TMCJ
www.vishay.com
Vishay Polytech
Solid Tantalum Surface Mount Chip Capacitors
Molded Case, 0603 Size
FEATURES
• Small size, suitable for high density packaging
• Terminations: 100 % matte tin
• Qualified to EIA-717
• Compatible with “high volume” automatic pick
and place equipment
• Moisture sensitivity level 1
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
Operating Temperature: -55 °C to +125 °C
(above 85 °C, voltage derating is required)
Capacitance Range: 0.68 μF to 22 μF
Capacitance Tolerance: ± 20 %
Voltage Rating: 2.5 VDC to 20 VDC
Available
Available
APPLICATIONS
• Industrial
• Audio and visual equipment
• General purpose
ORDERING INFORMATION
TMC
J
0J
106
M
TR
(2)
F
TYPE
CASE
CODE
DC VOLTAGE
RATING AT +85 °C
CAPACITANCE
(μF)
CAPACITANCE
TOLERANCE
PACKAGING
POLARITY
(OPTIONAL)
TERMINAL
CODE
See
Ratings
and
Case
Codes
table
0E = 2.5 V
0G = 4.0 V
0J = 6.3 V
1A = 10 V
1C = 16 V
1D = 20 V
1E = 25 V
This is
expressed in
picofarads. The
first two digits
are the
significant
figures. The
third is the
number of zeros
to follow.
M = ± 20 %
TR = 7" reel,
cathodes close
to perforation
side
Halogen-free
(special order)
F=
lead (Pb)-free
terminations
DIMENSIONS in inches [millimeters]
Anode indication belt mark
L
a
H
W
W
l
CASE CODE
J
Revision: 04-Aug-2020
l
EIA SIZE
L
W
H
l
a
1608-09
0.063 ± 0.004
[1.6 ± 0.1]
0.031 ± 0.004
[0.8 ± 0.1]
0.031 ± 0.004
[0.8 ± 0.1]
0.012 ± 0.006
[0.3 ± 0.15]
0.024 ± 0.004
[0.6 ± 0.1]
Document Number: 40176
1
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TMCJ
www.vishay.com
Vishay Polytech
RATINGS AND CASE CODES
μF
2.5 V
4.0 V
6.3 V
10 V
16 V
0.68
20 V
J
1.0
J
1.5
J
J
J
2.2
J
J
3.3
J
J
J
4.7
J
J
J
6.8
J
J
J
10
J
J
J
15
J
J
22
J
J
MARKING
Anode indication belt mark
AE
Simplified code of rated
voltage (A: 10 V)
μF
2.5 V
4V
Simplified code of nominal
capacitance (E: 1.5 μF)
6.3 V
10 V
16 V
0.68
DW
1.0
CA
1.5
AE
CE
CJ
2.2
JJ
AJ
3.3
JN
AN
AS
4.7
eS
GS
JS
6.8
eW
GW
JW
10
eA
GA
JA
15
eE
GE
22
eJ
gJ
Revision: 04-Aug-2020
20 V
Document Number: 40176
2
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TMCJ
www.vishay.com
Vishay Polytech
STANDARD RATINGS
CAPACITANCE
(μF)
CASE CODE
PART NUMBER
MAX. DCL
AT +25 °C
(μA)
MAX. DF
AT +25 °C
120 Hz
(%)
MAX. ESR
AT +25 °C
100 kHz
(ω)
MAX. RIPPLE,
100 kHz IRMS
(A)
2.5 VDC AT +85 °C, 1.6 VDC AT +125 °C
4.7
J
