TNPW e3
Vishay
High Stability Thin Film Flat Chip Resistors
FEATURES
• Low temperature coefficient and tight
tolerances (± 0.1 %; ± 10 ppm/K)
• Superior moisture resistivity 0.25 % (85 °C;
56 days; 85 % RH)
• Excellent overall stability at different
environmental conditions 0.05 % (1000 h
rated power at 70 °C)
• AEC-Q200 qualified (sizes 0402 to 1206)
• Waste gas resistant
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
TNPW e3 precision thin film flat chip resistors are the perfect
choice for most fields of modern electronics where highest
reliability and stability is of major concern. Typical
applications include test and measuring equipment, medical
equipment, industrial, and automotive.
APPLICATIONS
•
•
•
•
Test and measuring equipment
Medical equipment
Industrial equipment
Automotive
STANDARD ELECTRICAL SPECIFICATIONS
DESCRIPTION
Metric size
TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 (1) TNPW2010 e3 TNPW2512 e3 (1)
RR 1005M
Resistance range
RR 1608M
RR 2012M
RR 3216M
10 to 100 k 10 to 332 k 10 to 1 M
Resistance tolerance
RR 3225M
RR 5025M
RR 6332M
10 to 2 M 10 to 3.01 M 10 to 4.99 M 10 to 8.87 M
± 1 %; ± 0.5 %; ± 0.1 %
Temperature
coefficent
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
± 50 ppm/K; ± 25 ppm/K
Rated dissipation,
P70 (2)
0.063 W
0.1 W
0.125 W
0.25 W
0.33 W
0.4 W
0.5 W
Operating voltage,
Umax. AC/DC
50 V
75 V
150 V
200 V
200 V
300 V
300 V
140 K/W
110 K/W
Permissible film
temperature, F max.
155 °C
Operating
temperature range
Thermal resistance (3)
Max. resistance
change at P70; R/R:
- 55 °C to 125 °C (155 °C)
870 K/W
550 K/W
440 K/W
10 to 100 k 10 to 332 k 10 to 1 M
220 K/W
170 K/W
10 to 2 M 10 to 3.01 M 10 to 4.99 M 10 to 8.87 M
1000 h
0.05 %
0.05 %
0.05 %
0.05 %
0.05 %
0.05 %
0.05 %
8000 h
0.10 %
0.10 %
0.10 %
0.10 %
0.10 %
0.10 %
0.10 %
225 000 h
0.30 %
0.30 %
0.30 %
0.30 %
0.30 %
0.30 %
0.30 %
Uins 1 min
75 V
100 V
200 V
300 V
300 V
300 V
300 V
Continuous
75 V
75 V
75 V
75 V
75 V
75 V
75 V
0.1 x 10-9/h
0.1 x 10-9/h
0.1 x 10-9/h
0.1 x 10-9/h
0.1 x 10-9/h
0.1 x 10-9/h
0.1 x 10-9/h
Insulation voltage:
Failure rate:
FITobserved
Notes
• TNPW 0402 without marking.
(1) Size not specified in EN 140401-801.
(2) Rated voltage P x R . The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat
flow support of the printed-circuit board (thermal resistance). Using advanced temperature level may require special considerations towards
the choice of circuit board and solder material. The rated dissipation applies only if the permitted film temperature is not exceeded.
(3) Measuring conditions in accordance with EN 140401-801.
