TNPU0805500RAZEN00

TNPU e3 www.vishay.com Vishay Draloric Ultra Precision Thin Film Chip Resistors FEATURES • Low temperature coefficients and tight tolerances • Sulfur resistance ASTM B 809 verified according to • Superior moisture resistivity (85 °C; 85 % RH) • Excellent overall stability at different environmental conditions, e.g.  0.05 % (1000 h rated power at 70 °C) • AEC-Q200 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TNPU e3 ultra precision thin film flat chip resistors combine the proven reliability of TNPW e3 products with a most advanced level of precision and stability. This unique combination makes the product perfectly suited for all applications with outstanding requirements towards size, reliable precision and stability. APPLICATIONS • Automotive • Industrial equipment • Test and measuring equipment • Medical equipment • Telecommunication • Instrumentation TECHNICAL SPECIFICATIONS DESCRIPTION Imperial size TNPU0402 e3 TNPU0603 e3 TNPU0805 e3 TNPU1206 e3 0402 0603 0805 1206 Metric size code RR1005M RR1608M RR2012M RR3216M Resistance range 100  to 100 k 100  to 100 k 100  to 332 k 100  to 511 k Resistance tolerance ± 0.1 %; ± 0.05 % ± 0.1 %; ± 0.05 %; ± 0.02 % Temperature coefficient ± 10 ppm/K; ± 5 ppm/K ± 10 ppm/K; ± 5 ppm/K; ± 2 ppm/K Rated dissipation, P70 (1) 0.063 W 0.1 W 0.125 W 0.25 W 50 V 75 V 150 V 200 V 38 K/W 32 K/W 200 V 300 V Operating voltage, Umax. ACRMS/DC Permissible film temperature, F max. (1) 125 °C Operating temperature range Internal thermal resistance (1) -55 °C to 125 °C 90 K/W 63 K/W 75 V 100 V Permissible voltage against ambient (insulation): 1 min; Uins FITobserved  0.1 x 10-9/h Note (1) Please refer to APPLICATION INFORMATION, see below APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 09-Jan-2020 Document Number: 28779 1 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPU e3 www.vishay.com Vishay Draloric MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION OPERATION MODE STANDARD Rated dissipation, P70 TNPU0402 e3 0.063 W TNPU0603 e3 0.100 W TNPU0805 e3 0.125 W TNPU1206 e3 0.250 W Operating temperature range -55 °C to 125 °C Permissible film temperature, F max. 125 °C Max. resistance change at P70 for resistance range, |R/R| after: TNPU0402 e3 100  to 100 k TNPU0603 e3 100  to 100 k TNPU0805 e3 100  to 332 k TNPU1206 e3 100  to 511 k 1000 h  0.05 % 8000 h  0.1 % 225 000 h  0.3 % TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TNPU0402 e3 TCR TOLERANCE ± 10 ppm/K ± 0.05 % ± 5 ppm/K ± 10 ppm/K ± 0.1 % TNPU0603 e3 E-SERIES 100  to 100 k ± 0.05 % ± 0.05 % ± 0.1 % ± 5 ppm/K RESISTANCE ± 0.05 % 100  to 100 k ± 0.02 % ± 0.1 % ± 2 ppm/K ± 0.05 % 500  to 20 k ± 0.02 % ± 10 ppm/K ± 0.05 % ± 5 ppm/K ± 0.05 % ± 0.1 % ± 0.02 % TNPU0805 e3 100  to 332 k E24; E192 100  to 200 k ± 0.1 % ± 2 ppm/K ± 0.05 % 500  to 20 k ± 0.02 % ± 10 ppm/K ± 0.05 % ± 0.1 % ± 5 ppm/K ± 0.05 % ± 0.02 % TNPU1206 e3 100  to 511 k 100  to 200 k ± 0.1 % ± 2 ppm/K ± 0.05 % 500  to 20 k ± 0.02 % Revision: 09-Jan-2020 Document Number: 28779 2 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPU e3 www.vishay.com Vishay Draloric PACKAGING TYPE / SIZE TNPU0402 e3 TNPU0603 e3 TNPU0805 e3 TNPU1206 e3 CODE QUANTITY EP1 = EP 1000 ET2 = EI 5000 E52 = EN 1000 ET1 = EA 5000 PACKAGING STYLE WIDTH PACKAGING DIMENSIONS PITCH 2 mm Paper tape according IEC 60286-3, type 1a 8 mm Ø 180 mm / 7" 4 mm PART NUMBER AND PRODUCT DESCRIPTION Part Number: TNPU12061K32AZEA00 T N P U 1 2 0 6 1 K 3 2 A Z E A 0 TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING TNPU0402 TNPU0603 TNPU0805 TNPU1206 