TMCJ0E475MTRF
0.5
20
10.0
0.071
6.8
J
TMCJ0E685MTRF
0.5
20
10.0
0.071
10
J
TMCJ0E106MTRF
0.5
20
10.0
0.071
15
J
TMCJ0E156MTRF
0.5
20
10.0
0.071
22
J
TMCJ0E226MTRF
4 VDC AT +85 °C, 2.5 VDC AT +125 °C
4.7
J
TMCJ0G475MTRF
0.5
20
10.0
0.071
6.8
J
TMCJ0G685MTRF
0.5
20
10.0
0.071
10
J
TMCJ0G106MTRF
0.5
20
10.0
0.071
15
J
TMCJ0G156MTRF
6.0
20
10.0
0.071
22
J
TMCJ0G226MTRF
8.8
20
10.0
0.071
2.2
J
TMCJ0J225MTRF
0.5
20
10.0
0.071
3.3
J
TMCJ0J335MTRF
0.5
20
10.0
0.071
4.7
J
TMCJ0J475MTRF
0.5
20
10.0
0.071
6.8
J
TMCJ0J685MTRF
0.5
20
10.0
0.071
10
J
TMCJ0J106MTRF
0.6
20
10.0
0.071
6.3 VDC AT 85 °C, 4 VDC AT +125 °C
10 VDC AT 85 °C, 6.3 VDC AT +125 °C
1.5
J
TMCJ1A155MTRF
0.5
20
10.0
0.071
2.2
J
TMCJ1A225MTRF
0.5
20
10.0
0.071
3.3
J
TMCJ1A335MTRF
0.5
20
10.0
0.071
4.7
J
TMCJ1A475MTRF
0.5
20
10.0
0.071
1.0
J
TMCJ1C105MTRF
0.5
20
10.0
0.071
1.5
J
TMCJ1C155MTRF
0.5
20
10.0
0.071
2.2
J
TMCJ1C225MTRF
0.5
20
10.0
0.071
0.68
J
TMCJ1D684MTRF
20
27.5
0.043
16 VDC AT 85 °C, 10 VDC AT +125 °C
20 VDC AT 85 °C, 13 VDC AT +125 °C
0.5
RECOMMENDED VOLTAGE DERATING GUIDELINES (for temperature below +85 °C)
CAPACITOR VOLTAGE RATING
OPERATING VOLTAGE
2.5
1.2
4.0
2.0
6.3
3.1
10
5.0
16
8.0
20
10
Note
• For more information about recommended voltage derating see technical note www.vishay.com/doc?40246
Revision: 04-Aug-2020
Document Number: 40176
3
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TMCJ
www.vishay.com
Vishay Polytech
POWER DISSIPATION
CASE CODE
MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR
J
0.050
STANDARD PACKAGING QUANTITY
CASE CODE
UNITS PER 7" REEL
J
4000
PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Capacitance change
Temperature
characteristics
Solder heat
resistance
Moisture
resistance
no load
Measure the specified
characteristics in each stage
Solder dip:
260 °C ± 5 °C, 10 s ± 1 s
Reflow
260 °C, 10 s ± 1 s
Leave at 40 °C and 90 % to
95 % RH for 500 h
High
temperature
load
85 °C. The rated voltage is
applied for 2000 h
Thermal shock
Leave at -55 °C, normal
temperature, 125 °C, and
normal temperature for 30 min,
3 min, 30 min, and 3 min.
Repeat this operation 5 times
running
Failure rate
85 °C. The rated voltage is
applied through a protective
resistor of 1 Ω/V
Specified
initial value
-55 °C
+85 °C
+125 °C
-
-20 % to 0 %
0 % to +20 %
0 % to +20 %
Dissipation factor
(%) max.
