TR8
www.vishay.com
Vishay Sprague
Solid Tantalum Chip Capacitors
MICROTAN® Low ESR, Leadframeless Molded
FEATURES
• Lead (Pb)-free face-down terminations
• 8 mm tape and reel packaging available per
EIA-481 and reeling per IEC 60286-3
7" [178 mm] standard
• Low ESR
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
PERFORMANCE CHARACTERISTICS
Operating Temperature: -55 °C to +125 °C
(above 85 °C, voltage derating is required)
Capacitance Range: 1 μF to 220 μF
Capacitance Tolerance: ± 20 % standard, ± 10 % available
Voltage Range: 2.5 VDC to 25 VDC
Note
• For further characteristics and recommended voltage derating guidelines see “Typical Performance Characteristics”:
www.vishay.com/doc?40169
ORDERING INFORMATION
TR8
M
106
M
6R3
C
2000
TYPE
CASE
CODE
CAPACITANCE
CAPACITANCE
TOLERANCE
DC VOLTAGE RATING
AT +85 °C
TERMINATION
ESR
See Ratings
and Case
Codes table
This is expressed in
picofarads. The first
two digits are the
significant figures. The
third is the number of
zeros to follow.
K = ± 10 %
M = ± 20 %
This is expressed in volts.
To complete the
three-digit block, zeros
precede the voltage
rating. A decimal point
is indicated by an “R”
(6R3 = 6.3 V).
C = 100 % tin
7" [178 mm]
reel
A = gold / 7"
[178 mm] reel
Maximum
100 kHz ESR
in (mΩ)
See note
below.
Note
• We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.
Voltage substitutions will be marked with the higher voltage rating.
Low ESR solid tantalum chip capacitors allow delta ESR of 1.25 times the datasheet limit after mounting
DIMENSIONS in inches [millimeters]
Anode Polarity Bar
Anode Termination
W
C
P1
CASE CODE
M
R
P
Q
A
Revision: 06-Sep-2022
P2
L
0.063 ± 0.008
[1.60 ± 0.2]
0.081 ± 0.006
[2.06 ± 0.15]
0.094 ± 0.004
[2.4 ± 0.1]
0.126 ± 0.008
[3.2 ± 0.2]
0.126 ± 0.008
[3.2 ± 0.2]
Cathode Termination
H
P1
L
W
0.033 ± 0.008
[0.85 ± 0.2]
0.053 ± 0.006
[1.35 ± 0.15]
0.057 ± 0.004
[1.45 ± 0.1]
0.063 ± 0.008
[1.6 ± 0.2]
0.063 ± 0.008
[1.6 ± 0.2]
H (MAX.)
0.035
[0.9]
0.062
[1.57]
0.047
[1.2]
0.039
[1.0]
0.071
[1.8]
P1
0.020 ± 0.004
[0.50 ± 0.1]
0.020 ± 0.004
[0.51 ± 0.1]
0.020 ± 0.004
[0.50 ± 0.1]
0.031 ± 0.004
[0.80 ± 0.1]
0.031 ± 0.004
[0.80 ± 0.1]
P2 (REF.)
0.024
[0.60]
0.043
[1.10]
0.057
[1.40]
0.063
[1.60]
0.063
[1.60]
C
0.024 ± 0.004
[0.60 ± 0.1]
0.035 ± 0.004
[0.90 ± 0.1]
0.035 ± 0.004
[0.90 ± 0.1]
0.047 ± 0.004
[1.20 ± 0.1]
0.047 ± 0.004
[1.20 ± 0.1]
Document Number: 40114
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TR8
www.vishay.com
Vishay Sprague
RATINGS AND CASE CODES
μF
2.5 V
4V
6.3 V
10 V
16 V
1.0
25 V
M
2.2
M
M
4.7
M
M
R
10
M
M
15
M
M
22
M
33
M
47
M
100
P
220
P
M
A
P
P
P/A
P/Q
MARKING
A, Q-Case
Polarity bar
Voltage
code
M-Case
P, R-Case
Polarity bar
EIA capacitance
code (pF)
Polarity bar
J 107
Voltage code
Voltage
code
Capacitance
code
GJ
A
VOLTAGE CODE
CAPACITANCE CODE
V
CODE
CAP, μF
CODE
2.5
e
10
α
4.0
G
33
n
6.3
J
47
s
10
A
68
w
16
C
100
A
20
D
150
E
25
E
220
J
Revision: 06-Sep-2022
Document Number: 40114
2
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TR8
www.vishay.com
Vishay Sprague
STANDARD RATINGS
CAPACITANCE
(μF)
CASE
CODE
PART NUMBER
MAX. DCL
AT +25 °C
(μA)
MAX. DF
AT +25 °C
(%)
MAX. ESR
AT +25 °C
100 kHz
(Ω)
MAX. RIPPLE
100 kHz
IRMS
(A)
1.50
0.129
2.5 VDC AT +85 °C; 1.6 VDC AT +125 °C
220
P
TR8P227M2R5C1500
11.0
30
4 VDC AT +85 °C; 2.7 VDC AT +125 °C
33
M
TR8M336M004C1500
2.6
30
1.50
0.129
