCEIVER
Supply voltage
Dynamic Supply current
Receive mode only, idle
In transmit mode, add additional 85 mA (typ) for IRED current.
Add RXD output current depending on RXD load.
SIR mode
ICC
1.8
3
mA
MIR/FIR mode
ICC
2
3.3
mA
Shutdown supply current
SD = high
T= 25 °C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
0.01
Shutdown supply current
SD = high, full specified
temperature range, not ambient
light sensitive
ISD
μA
1
μA
Operating temperature range
TA
- 25
+ 85
°C
Input voltage low (TXD, SD)
VIL
- 0.5
0.5
V
Rev. 2.2, 06-Sep-13
Document Number: 84763
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For technical questions, contact: irdasupportAM@vishay.com
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
TFDU6300
www.vishay.com
Vishay Semiconductors
ELECTRICAL CHARACTERISTICS
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
CMOS level (1)
VIH
VIN = 0.9 x VCC1
IICH
TYP.
MAX.
UNIT
VCC - 0.3
6
V
-1
TRANSCEIVER
Input voltage high (TXD, SD)
Input leakage current (TXD, SD)
Input capacitance, TXD, SD
Output voltage low
Output voltage high
IOL = 500 μA
Cload = 15 pF
IOH = - 250 μA
Cload = 15 pF
Output RXD current limitation
high state
low state
Short to ground
Short to VCC1
SD shutdown pulse duration
Activating shutdown
RXD to VCC1 impedance
SD mode programming pulse
duration
All modes
+1
μA
CI
5
pF
VOL
0.4
V
0.9 x VCC1
VOH
V
20
20
30
RRXD
400
tSDPW
200
500
mA
mA
μs
600
k
ns
Notes
• Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for design aid only, not guaranteed nor subject to production testing.
(1) The typical threshold level is 0.5 x V
CC1 (VCC1 = 3 V) . It is recommended to use the specified min./max. values to avoid increased operating
current.
OPTOELECTRONIC CHARACTERISTICS
PARAMETER
TEST CONDITIONS
SYMBOL
9.6 kbit/s to 115.2 kbit/s
= 850 nm to 900 nm,
VCC = 2.4 V
Minimum irradiance Ee in angular
range, MIR mode
MIN.
TYP.
MAX.
UNIT
Ee
50
(5)
80
(8)
mW/m2
(μW/cm2)
1.152 Mbit/s
= 850 nm to 900 nm,
VCC = 2.4 V
Ee
100
(10)
Minimum irradiance Ee inangular
range, FIR mode
4 Mbit/s
= 850 nm to 900 nm,
VCC = 2.4 V
Ee
130
(13)
Maximum irradiance Ee in angular
range (3)
= 850 nm to 900 nm
Ee
5
(500)
Rise time of output signal
10 % to 90 %, CL = 15 pF
tr (RXD)
10
40
ns
Fall time of output signal
40
ns
RECEIVER
Minimum irradiance Ee (1) in
angular range (2)
mW/m2
(μW/cm2)
200
(20)
mW/m2
(μW/cm2)
kW/m2
(mW/cm2)
90 % to 10 %, CL = 15 pF
tf (RXD)
10
RXD pulse width of output signal,
50 %, SIR mode
Input pulse length
1.4 μs < PWopt < 25 μs
tPW
1.6
2.2
3
μs
RXD pulse width of output signal,
50 %, MIR mode
Input pulse length
PWopt = 217 ns, 1.152 Mbit/s
tPW
105
250
275
ns
RXD pulse width of output signal,
50 %, FIR mode
Input pulse length
PWopt = 125 ns, 4 Mbit/s
tPW
105
125
145
ns
RXD pulse width of output signal,
50 %, FIR mode
Input pulse length
PWopt = 250 ns, 4 Mbit/s
tPW
225
250
275
ns
25
80
350
ns
ns
ns
250
μs
100
μs
Stochastic jitter, leading edge
Input irradiance = 100 mW/m2,
4 Mbit/s
1.152 Mbit/s
115.2 kbit/s
Receiver start up time
After completion of shutdown
programming sequence
power on delay
Latency
Rev. 2.2, 06-Sep-13
tL
40
Document Number: 84763
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Not for New Designs
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Vishay Semiconductors
OPTOELECTRONIC CHARACTERISTICS
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Note: no external resistor current
limiting resistor is needed
ID
330
440
600
mA
Input pulse width t < 20 μs
tPW
TRANSMITTER
IRED operating current, switched