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TNPW e3
High Stability Thin Film Flat Chip Resistors
DIMENSIONS
Vishay
DIMENSIONS AND MASS
TYPE
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
L
(mm)
1.0 ± 0.05
1.6 ± 0.10
2.0 ± 0.15
3.2 ± 0.15
3.2 ± 0.15
5.0 ± 0.15
6.3 ± 0.20
W
(mm)
0.5 ± 0.05
0.85 ± 0.10
1.25 ± 0.15
1.6 ± 0.15
2.45 ± 0.15
2.5 ± 0.15
3.1 ± 0.15
H
(mm)
0.35 ± 0.05
0.45 ± 0.10
0.45 ± 0.10
0.55 ± 0.10
0.60 ± 0.15
0.60 ± 0.15
0.60 ± 0.15
T1/T2 MASS
(mm)
(mg)
0.2 ± 0.10 0.65
0.3 ± 0.20
2
0.4 ± 0.20 5.5
0.5 ± 0.25 10
0.5 ± 0.25 16
0.6 ± 0.25 28
0.6 ± 0.25 39
SOLDER PAD DIMENSIONS
TYPE
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
REFLOW SOLDERING
a
b
l
(mm)
(mm)
(mm)
0.4
0.6
0.5
0.5
0.9
1.0
0.7
1.3
1.2
0.9
1.7
2.0
0.9
2.5
2.0
1.0
2.5
3.9
1.0
3.2
5.2
WAVE SOLDERING
a
b
l
(mm)
(mm)
(mm)
0.9
0.9
1.0
0.9
1.3
1.3
1.1
1.7
2.3
1.1
2.5
2.3
1.2
2.5
3.9
1.2
3.2
5.2
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE
TCR
± 50 ppm/K
TNPW0402 e3
± 25 ppm/K
± 15 ppm/K
± 10 ppm/K
± 50 ppm/K
TNPW0603 e3
± 25 ppm/K
± 15 ppm/K
± 10 ppm/K
± 50 ppm/K
TNPW0805 e3
± 25 ppm/K
± 15 ppm/K
± 10 ppm/K
± 50 ppm/K
TNPW1206 e3
± 25 ppm/K
± 15 ppm/K
± 10 ppm/K
TOLERANCE
±1%
± 0.5 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
± 0.1 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
± 0.1 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
± 0.1 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
± 0.1 %
± 0.1 %
RESISTANCE
10R to 100K
10R to 100K
47R to 100K
10R to 100K
10R to 100K
47R to 100K
E-SERIES
24; 96
24; 192
24; 96
24; 192
10R to 332K
24; 96
10R to 332K
24; 192
10R to 332K
24; 96
10R to 332K
24; 192
47R to 332K
10R to 1M0
24; 96
10R to 1M0
24; 192
10R to 1M0
24; 96
10R to 1M0
24; 192
47R to 1M0
10R to 2M0
24; 96
10R to 2M0
24; 192
10R to 2M0
24; 96
10R to 2M0
24; 192
47R to 2M0
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TNPW e3
High Stability Thin Film Flat Chip Resistors
Vishay
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE
TCR
TOLERANCE
±1%
± 0.5 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
± 0.1 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
±1%
± 0.5 %
± 0.1 %
± 50 ppm/K
TNPW1210 e3
± 25 ppm/K
± 15 ppm/K
± 10 ppm/K
± 50 ppm/K
TNPW2010 e3
± 25 ppm/K
± 50 ppm/K
TNPW2512 e3
± 25 ppm/K
RESISTANCE
10R to 3M01
10R to 3M01
47R to 2M13
10R to 3M01
10R to 3M01
E-SERIES
24; 96
24; 192
24; 96
24; 192
47R to 2M13
10R to 4M99
10R to 4M99
47R to 1M0
10R to 4M99
10R to 4M99
47R to 1M0
10R to 8M87
10R to 8M87
47R to 1M0
10R to 8M87
10R to 8M87
47R to 1M0
24; 96
24; 192
24; 96
24; 192
24; 96
24; 192
24; 96
24; 192
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPW12061K32DEEA
T
N
P
W
1
2
0
6
1
K
3
2
D
E
E
A
TYPE/SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
SPECIAL
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
R = Decimal
K = Thousand
M = Million
(4 digits)
B = ± 0.1 %
D = ± 0.5 %
F = ± 1.0 %
H = ± 50 ppm/K
E = ± 25 ppm/K
X = ± 15 ppm/K
Y = ± 10 ppm/K
EA
EC
ED
EG
EN
EY
Up to 2 digits
Blank = Standard
Product Description: TNPW1206 1K32 0.5 % T-9 ET1 e3
TNPW1206
1K32
0.5 %
T-9
ET1
e3
TYPE/SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
LEAD (Pb)-FREE
TNPW0402
TNPW0603
TNPW0805
TNPW1206
TNPW1210
TNPW2010
TNPW2512
Examples:
54R1 = 54.1
1K32 = 1320
± 0.1 %
± 0.5 %
± 1.0 %
T-2 = ± 50 ppm/K
T-9 = ± 25 ppm/K
T-10 = ± 15 ppm/K
T-13 = ± 10 ppm/K
ET1
ET6
ET7
E67
E52
E75
e3 = Pure tin
termination finish
Note
• The product can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION.