20
30
20
30
Leakage current
Refer to
Standard
Ratings
table
-
1000 %
specified
initial value
or less
1250 %
specified
initial value
or less
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Initial specified value or less
Leakage current
Initial specified value or less
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Shall not exceed 150 % of initial specified value
Leakage current
Initial specified value or less
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Initial specified value or less
Leakage current
Shall not exceed 200 % of initial specified value
Capacitance change
Within ± 20 % of initial value
Dissipation factor
Initial specified value or less
Leakage current
Initial specified value or less
1 %/1000 h
Note
• Test conditions per JIS C5101-1
Revision: 04-Aug-2020
Document Number: 40176
4
For technical questions, contact: polytech@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
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Vishay Polytech
Guide for Tantalum Solid Electrolyte Chip Capacitors
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC
e
DIELECTRIC CONSTANT
Air or vacuum
1.0
Paper
2.0 to 6.0
Plastic
2.1 to 6.0
Mineral oil
2.2 to 2.3
Silicone oil
2.7 to 2.8
Quartz
3.8 to 4.4
Glass
4.8 to 8.0
Porcelain
5.1 to 5.9
Mica
5.4 to 8.7
THE BASICS OF TANTALUM CAPACITORS
Aluminum oxide
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called “valve”
metals and include titanium, zirconium, niobium, tantalum,
hafnium, and aluminum. Only a few of these permit the
accurate control of oxide thickness by electrochemical
means. Of these, the most valuable for the electronics
industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Tantalum pentoxide
Revision: 21-Sep-2020
Ceramic
8.4
26
12 to 400K
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
where
eA
C = ------t
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
Document Number: 40218
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
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Vishay Polytech
SOLID ELECTROLYTE TANTALUM CAPACITORS
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
Also important are their good low temperature performance
characteristics and freedom from corrosive electrolytes.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the leadframe.
Datasheets covering the various types and styles of
capacitors for consumer and entertainment electronics and
industry applications are available where detailed
performance characteristics must be specified.
Molded chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to ensure long life and
reliability. It offers excellent reliability and high stability for
consumer and commercial electronics with the added
feature of low cost.
Surface mount designs of “Solid Tantalum” capacitors use
lead frames as shown in the accompanying drawings.
MOLDED CHIP CAPACITOR, ALL TYPES EXCEPT TMCTX / TMCJ
Tantalum wire
Supporter
Silver adhesive
Epoxy encapsulation
Leadframe
Solderable cathode termination
Solderable anode termination
Carbon / silver coating
MnO2
Sintered tantalum
MOLDED CHIP CAPACITOR WITH BUILT-IN FUSE, TYPE TMCTX
Sintered tantalum
Carbon / silver coating
Supporter
Tantalum wire
Epoxy encapsulation
Fusible ribbon
Leadframe
Solderable cathode termination
Solderable anode termination
MnO2
Silver adhesive
MOLDED CHIP CAPACITOR 0603 SIZE, TYPE TMCJ
Tantalum wire
Silver adhesive
Epoxy encapsulation
Leadframe
Solderable anode termination
Solderable cathode termination
Carbon / silver coating
Revision: 21-Sep-2020
MnO2
Sintered tantalum
Document Number: 40218
2
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
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Vishay Polytech
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES
TMCS
TMCM
TMCR
TMCU
