TNPV12061M20BEEN

TNPV e3 www.vishay.com Vishay Draloric High Voltage Thin Film Flat Chip Resistors FEATURES • High operating voltage Umax. up to 1000 V • Low voltage coefficient < 1 ppm/V • Excellent overall stability at different environmental conditions ≤ 0.05 % (1000 h rated power at 70 °C) • Superior moisture resistivity (85 °C; 85 % RH) • AEC-Q200 qualified • Sulfur resistance verified according to ASTM B 809 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TNPV e3 precision thin film flat chip resistors are the perfect choice for most fields of modern electronics where the highest reliability and stability at high operating voltages are of major concern. Typical applications include industrial and automotive inverters, voltage measurement systems as implemented in battery management systems, and test and measuring equipment. APPLICATIONS • Industrial and automotive inverters • Battery management system • Test and measuring equipment TECHNICAL SPECIFICATIONS DESCRIPTION TNPV0805 e3 TNPV1206 e3 0805 1206 1210 (1) Metric size code RR2012M RR3216M RR3225M (1) Resistance range 180 kΩ to 1 MΩ 160 kΩ to 2 MΩ 121 kΩ to 3.01 MΩ Imperial size Resistance tolerance TNPV1210 e3 ± 1 %; ± 0.5 %; ± 0.1 % Temperature coefficient ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K Voltage coefficient |c| < 1 ppm/V Rated dissipation, P70 (2) 0.20 W 0.25 W 0.33 W Maximum operating voltage, Umax. ACRMS or DC (3) 450 V 700 V 1000 V Permissible film temperature, ϑF max. (2) 155 °C Operating temperature range Internal thermal resistance (2) Failure rate: FITobserved -55 °C to 125 °C (155 °C) 38 K/W 32 K/W tbd ≤ 0.1 x 10-9/h Notes (1) Size not specified in EN 140401-801 (2) Please refer to APPLICATION INFORMATION below (3) Application-specific safety requirements may set limitations to the applicability of the specified voltage APPLICATION INFORMATION The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. Please consider the application note “Thermal Management in Surface-Mounted (www.vishay.com/doc?28844) for information on the general nature of thermal resistance. Resistor Applications” These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating voltage, and permissible film temperature. However, the resistance typically increases due to the resistor's film temperature over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and temperature limits in order to maintain a desired stability. Revision: 02-Jul-2021 Document Number: 28881 1 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION PARAMETER VALUE 0.20 W 0.25 W 0.33 W 125 °C 180 kΩ to 1 MΩ 160 kΩ to 2 MΩ 121 kΩ to 3.01 MΩ ≤ 0.05 % ≤ 0.10 % ≤ 0.30 % TNPV0805 e3 TNPV1206 e3 TNPV1210 e3 Rated dissipation, P70 Applied maximum film temperature, ϑF max. TNPV0805 e3 TNPV1206 e3 TNPV1210 e3 1000 h 8000 h 225 000 h Max. resistance change at P70 for resistance range ΔR/R, after: TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR ± 50 ppm/K TOLERANCE ±1% ± 0.5 % ± 0.1 % ± 0.1 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ± 0.1 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ± 0.1 % ± 0.1 % ± 25 ppm/K TNPV0805 e3 ± 15 ppm/K ± 10 ppm/K ± 50 ppm/K ± 25 ppm/K TNPV1206 e3 ± 15 ppm/K ± 10 ppm/K ± 50 ppm/K ± 25 ppm/K TNPV1210 e3 ± 15 ppm/K ± 10 ppm/K RESISTANCE E-SERIES E24; E96 180 kΩ to 1.0 MΩ E24; E192 E24; E96 160 kΩ to 2.0 MΩ E24; E192 E24; E96 121 kΩ to 3.01 MΩ E24; E192 121 kΩ to 2.13 MΩ PACKAGING TYPE / SIZE TNPV0805 e3 TNPV1206 e3 TNPV1210 e3 CODE E52 = EN ET1 = EA ET6 = EC QUANTITY 1000 (1) 5000 20 000 PACKAGING STYLE WIDTH PITCH Paper tape according IEC 60286-3, Type 1a 8 mm 4 mm PACKAGING DIMENSIONS Ø 180 mm / 7" Ø 330 mm / 13" Note (1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 % PART NUMBER AND PRODUCT DESCRIPTION Part Number: TNPV12061M24DEEA T N P V 1 