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TNPW e3
High Stability Thin Film Flat Chip Resistors
Vishay
PACKAGING
TYPE
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
CODE
QUANTITY
ET7 = ED
10 000
E52 = EN
1000 (1)
ET1 = EA
5000
ET6 = EC
20 000
E75 = EY
1000
E75 = EY
1000
E67 = EG
2000
TNPW2512 e3
CARRIER TAPE
Paper tape
acc. IEC 60286-3
Type I
Blister tape
acc. IEC 60286-3
Type II
WIDTH
8 mm
12 mm
PITCH
REEL DIAMETER
2 mm
180 mm / 7"
4 mm
180 mm / 7"
4 mm
330 mm / 13"
4 mm
180 mm / 7"
Note
(1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 % and temperature coefficient ± 25 ppm/K.
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
AI2O3 ceramic substrate and conditioned to achieve the
desired temperature coefficient. Specially designed inner
contacts are deposited on both sides. A special laser is used
to achieve the target value by smoothly fine trimming the
resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating. The result of the determined production is verified by
an extensive testing procedure on 100 % of the individual
chip resistors. This includes pulse load screening for the
elimination of products with a potential risk of early life
failures according to EN 140401-801, 2.1.2.2. Only accepted
products are laid directly into the tape in accordance with
EN 60286-3.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic soldering
using wave, reflow or vapour phase as shown in
IEC 61760-1. The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system. The resistors are RoHS compliant, the pure
tin plating provides compatibility with lead (Pb)-free and
lead-containing soldering processes. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the GADSL (2) and the
CEFIC-EECA-EICTA (3) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the use of Hazardous
Substances Directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
The resistors are Halogen-free according to JEDEC JS709A
definition.
Solderability is specified for 2 years after production or
re-qualification. The permitted storage time is 20 years.
RELATED PRODUCTS
The TNPW with SnPb termination plating is designed for
those applications, where lead bearing terminations are
mandatory. For ordering TNPW with SnPb terminations
please refer to latest edition of data sheet TNPW, document
number 31006.
TNPS .... ESCC high-reliability thin film chip resistors are the
premium choice for design and manufacture of equipment,
where matured technology and proven reliability are of
utmost importance. They are regularly used in
communication and research satellites and fit equally well
into aircraft and military electronic systems. Approval of the
TNPS .... ESCC products is granted by the European Space
Components Coordination and registered in the ESCC
Qualified Parts List, REP005, document number 28789.
Notes
(2) Global Automotive Declarable Substance List, see www.gadsl.org.
(3) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org issue
environment policy chemicals chemicals for electronics.