TMCP
TMCJ
PRODUCT
IMAGE
TYPE
FEATURES
Solid tantalum surface mount chip capacitors, molded case
Standard
industrial grade
Standard
industrial grade
extended range
Low ESR
TEMPERATURE
RANGE
CAPACITANCE
RANGE
Low profile
0805 size
0603 size
-55 °C to +125 °C
0.1 μF to 68 μF
0.47 μF to 470 μF
10 μF to 330 μF
0.1 μF to 220 μF
0.1 μF to 47 μF
0.68 μF to 22 μF
4 V to 35 V
2.5 V to 35 V
7 V to 35 V
2.5 V to 35 V
2.5 V to 25 V
2.5 V to 20 V
VOLTAGE
RANGE
CAPACITANCE
TOLERANCE
± 10 %, ± 20 %
LEAKAGE
CURRENT
DISSIPATION
FACTOR
± 20 %
0.01 CV or 0.5 μA, whichever is greater
4 % to 6 %
4 % to 30 %
6 % to 30 %
4 % to 30 %
6 % to 30 %
20 %
A, B, C, E
A, B, C, E
B, C, E
UA, UB
P
J
CASE SIZES
TERMINATION
FINISH
Case UA: 100 % tin
Case UB: Ni / Pd / Au
100 % tin
100 % tin
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES
TMCTX
TMCH
THC
PRODUCT IMAGE
TYPE
FEATURES
Solid tantalum surface mount chip capacitors, molded case
Built-in fuse
TEMPERATURE RANGE
CAPACITANCE RANGE
VOLTAGE RANGE
High reliability
-55 °C to +125 °C
DISSIPATION FACTOR
CASE SIZES
TERMINATION FINISH
Revision: 21-Sep-2020
-55 °C to +150 °C
1.0 μF to 68 μF
0.1 μF to 100 μF
0.33 μF to 47 μF
10 V to 35 V
4 V to 35 V
10 V to 35 V
CAPACITANCE TOLERANCE
LEAKAGE CURRENT
High reliability,
high temperature +150 °C
± 10 %, ± 20 %
0.01 CV or 0.5 μA,
whichever is greater
0.005 CV or 0.25 μA, whichever is greater
4 % to 6 %
4 % to 8 %
4 % to 6 %
B, C, E, F
A, B, C, E, P
A, B, C, E
100 % tin
Document Number: 40218
3
For technical questions, contact: tantalum@vishay.com
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
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Vishay Polytech
PLASTIC TAPE AND REEL PACKAGING DIMENSIONS in millimeters
E
A
B
C
Label
D
W
CASE CODE
TAPE WIDTH
A+0/-3
B+1/0
C ± 0.2
D ± 0.5
E ± 0.5
W ± 0.3
J, P, A, UA, B, UB
8
C, E, F
12
Ø 180
Ø 60
Ø 13
Ø 21
2.0
9.0
13.0
TAPE SIZE in millimeters
Pocket
Perforation
E
Ø 1.5 + 0.10
F
B
W
A
P1
t
Direction of tape flow
4.0 ± 0.1
2.0 ± 0.1
Inserting direction
Perforation
Marking side (upper)
Mounting terminal side (lower)
Symbol: R
CASE CODE
J
P
A
UA
B
UB
C
E
F
A ± 0.2
1.0
1.4
1.9
1.9
3.1
3.1
3.7
4.8
6.2
Revision: 21-Sep-2020
B ± 0.2
1.8
2.2
3.5
3.5
3.8
3.8
6.3
7.7
7.5
W ± 0.3
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
F ± 0.1
3.5
3.5
3.5
3.5
3.5
3.5
5.5
5.5
5.5
E ± 0.1
1.75
1.75
1.75
1.75
1.75
1.75
1.75
1.75
1.75
P1 ± 0.1
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
tmax.
1.3
1.6
2.5
1.7
2.5
1.7
3.1
3.4
4.1
Document Number: 40218
4
For technical questions, contact: tantalum@vishay.com
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Molded Guide
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Vishay Polytech
RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard
TEMPERATURE (°C)
Tp
TL
Ts max.
TC - 5 °C
tp
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
tL
Preheat area
Ts min.
ts
25
Time 25 °C to peak
TIME (s)
PROFILE FEATURE
Preheat / soak
Temperature min. (Ts min.)
Temperature max. (Ts max.)
Time (ts) from (Ts min. to Ts max.)
Ramp-up
Ramp-up rate (TL to Tp)
Liquidus temperature (TL)
Time (tL) maintained above TL
LEAD (Pb)-FREE ASSEMBLY
130 °C
160 °C
60 s to 120 s
3 °C/s max.
200 °C
50 s max.
Peak package body temperature (Tp) max.
Depends on case size - see table below
Time (tp) within 5 °C of the peak maximum temperature
Ramp-down rate (Tp to TL)
Time from 25 °C to peak temperature
10 s max.
6 °C/s max.
8 min max.
PEAK PACKAGE BODY TEMPERATURE (Tp)
PEAK PACKAGE BODY TEMPERATURE (Tp)
CASE CODE
LEAD (Pb)-FREE PROCESS
J, P, UA, A, UB, B, C
260 °C
E, F
250 °C
PAD DIMENSIONS in millimeters
L
Capacitor
Pattern
Y
CASE /
DIMENSIONS
J
P
UA, A
UB, B
C
E
F
Revision: 21-Sep-2020
CAPACITOR SIZE
L
W
1.6
0.8
2.0
1.25
3.2
1.6
3.5
2.8
5.8
3.2
7.3
4.3
7.3
5.8
X
W
G
Z
G (max.)
