THJP1206ABT1

THJP www.vishay.com Vishay Dale Thin Film ThermaWick® Thermal Jumper Surface Mount Chip FEATURES • Electrically isolated thermal conductor • High thermal conductivity AlN substrate (170 W/mK) • Electrically isolated terminations (> 999 MΩ) Available Available • Low capacitance • Available with SnPb or lead (Pb)-free wrap terminations Available • AEC-Q200 qualified LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Infographics • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS Videos THJP surface mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both SnPb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available. • Power supplies and converters CONSTRUCTION FUNCTIONAL APPLICATIONS / CONNECTION OPTIONS Solder coating • RF amplifiers • Synthesizers • Switch mode power supplies • Pin and laser diodes • Filters • Component to heat sink Nickel termination • Component to case • Component to ground plane • Pad to pad Aluminum nitride substrate • Pad to via • Pad to trace HEAT TRANSFER DEMONSTRATION Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumper connecting the device to the heat sink. Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction Thermal jumper location Ceramic Resistor Chip Without Thermal Jumper (149.8 °C) Revision: 30-Sep-2022 Ceramic Chip Resistor With Thermal Jumper (95.5 °C) Document Number: 60157 1 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 THJP www.vishay.com Vishay Dale Thin Film DIMENSIONS in inches W L T D D CASE SIZE L W T D 0603 0.061 ± 0.005 0.033 ± 0.005 0.030 ± 0.005 0.015 ± 0.005 0612 0.063 ± 0.005 0.126 ± 0.005 0.030 ± 0.005 0.015 ± 0.005 0805 0.079 ± 0.005 0.047 ± 0.005 0.030 ± 0.005 0.020 ± 0.005 1206 0.126 ± 0.005 0.063 ± 0.005 0.030 ± 0.005 0.020 ± 0.005 1225 0.126 ± 0.005 0.252 ± 0.005 0.030 ± 0.005 0.020 ± 0.005 2512 0.252 ± 0.005 0.126 ± 0.005 0.030 ± 0.005 0.020 ± 0.005 TYPICAL CHARACTERISTICS CASE SIZE 0603 0612 0805 1206 1225 Thermal resistance (°C/W), TR 14 4 13 15 4 2512 15 Thermal conductance (mW/°C), TC 70 259 77 65 259 65 Capacitance (pF) 0.07 0.26 0.15 0.07 0.26 0.07 Dielectric withstanding voltage kVAC, RMS (60 Hz) > 1.5 > 1.5 > 1.5 > 1.5 > 1.5 > 1.5 Note L • T R = ------------------------k (T • W) where k is the thermal conductivity of AIN, 170 W/mK 1 T C = -----TR STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS Operating temperature range -65 °C to +150 °C Storage temperature range -65 °C to +150 °C STANDARD MATERIAL SPECIFICATIONS Substrate material Aluminum nitride (170 W/mK) Termination (tin / lead) Electroplate tin / lead over electroplate nickel Termination (lead (Pb)-free) Electroplate tin (e3) over electroplate nickel ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 / AEC-Q200 Requirements) ENVIRONMENTAL TEST CONDITIONS LIMITS TYPICAL VISHAY PERFORMANCE 95 % Acceptable Solderability Visual J-STD-002, method B and B1 Solder mounting integrity Visual MIL-PRF-55342, method par. 4.8.13.1 Pass / fail Pass Board flex Visual AEC-Q200, method 005 Pass / fail Pass Revision: 30-Sep-2022 Document Number: 60157 2 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 THJP www.vishay.com Vishay Dale Thin Film GLOBAL PART NUMBER INFORMATION New Global Part Numbering: THJP1206AST1 T H J P 1 2 0 6 A S GLOBAL MODEL CASE SIZE THICKNESS TERMINATION THJP 0603 0805 0612 1206 1225 2512 A = 0.030" B = wraparound Sn/Pb solder with nickel termination S = wraparound Sn (e3) solder with nickel termination RoHS compliant Revision: 30-Sep-2022 T 1 PACKAGING BS = BULK 100 min., 1 mult. TAPE AND REEL T0 = 100 min., 100 mult. T1 = 1000 min., 1000 mult. T3 = 300 min., 300 mult. T5 = 500 min., 500 mult. TF = full reel TS = 100 min., 1 mult. TI = 100 min., 1 mult. (item single lot date code) TP = 100 min., 1 mult. (package unit single lot date code) Document Number: 60157 3 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2023 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2023 1 Document Number: 91000