R = decimal K = thousand M = million (4 digits) B = ± 0.1 % A = ± 0.05 % H = ± 0.02 % Y = ± 10 ppm/K Z = ± 5 ppm/K W = ± 2 ppm/K EP EI EN EA 0 Product Description: TNPU1206 1K32 0.05 % T-16 ET1 e3 TNPU1206 1K32 0.05 % T-16 ET1 e3 TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE TNPU0402 TNPU0603 TNPU0805 TNPU1206 1K32 = 1320  ± 0.02 % ± 0.05 % ± 0.1 % T-13 = ± 10 ppm/K T-16 = ± 5 ppm/K T-20 = ± 2 ppm/K EP1 ET2 E52 ET1 e3 = pure tin termination finish Note • Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION Revision: 09-Jan-2020 Document Number: 28779 3 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPU e3 www.vishay.com Vishay Draloric DESCRIPTION MATERIALS Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade ceramic substrate (Al2O3) and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. A further conditioning is applied in order to stabilize the trimming result. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure matte tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a (1). Vishay acknowledges the following systems for the regulation of hazardous substances: ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS compliant, the pure matte tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The immunity of the plating against tin whisker growth has been proven under extensive testing. • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. RELATED PRODUCTS For products with precision specification see the datasheet: • TNPW e3 - High Stability Thin Film Flat Chip Resistors (www.vishay.com/doc?28758) Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 09-Jan-2020 Document Number: 28779 4 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPU e3 www.vishay.com Vishay Draloric Rated Power in % FUNCTIONAL PERFORMANCE 120 100 80 60 40 20 0 -55 -25 0 25 50 75 70 100 Non-Linearity A3 in dB Derating 110 100 125 150 175 Ambient Temperature in °C TNPU1206 e3 TNPU0805 e3 TNPU0603 e3 90 80 70 60 40 100 1K 10K 100K Current Noise in µV/V Non-Linearity 1M Resistance Value in Ω 1 TNPU0805 e3 TNPU0603 e3 0.1 TNPU1206 e3 0.01 100 Current Noise Revision: 09-Jan-2020 1K 10K 100K 1M Resistance Value in Ω Document Number: 28779 5 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPU e3 www.vishay.com Vishay Draloric TEST AND REQUIREMENTS All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: EN 60115-8 (successor of EN 140400), sectional specification Temperature: 15 °C to 35 °C EN 140401-801, detail specification Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) IEC 60068-2-xx, test methods A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). Relative humidity: 25 % to 75 % The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-801. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. The components are mounted for testing on printed circuit boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified. The testing also covers most of the requirements specified by EIA / ECA-703 and JIS-C-5201-1. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (R) Stability for product types: 4.5 4.8 - Resistance - Temperature coefficient TNPU0402 e3 100  to 100 k TNPU0603 e3 100  to 100 k TNPU0805 e3 100  to 332 k TNPU1206 e3 100  to 511 k ± 0.1 %; ± 0.05 %; ± 0.02 % At (20 / -55 / 20) °C and (20 / 125 / 20) °C ± 10 ppm/K; ± 5 ppm/K; ± 2 ppm/K U = P 70 x R or U = Umax.; whichever is the less severe; 4.25.1 - 1.5 h on; 0.5 h off; Endurance at 70 °C 70 °C; 1000 h ± (0.1 % R + 0.02 ) ± (0.05 % R + 0.01 ) - Endurance at upper category temperature 125 °C; 1000 h 125 °C; 8000 h ± (0.1 % R + 0.02 ) 