47
M
TR8M476M004C1500
3.8
40
1.50
0.129
100
P
TR8P107M004C1500
4.0
30
1.50
0.173
220
P
TR8P227(1)004C1000
17.6
30
1.00
0.212
220
Q
TR8Q227M004C1200
88.0
80
1.20
0.214
6.3 VDC AT +85 °C; 4 VDC AT +125 °C
10
M
TR8M106(1)6R3C2000
0.6
8
2.00
0.112
15
M
TR8M156M6R3C3000
0.9
20
3.00
0.091
22
M
TR8M226M6R3C1500
2.8
20
1.50
0.129
33
M
TR8M336M6R3C1500
4.2
30
1.50
0.129
100
P
TR8P107(1)6R3C1500
6.3
30
1.50
0.173
100
A
TR8A107M6R3C0500
6.3
20
0.50
0.390
10
4.00
0.079
0.079
10 VDC AT +85 °C; 7 VDC AT +125 °C
2.2
M
TR8M225M010C4000
0.5
4.7
M
TR8M475M010C3000
0.5
6
3.00
10
M
TR8M106M010C2000
1.0
20
2.00
0.112
15
M
TR8M156(1)010C3000
1.5
30
3.00
0.091
33
P
TR8P336M010C2500
3.3
20
2.50
0.134
47
P
TR8P476M010C1000
4.7
22
1.00
0.212
16 VDC AT +85 °C; 10 VDC AT +125 °C
1.0
M
TR8M105(1)016C9500
0.5
6
9.50
0.050
2.2
M
TR8M225M016C4000
0.5
10
4.00
0.079
4.7
M
TR8M475M016C4000
0.8
8
4.00
0.079
4.7
M
TR8M475M016C9000
0.8
8
9.00
0.053
10
R
TR8R106M016C5000
1.6
8
5.00
0.095
2.50
0.173
25 VDC AT +85 °C; 17 VDC AT +125 °C
10
A
TR8A106(1)025C2500
2.5
10
Note
• Part number definition:
(1) Tolerance: for 10 % tolerance, specify “K”; for 20 % tolerance, change to “M”
STANDARD PACKAGING QUANTITY
CASE CODE
Revision: 06-Sep-2022
QUANTITY (PCS/REEL)
7" REEL
M
4000
R
2500
P
3000
Q
2500
A
2000
Document Number: 40114
3
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TR8
www.vishay.com
Vishay Sprague
POWER DISSIPATION
CASE CODE
MAXIMUM PERMISSIBLE
POWER DISSIPATION AT +25 °C (W) IN FREE AIR
M
0.025
R
0.045
P
0.045
Q
0.055
A
0.075
PRODUCT INFORMATION
Micro Guide
Pad Dimensions
www.vishay.com/doc?40115
Packaging Dimensions
Moisture Sensitivity
www.vishay.com/doc?40135
Typical Performance Characteristics
www.vishay.com/doc?40169
Solid Tantalum Capacitors (With MnO2 Electrolyte) Voltage Derating
www.vishay.com/doc?40246
SELECTOR GUIDES
Solid Tantalum Selector Guide
www.vishay.com/doc?49053
Solid Tantalum Chip Capacitors
www.vishay.com/doc?40091
FAQ
Frequently Asked Questions
Revision: 06-Sep-2022
www.vishay.com/doc?40110
Document Number: 40114
4
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Micro Guide
www.vishay.com
Vishay Sprague
Guide for Leadframeless Molded Tantalum Capacitors
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today’s surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called “valve”
metals and include titanium, zirconium, niobium, tantalum,
hafnium, and aluminum. Only a few of these permit the
accurate control of oxide thickness by electrochemical
means. Of these, the most valuable for the electronics
industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Revision: 26-Jan-2022
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
COMPARISON OF CAPACITOR DIELECTRIC
CONSTANTS
DIELECTRIC
Air or Vacuum
Paper
e
DIELECTRIC CONSTANT
1.0
2.0 to 6.0
Plastic
2.1 to 6.0
Mineral Oil
2.2 to 2.3
Silicone Oil
2.7 to 2.8
Quartz
3.8 to 4.4
Glass
4.8 to 8.0
Porcelain
5.1 to 5.9
Mica
5.4 to 8.7
Aluminum Oxide
Tantalum Pentoxide
Ceramic
8.4
26
12 to 400K
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
eA
C = ------t
where
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
Document Number: 40115
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Micro Guide
www.vishay.com
Vishay Sprague
SOLID ELECTROLYTE TANTALUM CAPACITORS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the leadframe.