2 0 6 1 M 2 4 D E E A TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL TNPV0805 TNPV1206 TNPV1210 R = decimal K = thousand M = million (4 digits) B = ± 0.1 % D = ± 0.5 % F = ± 1.0 % H = ± 50 ppm/K E = ± 25 ppm/K X = ± 15 ppm/K Y = ± 10 ppm/K EA EC EN Up to 2 digits Blank = standard Product Description: TNPV1206 1M24 0.5 % T-9 ET1 e3 TNPV1206 1M24 0.5 % T-9 ET1 e3 TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE TNPV0805 TNPV1206 TNPV1210 Examples: 1M24 = 1.24 MΩ 560K = 560 kΩ ± 0.1 % ± 0.5 % ± 1.0 % T-2 = ± 50 ppm/K T-9 = ± 25 ppm/K T-10 = ± 15 ppm/K T-13 = ± 10 ppm/K ET1 ET6 E52 e3 = pure tin termination finish Note • Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION Revision: 02-Jul-2021 Document Number: 28881 2 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric DESCRIPTION MATERIALS Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of special metal alloy is deposited on a high grade ceramic substrate (AI2O3) and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. A further conditioning is applied in order to stabilize the trimming result. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure matte tin on nickel plating. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. This includes full screening for the elimination of products with a potential risk of early life failures (feasible for R ≥ 10 Ω). Only accepted products are laid directly into the tape in accordance with IEC 60286-3, Type 1a (1). Vishay acknowledges the following systems for the regulation of hazardous substances: • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS-compliant, the pure matte tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. RELATED PRODUCTS For products with ultra precision specification see the datasheet: • TNPU e3 - Ultra Precision Thin Film Flat Chip Resistors (www.vishay.com/doc?28779) For products with high stability specification see the datasheet: • TNPW e3 - High Stability Thin Film Flat Chip Resistors (www.vishay.com/doc?28758) Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 02-Jul-2021 Document Number: 28881 3 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric Rated Power in % FUNCTIONAL PERFORMANCE 120 100 80 60 40 20 EN 0 -55 -25 0 25 50 75 70 100 125 150 175 Ambient Temperature in °C Derating 1200 1000 800 600 400 TNPV1210 e3 0 100K TNPV1206 e3 160K 180K 200 121K Permissible Operating Voltage in V Note • The solid line is based on IEC/EN reference test conditions which is considered as standard mode. However, above that the maximum permissible film temperature is 155 °C (dashed line) TNPV0805 e3 1M 10M Resistance Value in : Nominal Operating Voltage Note • The permissible operating voltage equals the rated voltage U R = be considered Revision: 02-Jul-2021 P 70 x R . For ambient temperatures above 70 °C power derating must Document Number: 28881 4 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 Permissible Pulse Power P i, max. in W www.vishay.com Vishay Draloric TNPV1210 e3 TNPV1206 e3 TNPV0805 e3 10 1 Conditions: P 0, n  1000 and Ui  Ui, max. 0.1 10µ 100µ 1m 10m 100m 1 10 Pulse Duration ti in s Permissible Pulse Voltage Ui, max. in V Maximum Pulse Load Pi, max. Single Pulses 1000 TNPV1210 e3 Conditions: Pi  Pi, max. 100 10µ 100µ TNPV1206 e3 TNPV0805 e3 1m 10m 100m 1 10 Pulse Duration ti in s Maximum Pulse Voltage Ui, max. Revision: 02-Jul-2021 Document Number: 28881 5 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric TEST AND REQUIREMENTS All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 60115-8 (successor of EN 140400), sectional specification EN 140401-801, detail specification IEC 60068-2-xx, test methods The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-801. