TNPV e3
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Vishay Draloric
High Voltage Thin Film Flat Chip Resistors
FEATURES
• High operating voltage Umax. up to 1000 V
• Low voltage coefficient < 1 ppm/V
• Excellent overall stability at different
environmental conditions ≤ 0.05 %
(1000 h rated power at 70 °C)
• Superior moisture resistivity (85 °C; 85 % RH)
• AEC-Q200 qualified
• Sulfur resistance verified according to ASTM B 809
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TNPV e3 precision thin film flat chip resistors are the perfect
choice for most fields of modern electronics where the
highest reliability and stability at high operating voltages are
of major concern. Typical applications include industrial and
automotive inverters, voltage measurement systems as
implemented in battery management systems, and test and
measuring equipment.
APPLICATIONS
• Industrial and automotive inverters
• Battery management system
• Test and measuring equipment
TECHNICAL SPECIFICATIONS
DESCRIPTION
TNPV0805 e3
TNPV1206 e3
0805
1206
1210 (1)
Metric size code
RR2012M
RR3216M
RR3225M (1)
Resistance range
180 kΩ to 1 MΩ
160 kΩ to 2 MΩ
121 kΩ to 3.01 MΩ
Imperial size
Resistance tolerance
TNPV1210 e3
± 1 %; ± 0.5 %; ± 0.1 %
Temperature coefficient
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
Voltage coefficient |c|
< 1 ppm/V
Rated dissipation, P70 (2)
0.20 W
0.25 W
0.33 W
Maximum operating voltage, Umax. ACRMS or DC (3)
450 V
700 V
1000 V
Permissible film temperature, ϑF max. (2)
155 °C
Operating temperature range
Internal thermal resistance
(2)
Failure rate: FITobserved
-55 °C to 125 °C (155 °C)
38 K/W
32 K/W
tbd
≤ 0.1 x 10-9/h
Notes
(1) Size not specified in EN 140401-801
(2) Please refer to APPLICATION INFORMATION below
(3) Application-specific safety requirements may set limitations to the applicability of the specified voltage
APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow
support of the printed circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is
not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder
joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly.
Please consider the application note “Thermal Management in Surface-Mounted
(www.vishay.com/doc?28844) for information on the general nature of thermal resistance.
Resistor
Applications”
These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating
voltage, and permissible film temperature. However, the resistance typically increases due to the resistor's film temperature
over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit
and thereby limits the functional lifetime. The designer may estimate the performance of the particular resistor application or set
certain load and temperature limits in order to maintain a desired stability.
Revision: 02-Jul-2021
Document Number: 28881
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TNPV e3
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Vishay Draloric
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
PARAMETER
VALUE
0.20 W
0.25 W
0.33 W
125 °C
180 kΩ to 1 MΩ
160 kΩ to 2 MΩ
121 kΩ to 3.01 MΩ
≤ 0.05 %
≤ 0.10 %
≤ 0.30 %
TNPV0805 e3
TNPV1206 e3
TNPV1210 e3
Rated dissipation, P70
Applied maximum film temperature, ϑF max.
TNPV0805 e3
TNPV1206 e3
TNPV1210 e3
1000 h
8000 h
225 000 h
Max. resistance change at P70 for resistance range
ΔR/R, after:
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
TCR
± 50 ppm/K
TOLERANCE
±1%
± 0.5 %
± 0.1 %
± 0.1 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
± 0.1 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
± 0.1 %
± 0.1 %
± 25 ppm/K
TNPV0805 e3
± 15 ppm/K
± 10 ppm/K
± 50 ppm/K
± 25 ppm/K
TNPV1206 e3
± 15 ppm/K
± 10 ppm/K
± 50 ppm/K
± 25 ppm/K
TNPV1210 e3
± 15 ppm/K
± 10 ppm/K
RESISTANCE
E-SERIES
E24; E96
180 kΩ to 1.0 MΩ
E24; E192
E24; E96
160 kΩ to 2.0 MΩ
E24; E192
E24; E96
121 kΩ to 3.01 MΩ
E24; E192
121 kΩ to 2.13 MΩ
PACKAGING
TYPE / SIZE
TNPV0805 e3
TNPV1206 e3
TNPV1210 e3
CODE
E52 = EN
ET1 = EA
ET6 = EC
QUANTITY
1000 (1)
5000
20 000
PACKAGING STYLE
WIDTH
PITCH
Paper tape according
IEC 60286-3, Type 1a
8 mm
4 mm
PACKAGING DIMENSIONS
Ø 180 mm / 7"
Ø 330 mm / 13"
Note
(1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 %
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPV12061M24DEEA
T
N
P
V
1
2
0
6
1
M
2
4
D
E
E
A
TYPE / SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