current limiter
Output pulse width limitation
Input pulse width 20 μs < t < 150 μs
tPW
Input pulse width t 150 μs
tPW_lim
Output leakage IRED current
Output radiant intensity,
see figure 3,
recommended appl. circuit
Output radiant intensity,
see figure 3,
recommended appl. circuit
Output radiant intensity
t
18
μs
150
μs
150
μs
1
μA
IIRED
-1
VCC = VIRED = 3.3 V, = 0°
TXD = high, SD = low
Ie
65
180
468 (4)
mW/sr
VCC = VIRED = 3.3 V, = 0°, 15°
TXD = high, SD = low
Ie
50
125
468 (4)
mW/sr
VCC1 = 3.3 V, = 0°, 15°
TXD = low or SD = high (receiver is
inactive as long as SD = high)
Ie
0.04
mW/sr
Output radiant intensity, angle of
half intensity
Peak - emission wavelength (5)
p
Spectral bandwidth
Optical rise time,
optical fall time
± 24
875
886
deg
900
45
tropt,
tfopt
10
nm
nm
40
ns
Optical output pulse duration
Input pulse width 217 ns,
1.152 Mbit/s
topt
207
217
227
ns
Optical output pulse duration
Input pulse width 125 ns,
4 Mbit/s
topt
117
125
133
ns
Optical output pulse duration
Input pulse width 250 ns,
4 Mbit/s
topt
242
250
258
ns
25
%
Optical overshoot
Notes
• Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production
testing. All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 μs after
starting the preamble.
(1) IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.
(2) IrDA sensitivity definition (equivalent to threshold irradiance): minimum irradiance E in angular range, power per unit area. The receiver must
e
meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angular range at
the maximum link length.
(3) Maximum irradiance E in angular range, power per unit area. The optical delivered to the detector by a source operating at the maximum
e
intensity in angular range at minimum link length must not cause receiver overdrive distortion and possible related link errors. If placed at
the active output interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification. For more
definitions see the document “Symbols and Terminology” on the Vishay website
(4) Maximum value is given by eye safety class 1, IEC 60825-1, simplified method.
(5) Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the
standard remote control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range conditions
(125 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers are used.
Rev. 2.2, 06-Sep-13
Document Number: 84763
5
For technical questions, contact: irdasupportAM@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
TFDU6300
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Vishay Semiconductors
RECOMMENDED CIRCUIT DIAGRAM
Operated at a clean low impedance power supply the
TFDU6300 needs no additional external components.
However, depending on the entire system design and board
layout, additional components may be required
(see figure 3).
VCC2
R1
VCC1
R2
C1
GND
IRED Anode
V CC
C2
Ground
SD
SD
TXD
TXD
RXD
RXD
SD) and the output RXD should be directly (DC) coupled to
the I/O circuit.
The capacitor C2 combined with the resistor R2 is the low
pass filter for smoothing the supply voltage.
R2, C1 and C2 are optional and dependent on the quality of
the supply voltages VCCx and injected noise. An unstable
power supply with dropping voltage during transmission
may reduce the sensitivity (and transmission range) of the
transceiver.
The placement of these parts is critical. It is strongly
recommended to position C2 as close as possible to the
transceiver power supply pins. A tantalum capacitor should
be used for C1 while a ceramic capacitor is used for C2.
