THJP
www.vishay.com
Vishay Dale Thin Film
ThermaWick® Thermal Jumper Surface Mount Chip
FEATURES
• Electrically isolated thermal conductor
• High thermal conductivity AlN substrate
(170 W/mK)
• Electrically isolated terminations (> 999 MΩ)
Available
Available
• Low capacitance
• Available with SnPb or lead (Pb)-free wrap
terminations
Available
• AEC-Q200 qualified
LINKS TO ADDITIONAL RESOURCES
3D 3D
3D Models
Infographics
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
Videos
THJP surface mount chips are designed to provide an
electrically isolated thermal conductive pathway to a ground
plane or heat sink while maintaining the electrical isolation of
the device. The devices are constructed with aluminum
nitride substrates in both SnPb and Pb-free wraparound
termination styles. The low capacitance of the device makes
them an excellent choice for high frequency and thermal
ladder applications. Custom sizes available.
• Power supplies and converters
CONSTRUCTION
FUNCTIONAL APPLICATIONS /
CONNECTION OPTIONS
Solder coating
• RF amplifiers
• Synthesizers
• Switch mode power supplies
• Pin and laser diodes
• Filters
• Component to heat sink
Nickel termination
• Component to case
• Component to ground plane
• Pad to pad
Aluminum nitride
substrate
• Pad to via
• Pad to trace
HEAT TRANSFER DEMONSTRATION
Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices
were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause
the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumper
connecting the device to the heat sink.
Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction
Thermal jumper location
Ceramic Resistor Chip Without Thermal Jumper (149.8 °C)
Revision: 30-Sep-2022
Ceramic Chip Resistor With Thermal Jumper (95.5 °C)
Document Number: 60157
1
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
THJP
www.vishay.com
Vishay Dale Thin Film
DIMENSIONS in inches
W
L
T
D
D
CASE SIZE
L
W
T
D
0603
0.061 ± 0.005
0.033 ± 0.005
0.030 ± 0.005
0.015 ± 0.005
0612
0.063 ± 0.005
0.126 ± 0.005
0.030 ± 0.005
0.015 ± 0.005
0805
0.079 ± 0.005
0.047 ± 0.005
0.030 ± 0.005
0.020 ± 0.005
1206
0.126 ± 0.005
0.063 ± 0.005
0.030 ± 0.005
0.020 ± 0.005
1225
0.126 ± 0.005
0.252 ± 0.005
0.030 ± 0.005
0.020 ± 0.005
2512
0.252 ± 0.005
0.126 ± 0.005
0.030 ± 0.005
0.020 ± 0.005
TYPICAL CHARACTERISTICS
CASE SIZE
0603
0612
0805
1206
1225
Thermal resistance (°C/W), TR
14
4
13
15
4
2512
15
Thermal conductance (mW/°C), TC
70
259
77
65
259
65
Capacitance (pF)
0.07
0.26
0.15
0.07
0.26
0.07
Dielectric withstanding voltage kVAC, RMS (60 Hz)
> 1.5
> 1.5
> 1.5
> 1.5
> 1.5
> 1.5
Note
L
• T R = ------------------------k (T • W)
where k is the thermal conductivity of AIN, 170 W/mK
1
T C = -----TR
STANDARD ELECTRICAL SPECIFICATIONS
TEST
SPECIFICATIONS
Operating temperature range
-65 °C to +150 °C
Storage temperature range
-65 °C to +150 °C
STANDARD MATERIAL SPECIFICATIONS
Substrate material
Aluminum nitride (170 W/mK)
Termination (tin / lead)
Electroplate tin / lead over electroplate nickel
Termination (lead (Pb)-free)
Electroplate tin (e3) over electroplate nickel
ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 / AEC-Q200 Requirements)
ENVIRONMENTAL TEST
CONDITIONS
LIMITS
TYPICAL VISHAY
PERFORMANCE
95 %
Acceptable
Solderability
Visual
J-STD-002, method B and B1
Solder mounting integrity
Visual
MIL-PRF-55342, method par. 4.8.13.1
Pass / fail
Pass
Board flex
Visual
AEC-Q200, method 005
Pass / fail
Pass
Revision: 30-Sep-2022
Document Number: 60157
2
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
THJP
www.vishay.com
Vishay Dale Thin Film
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: THJP1206AST1
T
H
J
P
1
2
0
6
A
S
GLOBAL MODEL
CASE SIZE
THICKNESS
TERMINATION
THJP
0603
0805
0612
1206
1225
2512
A = 0.030"
B = wraparound Sn/Pb solder
with nickel termination
S = wraparound Sn (e3) solder
with nickel termination
RoHS compliant
Revision: 30-Sep-2022
T
1
PACKAGING
BS = BULK 100 min., 1 mult.
TAPE AND REEL
T0 = 100 min., 100 mult.
T1 = 1000 min., 1000 mult.
T3 = 300 min., 300 mult.
T5 = 500 min., 500 mult.
TF = full reel
TS = 100 min., 1 mult.
TI = 100 min., 1 mult.
(item single lot date code)
TP = 100 min., 1 mult.
(package unit single lot date code)
Document Number: 60157
3
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Revision: 01-Jan-2023
1
Document Number: 91000