SPECIAL
TNPV0805
TNPV1206
TNPV1210
R = decimal
K = thousand
M = million
(4 digits)
B = ± 0.1 %
D = ± 0.5 %
F = ± 1.0 %
H = ± 50 ppm/K
E = ± 25 ppm/K
X = ± 15 ppm/K
Y = ± 10 ppm/K
EA
EC
EN
Up to 2 digits
Blank = standard
Product Description: TNPV1206 1M24 0.5 % T-9 ET1 e3
TNPV1206
1M24
0.5 %
T-9
ET1
e3
TYPE / SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
LEAD (Pb)-FREE
TNPV0805
TNPV1206
TNPV1210
Examples:
1M24 = 1.24 MΩ
560K = 560 kΩ
± 0.1 %
± 0.5 %
± 1.0 %
T-2 = ± 50 ppm/K
T-9 = ± 25 ppm/K
T-10 = ± 15 ppm/K
T-13 = ± 10 ppm/K
ET1
ET6
E52
e3 = pure tin
termination finish
Note
• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
Revision: 02-Jul-2021
Document Number: 28881
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TNPV e3
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Vishay Draloric
DESCRIPTION
MATERIALS
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade ceramic substrate (AI2O3) and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
fine trimming the resistive layer without damaging the
ceramics. A further conditioning is applied in order to
stabilize the trimming result. The resistor elements are
covered by a protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure matte tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with a
potential risk of early life failures (feasible for R ≥ 10 Ω). Only
accepted products are laid directly into the tape in
accordance with IEC 60286-3, Type 1a (1).
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure matte tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances
Directive
(RoHS)
with
amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
RELATED PRODUCTS
For products with ultra precision specification see the
datasheet:
• TNPU e3 - Ultra Precision Thin Film Flat Chip Resistors
(www.vishay.com/doc?28779)
For products with high stability specification see the
datasheet:
• TNPW e3 - High Stability Thin Film Flat Chip Resistors
(www.vishay.com/doc?28758)
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
Revision: 02-Jul-2021
Document Number: 28881
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPV e3
www.vishay.com
Vishay Draloric
Rated Power in %
FUNCTIONAL PERFORMANCE
120
100
80
60
40
20
EN
0
-55
-25
0
25
50
75
70
100
125
150
175
Ambient Temperature in °C
Derating
1200
1000
800
600
400
TNPV1210 e3
0
100K
TNPV1206 e3
160K
180K
200
121K
Permissible Operating Voltage in V
Note
• The solid line is based on IEC/EN reference test conditions which is considered as standard mode. However, above that the maximum
permissible film temperature is 155 °C (dashed line)
TNPV0805 e3
1M
10M
Resistance Value in :
Nominal Operating Voltage
Note
• The permissible operating voltage equals the rated voltage U R =
be considered
Revision: 02-Jul-2021
P 70 x R . For ambient temperatures above 70 °C power derating must
Document Number: 28881
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TNPV e3
Permissible Pulse Power P i, max. in W
www.vishay.com
Vishay Draloric
TNPV1210 e3
TNPV1206 e3
TNPV0805 e3
10
1
Conditions:
P 0, n 1000 and Ui Ui, max.
0.1
10µ
100µ
1m
10m
100m
1
10
Pulse Duration ti in s
Permissible Pulse Voltage Ui, max. in V
Maximum Pulse Load Pi, max. Single Pulses
1000
TNPV1210 e3
Conditions:
Pi Pi, max.
100
10µ
100µ
TNPV1206 e3
TNPV0805 e3
1m
10m
100m
1
10
Pulse Duration ti in s
Maximum Pulse Voltage Ui, max.
Revision: 02-Jul-2021
Document Number: 28881
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TNPV e3
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Vishay Draloric
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA / ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, where upon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE CHANGE
(ΔR)
Stability for product types:
TNPV0805 e3
180 kΩ to 1 MΩ
TNPV1206 e3
160 kΩ to 2 MΩ
TNPV1210 e3
121 kΩ to 3.01 MΩ
4.5
-
Resistance
-
± 1 %; ± 0.5 %; ± 0.1 %
4.8.4.2
-
Temperature
coefficient
At (20 / -55 / 20) °C
and (20 / 125 / 20) °C
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
4.25.1
-
Endurance
at 70 °C
U = Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (0.05 % R)
70 °C; 8000 h
± (0.1 % R)
125 °C; 1000 h
± (0.05 % R)
155 °C; 1000 h
± (0.1 % R)
-
Endurance at
upper category
temperature
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH;
U = 0.1 x Umax.