Molded chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. The molding
compound has been selected to meet the requirements of
UL 94 V-0 and outgassing requirements of ASTM E-595.
After assembly, the capacitors are tested and inspected to
assure long life and reliability. It offers excellent reliability
and high stability for consumer and commercial electronics
with the added feature of low cost.
Surface mount designs of “Solid Tantalum” capacitors use
lead frames or lead frameless designs as shown in the
accompanying drawings.
Side Cathode
Termination (-)
Voltage Code
Excluding 0402 (1005 metric)
case size
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
They will typically withstand up to about 10 % of the rated
DC working voltage in a reverse direction. Also important
are their good low temperature performance characteristics
and freedom from corrosive electrolytes.
Vishay Sprague patented the original solid electrolyte
capacitors and was the first to market them in 1956. Vishay
Sprague has the broadest line of tantalum capacitors and
has continued its position of leadership in this field. Data
sheets covering the various types and styles of Vishay
Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
where detailed performance characteristics must be
specified.
Epoxy Resin
Encapsulation
Polarity Bar Marking
Sintered
Tantalum Pellet
Side Anode
Termination (+)
MnO2/Carbon/
Silver Coating
Bottom Cathode
Termination (-)
Silver Adhesive Epoxy
Glass Reinforced
Epoxy Resin
Bottom Anode
Termination (+)
Fig. 1 - Leadframeless Molded Capacitors, All Types
Revision: 26-Jan-2022
Document Number: 40115
2
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Micro Guide
www.vishay.com
Vishay Sprague
SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED
SERIES
TL8
298D
298W
TR8
PRODUCT IMAGE
TYPE
Solid tantalum leadframeless molded chip capacitors
Small size including 0603 and 0402 foot print
FEATURES
Ultra low profile
Industrial grade
Industrial grade,
extended range
Low ESR
TEMPERATURE RANGE
Operating Temperature:
-55 °C to +125 °C
(above 40 °C, voltage
derating is required)
Operating Temperature:
-55 °C to +125 °C
(above 85 °C, voltage
derating is required)
Operating Temperature:
-55 °C to +125 °C
(above 40 °C, voltage
derating is required)
Operating Temperature:
-55 °C to +125 °C
(above 85 °C, voltage
derating is required)
CAPACITANCE RANGE
0.68 μF to 220 μF
0.33 μF to 220 μF
2.2 μF to 220 μF
1 μF to 220 μF
4 V to 25 V
2.5 V to 50 V
4 V to 16 V
2.5 V to 25 V
VOLTAGE RANGE
CAPACITANCE TOLERANCE
DISSIPATION FACTOR
± 20 %, ± 10 %
6 % to 80 %
6 % to 80 %
30 % to 80 %
6 % to 80 %
CASE CODES
W9, A0, B0
K, M, R, P, Q, A, S, B
K, M, Q
M, R, P, Q, A, B
TERMINATION
100 % tin
100 % tin or gold plated
SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED
SERIES
TP8
TM8
DLA 11020
PRODUCT IMAGE
TYPE
Solid tantalum leadframeless molded chip capacitors
Small size including 0603 and 0402 foot print
FEATURES
High performance,
automotive grade
VOLTAGE RANGE
1 μF to 100 μF
0.68 μF to 47 μF
1 μF to 47 μF
6.3 V to 40 V
2 V to 40 V
6.3 V to 40 V
CAPACITANCE TOLERANCE
DISSIPATION FACTOR
High reliability,
DLA approved
Operating Temperature:
-55 °C to +125 °C (above 85 °C, voltage derating is required)
TEMPERATURE RANGE
CAPACITANCE RANGE
High reliability
± 20 %, ± 10 %
6 % to 30 %
6 % to 20 %
6 % to 8 %
CASE CODES
M, W, R, P, A, N, T, B
K, M, G, W, R, P, A, N, T
M, W, R, P, A, N, T
TERMINATION
100 % tin
Tin / lead solder plated, 100 % tin
and gold plated
Tin / lead solder plated
or gold plated
Revision: 26-Jan-2022
Document Number: 40115
3
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Micro Guide
www.vishay.com
Vishay Sprague
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 ± 0.004
[4.0 ± 0.10]
Tape thickness
Deformation
between
embossments
0.014
[0.35]
max.
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Top
cover
tape
B1 (max.)
A0
K0
(6)
10 pitches cumulative
tolerance on tape
± 0.008 [0.200]
Embossment
0.079 ± 0.002
0.069 ± 0.004
[2.0 ± 0.05]
[1.75 ± 0.10]
0.030 [0.75]
min. (3)
B0
W
0.030 [0.75]
min. (4)
Top cover
tape
For tape feeder 0.004 [0.10]
max.
reference only
including draft.