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Document Number: 28758
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TNPW e3
High Stability Thin Film Flat Chip Resistors
Vishay
Current Noise in µV/V
Non-Linearity A3 in dB
FUNCTIONAL PERFORMANCE
120
TNPW1206 e3
TNPW0805 e3
TNPW0603 e3
110
100
TNPW0402 e3
90
80
3
2
1
0.5
TNPW0402 e3
TNPW0603 e3
0.3
TNPW0805 e3
0.1
TNPW1206 e3
0.05
0.03
70
60
10
100
10K
100K
Resistance Value in Ω
Non-Linearity
0.01
100
TNPW0603 e3
40
20
10 Ω
0
100K
1M
Resistance Value in Ω
TNPW0603 e3
40
20
10 Ω
0
100 Ω
1 kΩ
100 Ω
1 kΩ
- 20
- 40
- 40
4.75 kΩ
- 60
1
5 10
HF Performance (1)
10 k Ω
50 100
500 1000
Frequency f in MHz
4.75 k Ω
- 60
10 k Ω
- 80
1
5
10
50 100
HF Performance (1)
500 1000
Frequency f in MHz
60
TNPW0805 e3
40
20
10 Ω
0
100 Ω
- 20
[Z]-RO in %
RO
60
Phase Angle in ϑ°
10K
60
60
- 80
1K
Current Noise
[Z]-RO in %
RO
Phase Angle in ϑ°
1K
TNPW0805 e3
40
20
10 Ω
100 Ω
1 kΩ
0
- 20
1 kΩ
- 40
- 40
- 60
- 60
- 80
10 k Ω
1
5 10
HF Performance (1)
50 100
500 1000
Frequency f in MHz
10 k Ω
- 80
1
5
10
HF Performance (1)
50 100
500 1000
Frequency f in MHz
Note
(1) Typical figures. HF-characteristic also depends on termination and circuit design.
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TNPW e3
90
80
0402 0603 0805
1206
1210
2010
2512
70
60
50
Rated Power in %
Temperature Rise in K
High Stability Thin Film Flat Chip Resistors
Vishay
120
100
80
60
40
30
40
20
20
10
EN
0
0.1
0.2
0.3
0.4
0.5
Temperature Rise
Test Voltage in V
0.6
0.7
Power in W
3K
TNPW0805 e3
1K
TNPW0603 e3
100
10
0
25
50
70
75
100
125
150 175
Ambient Temperature in °C
3K
TNPW0805 e3
1K
TNPW0603 e3
100
10R
100R
1K
Single-Pulse High Voltage Overload
Test 1.2/50 µs EN140000 4.27
10K
100K
Resistance Value
in Ω
10
10R
100R
1K
Single-Pulse High Voltage Overload
Test 10/700 µs EN140000 4.27
10K
100K
Resistance Value
in Ω
100 W
100 W
TNPW1206 e3
Permissible pulse power Pi, max.
Permissible pulse power Pi, max.
- 25
Derating
Test Voltage in V
0
0
- 55
TNPW0805 e3
TNPW0603 e3
10 W
1W
Conditions:
P 0, n ≤ 1000 and Ui ≤ Ui, max.
0.1 W
10 µs
100 µs
1 ms
10 ms
Maximum pulse load Pi, max.
for single pulses
100 ms
1s
10 s
Pulse Duration t i
TNPW1206 e3
TNPW0805 e3
10 W
TNPW0603 e3
1W
Conditions:
Pmax. ≤ Pmax. (including derating)
and Ui ≤ Ui, max.
0.1 W
10 µs
100 µs
1 ms
10 ms
Maximum pulse load Pi, max.
for continuous pulses
100 ms
1s
10 s
Pulse Duration t i
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TNPW e3
High Stability Thin Film Flat Chip Resistors
Vishay
Permissible pulse voltage Ui, max.
10 000 V
1000 V
TNPW1206 e3
TNPW0805 e3
TNPW0603 e3
100 V
Conditions:
Pi ≤ Pi, max.
10 V
10 µs
100 µs
1 ms
10 ms
100 ms
Maximum pulse voltage U i, max.