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH ± (0.1 % R + 0.01 ) 4.25.3 4.24 4.23 Climatic sequence: 4.23.2 2 (Bb) Dry heat UCT; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h; > 90 % RH; 5 cycle 4.23.4 1 (Ab) Cold LCT; 2 h 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 24 h; > 90 % RH; 5 cycles 4.23.7 - D.c. load 1 (Aa) Cold U= - ± (0.05 % R + 0.01 ) 70 °C; 8000 h Revision: 09-Jan-2020 ± (0.1 % R + 0.02 ) P 70 x R Umax.; 1 min LCT = -55 °C UCT = 125 °C -55 °C; 2 h ± (0.05 % R + 0.01 ) Document Number: 28779 6 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPU e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (R) Stability for product types: 4.19 100  to 100 k TNPU0603 e3 100  to 100 k TNPU0805 e3 100  to 332 k TNPU1206 e3 100  to 511 k 14 (Na) Rapid change of temperature 30 min at LCT and 30 min at UCT; LCT = -55 °C; UCT = 125 °C; 1000 cycles - Short time overload U = 2.5 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 5s ± (0.05 % R + 0.01 ) Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude  1.5 mm or  200 m/s2; 6 h ± (0.05 % R + 0.01 ) no visible damage 4.13 4.22 TNPU0402 e3 6 (Fc) Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s ± (0.1 % R + 0.01 ) Good tinning ( 95 % covered); no visible damage 4.17 58 (Td) Solderability Solder bath method; SnAg3Cu0,5 or SnAg3,5; non-activated flux (235 ± 3) °C; (2 ± 0.2) s 4.18 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ± (0.02 % R + 0.01) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol +50 °C; method 2 No visible damage RR 1005M and RR 1608M; 9 N 4.32 21 (Ue3) Shear (adhesion) 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.05 % R + 0.01) no visible damage, no open circuit in bent position 4.7 - Voltage proof URMS = Uins; 60 ± 5 s No flashover or breakdown - Flammability IEC 60 695-11-5 (1), needle flame test; 10 s No burning after 30 s 4.39 - Periodic electric overload: Standard operation mode U = 15 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 0.1 s on; 2.5 s off; 1000 cycles ± (0.1 R + 0.02 ) 4.37 67 (Cy) Damp heat, steady state, accelerated (85 ± 5) °C; 56 days (85 ± 5) % RH ± (0.25 R + 0.05 ) Electro static discharge (Human Body Model) IEC 61340-3-1 (1); 3 pos. + 3 neg. (equivalent to MIL-STD-883, method 3015) TNPU0402: 400 V TNPU0603: 1000 V TNPU0805: 1500 V TNPU1206: 2000 V ± (0.5 R + 0.05 ) 4.35 4.38 - RR 2012M and RR 3216M; 45 N No visible damage Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 09-Jan-2020 Document Number: 28779 7 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPU e3 www.vishay.com Vishay Draloric DIMENSIONS L Tt W H Tb DIMENSIONS AND MASS L (mm) W (mm) H (mm) Tt / Tb (mm) MASS (mg) TNPU0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.2 ± 0.10 0.65 TNPU0603 e3 1.6 ± 0.10 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20 2 TNPU0805 e3 2.0 ± 0.15 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20 5.5 TNPU1206 e3 3.2 ± 0.15 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25 10 TYPE / SIZE SOLDER PAD DIMENSIONS b l a RECOMMENDED SOLDER PAD DIMENSIONS REFLOW SOLDERING TYPE / SIZE WAVE SOLDERING a (mm) b (mm) l (mm) a (mm) b (mm) l (mm) TNPU0402 e3 0.4 0.6 0.5 - - - TNPU0603 e3 0.5 0.9 1.0 0.9 0.9 1.0 TNPU0805 e3 0.7 1.3 1.2 0.9 1.3 1.3 TNPU1206 e3 0.9 1.7 2.0 1.1 1.7 2.3 Notes • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1), or in publication IPC-7351 (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 09-Jan-2020 Document Number: 28779 8 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 09-Jul-2021 1 Document Number: 91000