0.7
0.5
1.1
1.4
2.9
4.1
4.1
PAD DIMENSIONS
Z (min.)
X (min.)
2.5
1.0
2.6
1.2
3.8
1.5
4.1
2.7
6.9
2.7
8.2
2.9
8.2
4.0
Y (Ref.)
0.9
1.05
1.35
1.35
2.0
2.05
2.05
Document Number: 40218
5
For technical questions, contact: tantalum@vishay.com
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
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Vishay Polytech
GUIDE TO APPLICATION
1.
AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
I R MS =
4.
P
-----------R ESR
where,
P=
2.
At 85 °C: 5 % of the rated voltage or 0.5 V, whichever
is smaller.
power dissipation in W at +25 °C as given in
the tables in the product datasheets.
RESR = the capacitor equivalent series resistance at
the specified frequency.
5.
Mounting Precautions:
5.1
Limit Pressure on Capacitor Installation with
Mounter: pressure must not exceed 4.9 N with a tool
end diameter of 1.5 mm when applied to the
capacitors using an absorber, centering tweezers, or
similar (maximum permitted pressurization time: 5 s).
An excessively low absorber setting position would
result in not only the application of undue force to the
capacitors but capacitor and other component
scattering, circuit board wiring breakage, and / or
cracking as well, particularly when the capacitors are
mounted together with other chips having a height of
1 mm or less.
AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
P
V R MS = Z -----------R ESR
or, from the formula:
V RMS = I RM S x Z
where,
P=
power dissipation in W at +25 °C as given in
the tables in the product datasheets.
RESR = The capacitor equivalent series resistance at
the specified frequency.
Z=
2.1
The capacitor impedance at the specified
frequency.
The tantalum capacitors must be used in such a
condition that the sum of the working voltage and
ripple voltage peak values does not exceed the rated
voltage as shown in figure below.
Reverse Voltage: the capacitors are not intended for
use with reverse voltage applied. If the application of
a reverse voltage is unavoidable, it must not exceed
the following values:
At 25 °C: 10 % of the rated voltage or 1 V, whichever
is smaller.
5.2
Flux Selection
5.2.1 Select a flux that contains a minimum of chlorine and
amine.
5.2.2 After flux use, the chlorine and amine in the flux
remain must be removed.
5.3
Cleaning After Mounting: the following solvents are
usable when cleaning the capacitors after mounting.
Never use a highly active solvent.
• Halogen organic solvent (HCFC225, etc.)
• Alcoholic solvent (IPA, ethanol, etc.)
Voltage
Ripple voltage
Rated voltage
Operating
voltage
Working voltage
Time (s)
3.
Temperature Derating: power dissipation is
affected by the heat sinking capability of the
mounting surface. If these capacitors are to
be operated at temperatures above +25 °C, the
permissible ripple current (or voltage) shall be
calculated using the derating coefficient as shown in
the table below:
MAXIMUM RIPPLE CURRENT TEMPERATURE
DERATING FACTOR
TEMPERATURE
TMC
25 °C
1.0
85 °C
0.9
105 °C
0.65
125 °C
0.4
Revision: 21-Sep-2020
• Petroleum solvent, alkali saponifying agent, water,
etc.
Circuit board cleaning must be conducted at a
temperature of not higher than 50 °C and for an
immersion time of not longer than 30 minutes. When
an ultrasonic cleaning method is used, cleaning must
be conducted at a frequency of 48 kHz or lower, at a
vibrator output of 0.02 W/cm3, at a temperature of
not higher than 40 °C, and for a time of 5 minutes or
shorter.
Notes
• Care must be exercised in cleaning process so that the
mounted capacitor will not come into contact with any
cleaned object or the like or will not get rubbed by a stiff
brush or similar. If such precautions are not taken
particularly when the ultrasonic cleaning method is
employed, terminal breakage may occur
• When performing ultrasonic cleaning under conditions
other than stated above, conduct adequate advance
checkout
Document Number: 40218
6
For technical questions, contact: tantalum@vishay.com
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