1s
10 s
Pulse Duration t i
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
IEC 60115-1, generic specification (includes tests)
EN 140400, sectional specification (includes schedule for
qualification approval)
EN 140401-801, detail specification (includes schedule for
conformance inspection)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202. The tests are carried out
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid. Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified. The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
4.5
-
Resistance
4.8.4.2
-
Temperature
coefficient
4.25.1
4.25.3
-
-
Endurance at
70 C
Endurance at
upper category
temperature
± 1 %; ± 0.5 %; ± 0.1 %
At (20/- 55/20) C and
(20/125/20) °C
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
U = P 70 x R or
U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (0.05 % R + 0.01 )
70 C; 8000 h
± (0.1 % R + 0.02 )
125 °C; 1000 h
155 °C; 1000 h
± (0.05 % R + 0.01 )
± (0.1 % R + 0.02 )
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TNPW e3
High Stability Thin Film Flat Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
4.24
78 (Cab)
4.23.3
(40±2) °C; 56 days;
(93 ± 3) % RH
± (0.1 % R + 0.01 )
Climatic
sequence:
4.23
4.23.2
Damp heat,
steady state
2 (Bb)
30 (Db)
Dry heat
UCT; 16 h
Damp
55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4
1 (Ab)
Cold
LCT; 2 h
4.23.5
13 (M)
Low air
8.5 kPa; 2 h; 25 ± 10 °C
4.23.6
30 (Db)
Damp heat,
cyclic
55 °C; 5 days;
> 95 to 100 % RH; 5 cycles
4.23.7
-
DC load
1 (Ab)
Cold
- 55 °C; 2 h
±(0.05 % R + 0.01 )
±(0.1 % R + 0.01 )
U=
-
±(0.1 % R + 0.02 )
P 70 x R Umax.; 1 min
LCT = - 55 °C
UCT = 125 °C
4.19
14 (Na)
Rapid change
of temperature
30 min at LCT and
30 min at UCT;
LCT = - 55 °C; UCT = 125 °C;
1000 cycles
4.13
-
Short time
overload
U = 2.5 x P 70 x R or
U = 2 x Umax.; whichever is the
less severe; 5 s
±(0.05 % R + 0.01 )
-
Single pulse
high voltage
overload
Severity no. 4:
U = 10 x P 70 x R or
U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 µs/700 µs
±(0.5 % R + 0.05 )
no visible damage
-
Periodic
electric
overload
15 x P 70 x R or
U = 2 x Umax.;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
±(0.5 % R + 0.05 )
no visible damage
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s2; 7.5 h
±(0.05 % R + 0.01 )
no visible damage
4.27
U=
4.37
4.22
6 (Fc)
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Document Number: 28758
For technical questions, contact: thinfilmchip@vishay.com
Revision: 27-Jun-12
343
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TNPW e3
High Stability Thin Film Flat Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
TNPW2010 e3
TNPW2512 e3
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
4.17.2
58 (Td)
Solderability
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
4.18.2
58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
±(0.02 % R + 0.01)
4.29
45 (XA)
Component
solvent
resistance
Isopropyl alcohol + 50 °C;
method 2
No visible damage
4.32
21 (Ue3)
Shear
(adhesion)
4.33
21 (Ue1)
Substrate
bending
Depth 2 mm, 3 times
±(0.05 % R + 0.01)
no visible damage, no open circuit in bent position
4.7
-
Voltage proof
URMS = Uins; 60 ± 5 s
No flashover or breakdown
4.35
-
Flammability
IEC 60695-11-5,
needle flame test; 10 s
No burning after 30 s
-
Damp heat
(85 ±5) °C; 56 days
(85 ±5) % RH
± (0.25 R + 0.05 )
-
RR 1005M and RR 1608M;
9N
RR 2012M and RR 3216M:
45 N
No visible damage
Document Number: 28758
www.vishay.com
For technical questions, contact: thinfilmchip@vishay.com
344
Revision: 27-Jun-12
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Vishay
Disclaimer
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Revision: 02-Oct-12
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Document Number: 91000