IRED Cathode
19307
Fig. 3 - Recommended Application Circuit
The capacitor C1 is buffering the supply voltage and
eliminates the inductance of the power supply line. This one
should be a tantalum or other fast capacitor to guarantee the
fast rise time of the IRED current. The resistor R1 is only
necessary for high operating voltages and elevated
temperatures.
Vishay transceivers integrate a sensitive receiver and a
built-in power driver. The combination of both needs a
careful circuit board layout. The use of thin, long, resistive
and inductive wiring should be avoided. The inputs (TXD,
In addition, when connecting the described circuit to the
power supply, low impedance wiring should be used.
When extended wiring is used the inductance of the power
supply can cause dynamically a voltage drop at VCC2. Often
some power supplies are not able to follow the fast current
rise time. In that case another 4.7 μF (type, see table under
C1) at VCC2 will be helpful.
Keep in mind that basic RF-design rules for circuit design
should be taken into account. Especially longer signal lines
should not be used without termination. See e.g. “The Art of
Electronics” Paul Horowitz, Winfield Hill, 1989, Cambridge
University Press, ISBN: 0521370957.
TABLE 1 - RECOMMENDED APPLICATION CIRCUIT COMPONENTS
COMPONENT
RECOMMENDED VALUE
C1
4.7 μF, 16 V
293D 475X9 016B
C2
0.1 μF, ceramic
VJ 1206 Y 104 J XXMT
R1
No resistor necessary, the internal controller is able to control the current
R2
10 , 0.125 W
I/O AND SOFTWARE
In the description, already different I/Os are mentioned.
Different combinations are tested and the function verified
with the special drivers available from the I/O suppliers. In
special cases refer to the I/O manual, the Vishay application
notes, or contact directly Vishay Sales, Marketing or
Application.
MODE SWITCHING
The TFDU6300 is in the SIR mode after power on as a
default mode, therefore the FIR data transfer rate has to be
set by a programming sequence using the TXD and SD
inputs as described below. The low frequency mode covers
speeds up to 115.2 kbit/s. Signals with higher data rates
should be detected in the high frequency mode. Lower
frequency data can also be received in the high frequency
mode but with reduced sensitivity. To switch the
transceivers from low frequency mode to the high frequency
mode and vice versa, the programming sequences
described below are required.
Rev. 2.2, 06-Sep-13
VISHAY PART NUMBER
CRCW-1206-10R0-F-RT1
SETTING TO THE HIGH BANDWIDTH MODE
(0.576 Mbit/s to 4 Mbit/s)
1. Set SD input to logic “high”.
2. Set TXD input to logic “high”. Wait ts 200 ns.
3. Set SD to logic “low” (this negative edge latches state of
TXD, which determines speed setting).
4. After waiting th 200 ns TXD can be set to logic “low”.
The hold time of TXD is limited by the maximum allowed
pulse length.
TXD is now enabled as normal TXD input for the high
bandwidth mode.
Document Number: 84763
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SETTING TO THE LOWER BANDWIDTH MODE
(2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic “high”.
2. Set TXD input to logic “low”. Wait ts 200 ns.
50 %
SD
3. Set SD to logic “low” (this negative edge latches state of
TXD, which determines speed setting).
4. TXD must be held for th 200 ns.
ts
th
High: FIR
TXD is now enabled as normal TXD input for the high
bandwidth mode.
50 %
TXD
50 %
Low: SIR
Note
• When applying this sequence to the device already in the lower
bandwidth mode, the SD pulse is interpreted as shutdown. In
this case the RXD output of the transceiver may react with a
single pulse (going active low) for a duration less than 2 μs. The
operating software should take care for this condition.
In case the applied SD pulse is longer than 4 μs, no RXD pulse
is to be expected but the receiver startup time is to be taken into
account before the device is in receive condition.