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. The testing also covers most of the requirements specified by EIA / ECA-703 and JIS-C-5201-1. The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, where upon the following values are applied: Temperature: 15 °C to 35 °C Relative humidity: 25 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The components are mounted for testing on printed circuit boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (ΔR) Stability for product types: TNPV0805 e3 180 kΩ to 1 MΩ TNPV1206 e3 160 kΩ to 2 MΩ TNPV1210 e3 121 kΩ to 3.01 MΩ 4.5 - Resistance - ± 1 %; ± 0.5 %; ± 0.1 % 4.8.4.2 - Temperature coefficient At (20 / -55 / 20) °C and (20 / 125 / 20) °C ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K 4.25.1 - Endurance at 70 °C U = Umax.; 1.5 h on; 0.5 h off; 70 °C; 1000 h ± (0.05 % R) 70 °C; 8000 h ± (0.1 % R) 125 °C; 1000 h ± (0.05 % R) 155 °C; 1000 h ± (0.1 % R) - Endurance at upper category temperature 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH; U = 0.1 x Umax. ± (0.1 % R) 4.19 14 (Na) Rapid change of temperature 30 min at LCT and 30 min at UCT; LCT = -55 °C; UCT = 125 °C; 1000 cycles ± (0.1 % R) 4.13 - Short time overload U = 2 x permissible operating voltage; 5 s ± (0.05 % R) 4.27 - Single pulse high voltage overload Severity no. 4: U = 2 x Umax.; 10 pulses 10 μs/700 μs ± (0.1 % R) 4.39 - Periodic electric overload U = 2 x Umax.; 0.1 s on; 2.5 s off; 1000 cycles ± (0.1 % R) Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude ≤ 1.5 mm or ≤ 200 m/s2; 7.5 h ± (0.05 % R) 4.25.3 4.24 4.22 6 (Fc) Revision: 02-Jul-2021 Document Number: 28881 6 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (ΔR) Stability for product types: 4.38 - TNPV0805 e3 180 kΩ to 1 MΩ TNPV1206 e3 160 kΩ to 2 MΩ TNPV1210 e3 121 kΩ to 3.01 MΩ IEC 61340-3-1 (1); Electrostatic 3 pos. + 3 neg. discharges; discharge (Human TNPV0805 e3: 4 kV Body Model) TNPV1206 e3, TNPV1210 e3: 6 kV Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s 4.17.2 58 (Td) Solderability Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux (235 ± 3) °C; (2 ± 0.2) s ± (0.5 % R) Good tinning (≥ 95 % covered); no visible damage Solder bath method; (260 ± 5) °C; (10 ± 1) s 4.18.2 58 (Td) Resistance to soldering heat 4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage 4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1, toothbrush No visible damage 4.32 21 (Ue3) Shear (adhesion) 45 N No visible damage 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.05 % R) no visible damage, no open circuit in bent position 4.35 - Flammability IEC 60695-11-5 (1), needle flame test; 10 s No burning after 30 s 67 (Cy) Damp heat, steady state, accelerated (85 ± 2) °C; (85 ± 5) % RH; U = 0.3 x Umax.; 1000 h ± (0.25 % R) 4.37 Reflow method 2 (IR/forced gas convection); (260 ± 5) °C; (10 ± 1) s ± (0.02 % R) Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 02-Jul-2021 Document Number: 28881 7 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric DIMENSIONS L Tt W H Tb DIMENSIONS AND MASS TYPE / SIZE H (mm) L (mm) W (mm) Tt / Tb (mm) MASS (mg) TNPV0805 e3 0.45 ± 0.10 2.0 ± 0.1 1.25 ± 0.15 0.4 ± 0.20 5.5 TNPV1206 e3 0.55 ± 0.10 3.2 + 0.1 / - 0.2 1.6 ± 0.15 0.5 ± 0.25 10 TNPV1210 e3 0.60 ± 0.15 3.2 + 0.1 / - 0.2 2.45 ± 0.15 0.5 ± 0.25 16 SOLDER PAD DIMENSIONS G X Y RECOMMENDED SOLDER PAD DIMENSIONS REFLOW SOLDERING TYPE / SIZE WAVE SOLDERING Y (mm) X (mm) G (mm) Y (mm) X (mm) G (mm) TNPV0805 e3 0.7 1.3 1.2 0.9 1.3 1.3 TNPV1206 e3 0.9 1.7 2.0 1.1 1.7 2.3 TNPV1210 e3 0.9 2.5 2.0 1.1 2.5 2.3 Note • Utilization of the full specified operating voltage may require special considerations on the creepage and clearance distance between conductors at different potential levels Revision: 02-Jul-2021 Document Number: 28881 8 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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