± (0.1 % R)
4.19
14 (Na)
Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = -55 °C; UCT = 125 °C;
1000 cycles
± (0.1 % R)
4.13
-
Short time
overload
U = 2 x permissible
operating voltage; 5 s
± (0.05 % R)
4.27
-
Single pulse
high voltage
overload
Severity no. 4:
U = 2 x Umax.;
10 pulses 10 μs/700 μs
± (0.1 % R)
4.39
-
Periodic electric
overload
U = 2 x Umax.;
0.1 s on; 2.5 s off; 1000 cycles
± (0.1 % R)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or
≤ 200 m/s2; 7.5 h
± (0.05 % R)
4.25.3
4.24
4.22
6 (Fc)
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Document Number: 28881
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TNPV e3
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Vishay Draloric
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE CHANGE
(ΔR)
Stability for product types:
4.38
-
TNPV0805 e3
180 kΩ to 1 MΩ
TNPV1206 e3
160 kΩ to 2 MΩ
TNPV1210 e3
121 kΩ to 3.01 MΩ
IEC 61340-3-1 (1);
Electrostatic
3 pos. + 3 neg. discharges;
discharge (Human
TNPV0805 e3: 4 kV
Body Model)
TNPV1206 e3, TNPV1210 e3: 6 kV
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
4.17.2
58 (Td)
Solderability
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
± (0.5 % R)
Good tinning (≥ 95 % covered);
no visible damage
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
4.18.2
58 (Td)
Resistance to
soldering heat
4.29
45 (XA)
Component
solvent resistance
Isopropyl alcohol; 50 °C;
method 2
No visible damage
4.30
45 (XA)
Solvent
resistance
of marking
Isopropyl alcohol;
50 °C;
method 1, toothbrush
No visible damage
4.32
21 (Ue3)
Shear
(adhesion)
45 N
No visible damage
4.33
21 (Ue1)
Substrate
bending
Depth 2 mm, 3 times
± (0.05 % R)
no visible damage, no open circuit in bent position
4.35
-
Flammability
IEC 60695-11-5 (1),
needle flame test; 10 s
No burning after 30 s
67 (Cy)
Damp heat,
steady state,
accelerated
(85 ± 2) °C;
(85 ± 5) % RH;
U = 0.3 x Umax.;
1000 h
± (0.25 % R)
4.37
Reflow method 2
(IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s
± (0.02 % R)
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 02-Jul-2021
Document Number: 28881
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TNPV e3
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Vishay Draloric
DIMENSIONS
L
Tt
W
H
Tb
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
W
(mm)
Tt / Tb
(mm)
MASS
(mg)
TNPV0805 e3
0.45 ± 0.10
2.0 ± 0.1
1.25 ± 0.15
0.4 ± 0.20
5.5
TNPV1206 e3
0.55 ± 0.10
3.2 + 0.1 / - 0.2
1.6 ± 0.15
0.5 ± 0.25
10
TNPV1210 e3
0.60 ± 0.15
3.2 + 0.1 / - 0.2
2.45 ± 0.15
0.5 ± 0.25
16
SOLDER PAD DIMENSIONS
G
X
Y
RECOMMENDED SOLDER PAD DIMENSIONS
REFLOW SOLDERING
TYPE / SIZE
WAVE SOLDERING
Y
(mm)
X
(mm)
G
(mm)
Y
(mm)
X
(mm)
G
(mm)
TNPV0805 e3
0.7
1.3
1.2
0.9
1.3
1.3
TNPV1206 e3
0.9
1.7
2.0
1.1
1.7
2.3
TNPV1210 e3
0.9
2.5
2.0
1.1
2.5
2.3
Note
• Utilization of the full specified operating voltage may require special considerations on the creepage and clearance distance between
conductors at different potential levels
Revision: 02-Jul-2021
Document Number: 28881
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Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of
any of the products, services or opinions of the corporation, organization or individual associated with the third-party website.
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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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© 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 09-Jul-2021
1
Document Number: 91000