14873
Fig. 4 - Mode Switching Timing Diagram
TABLE 2 - TRUTH TABLE
INPUTS
SD
High
OUTPUTS
TXD
OPTICAL INPUT IRRADIANCE mW/m2
RXD
x
x
Weakly pulled (500 k) to VCC1
0
High
x
Low (echo)
Ie
High > 150 μs
x
High
0
Low
min. detection threshold irradiance
< max. detection threshold irradiance
Low (active)
0
Low
> max. detection threshold irradiance
x
0
Low
RECOMMENDED SOLDER PROFILES
Temperature (°C)
Solder Profile for Sn/Pb Soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
TRANSMITTER
240 °C max.
10 s max. at 230 °C
A ramp-up rate less than 0.9 °C/s is not recommended.
Ramp-up rates faster than 1.3 °C/s could damage an optical
part because the thermal conductivity is less than compared
to a standard IC.
2 to 4 °C/s
160 °C max.
120 to180 s
Ramp-To-Spike profile is used increasingly. Shown in
figure 4 and 5 are Vishay’s recommended profiles for use
with the TFDU6300 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
Wave Soldering
90 s max.
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
2 to 4 °C/s
Manual Soldering
0
50
19535
100
150
200
250
300
350
Time/s
Fig. 5 - Recommended Solder Profile for Sn/Pb soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU6300 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn(3.0 - 4.0)Ag(0.5 - 0.9)Cu, there are two standard reflow
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Rev. 2.2, 06-Sep-13
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application
note, describing manual soldering and desoldering.
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
Document Number: 84763
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Not for New Designs
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www.vishay.com
Vishay Semiconductors
280
275
T ≥ 255 °C for 10 s....30 s
250
240
225
T ≥ 217 °C for 70 s max.
200
175
150
30 s max.
125
100
90 s to 120 s
70 s max.
2 °C/s to 4 °C/s
75
200
Temperature/°C
Temperature/°C
Tpeak = 260 °C max.
Tpeak = 260 °C
< 4 °C/s
160
120
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s < 2 °C/s
Peak temperature Tpeak = 260 °C
80
2 °C/s to 3 °C/s
50
1.3 °C/s
40
25
0
0
0
50
100
19532
150
200
250
300
350
0
50
100
TFDU Fig3
Time/s
150
200
250
300
Time/s
Fig. 6 - Solder Profile, RSS Recommendation
Fig. 7 - RTS Recommendation
PACKAGE DIMENSIONS in millimeters
TFDU6300 (universal) package
20627
Footprint
Mounting Center
Mounting Center
7 x 0.95 = 6.65
0.7
0.7 (8 x)
Top View
* min 0.2 Photoimageable
solder mask recommended
between pads to prevent bridgeing
Side View
(0.25)
1.2
1.4
1.4
(1.82)
0.95
0.4
0.2*
20626
Fig. 8 - Package Drawing
Rev. 2.2, 06-Sep-13
Document Number: 84763
8
For technical questions, contact: irdasupportAM@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
TFDU6300
www.vishay.com
Vishay Semiconductors
REEL DIMENSIONS in millimeters
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Fig. 9 - Reel Drawing
TAPE WIDTH
(mm)
A MAX.
(mm)
N
(mm)
W1 MIN.
(mm)
W2 MAX.
(mm)
W3 MIN.
(mm)
W3 MAX.
(mm)
16
180
60
16.4
22.4
15.9
19.4
16
330
60
16.4
22.4
15.9
19.4
Rev. 2.2, 06-Sep-13
Document Number: 84763
9
For technical questions, contact: irdasupportAM@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
TFDU6300
www.vishay.com
Vishay Semiconductors
TAPE DIMENSIONS in millimeters
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
19855
Fig. 10 - Tape Drawing, TFDU6300 for Top View Mounting
Rev. 2.2, 06-Sep-13
Document Number: 84763
10
For technical questions, contact: irdasupportAM@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Not for New Designs
TFDU6300
www.vishay.com
Vishay Semiconductors
TAPE DIMENSIONS in millimeters
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
19856
Fig. 11 - Tape Drawing, TFDU6300 for Side View Mounting
Rev. 2.2, 06-Sep-13
Document Number: 84763
11
For technical questions, contact: irdasupportAM@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000