Concentric around B0 (5)
F
20°
Maximum
component
rotation
(Side or front sectional view)
Center lines
of cavity
P1
D1 (min.) for components
(5)
.
0.079 x 0.047 [2.0 x 1.2] and larger
USER DIRECTION
OF FEED
Maximum
cavity size (1)
Cathode (-)
Anode (+)
DIRECTION OF FEED
20° maximum
component rotation
Typical
component
cavity
center line
B0
A0
(Top view)
Typical
component
center line
3.937 [100.0]
0.039 [1.0]
max.
Tape
0.039 [1.0]
max.
0.9843 [250.0]
Camber
(Top view)
Allowable camber to be 0.039/3.937 [1/100]
Non-cumulative over 9.843 [250.0]
Tape and Reel Specifications: all case sizes are
available on plastic embossed tape per EIA-481.
Standard reel diameter is 7" [178 mm].
Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only
(1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
0
0
0
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location shall be applied independent of each other
(6) B dimension is a reference dimension tape feeder clearance only
1
CARRIER TAPE DIMENSIONS in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8
CASE CODE
M (2)
W
R
P
A
A0, Q
B
W9, S
B0
TAPE SIZE
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
12 mm
B1 (MAX.) (1)
0.075 [1.91]
0.112 [2.85]
0.098 [2.46]
0.108 [2.75]
0.153 [3.90]
0.157 [4.0]
0.126 [3.20]
0.181 [4.61]
D1 (MIN.)
0.02 [0.5]
0.039 [1.0]
0.039 [1.0]
0.02 [0.5]
0.039 [1.0]
0.02 [0.5]
0.039 [1.0]
0.029 [0.75]
0.059 [1.5]
F
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.217 [5.5]
K0 (MAX.)
0.043 [1.10]
0.053 [1.35]
0.066 [1.71]
0.054 [1.37]
0.078 [2.00]
0.049 [1.25]
0.087[2.22]
0.045 [1.15]
0.049 [1.25]
P1
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
W
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.472 [12.0]
Notes
For reference only
Packaging of M case in plastic tape is available per request
(1)
(2)
Revision: 26-Jan-2022
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CARRIER TAPE DIMENSIONS in inches [millimeters] FOR TM8
CASE CODE
TAPE SIZE
B1 (MAX.) (1)
D1 (MIN.)
F
K0 (MAX.)
P1
W
M
8 mm
0.075 [1.91]
0.02 [0.5]
0.138 [3.5]
0.043 [1.10]
0.157 [4.0]
0.315 [8.0]
G
8 mm
0.077 [1.96]
0.02 [0.5]
0.138 [3.5]
0.051 [1.30]
0.157 [4.0]
0.315 [8.0]
W
8 mm
0.112 [2.85]
0.039 [1.0]
0.138 [3.5]
0.053 [1.35]
0.157 [4.0]
0.315 [8.0]
R
8 mm
0.098 [2.46]
0.039 [1.0]
0.138 [3.5]
0.066 [1.71]
0.157 [4.0]
0.315 [8.0]
P
8 mm
0.108 [2.75]
0.02 [0.5]
0.138 [3.5]
0.054 [1.37]
0.157 [4.0]
0.315 [8.0]
A
8 mm
0.153 [3.90]
0.039 [1.0]
0.138 [3.5]
0.078 [2.00]
0.157 [4.0]
0.315 [8.0]
N
12 mm
0.154 [3.90]
0.059 [1.5]
0.216 [5.5]
0.051 [1.30]
0.157 [4.0]
0.472 [12.0]
T
12 mm
0.154 [3.90]
0.059 [1.5]
0.216 [5.5]
0.067 [1.70]
0.157 [4.0]
0.472 [12.0]
Notes
(1) For reference only
PAPER TAPE AND REEL PACKAGING in inches [millimeters]
FOR 298D, 298W, TR8, TP8, TL8, TM8 (K case only)
T
P2
Ø D0
P0
[10 pitches cumulative tolerance on tape ± 0.2 mm]
E1
A0
Bottom cover
tape
F
W
B0
E2
Top
cover tape
P1
Cavity center lines
Anode
Cavity size (1)
G
Bottom cover tape
USER FEED DIRECTION
CASE TAPE
SIZE SIZE
A0
B0
D0
P0
P1
P2
E
F
W
T
K
8 mm
0.033 ± 0.002 0.053 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.078 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.03 ± 0.002
[0.85 ± 0.05] [1.35 ± 0.05] [1.5 ± 0.1]
[4.0 ± 0.1]
[2.0 ± 0.1]
[2.0 ± 0.05]
[1.75 ± 0.1]
[3.5 ± 0.05]
[8.0 ± 0.2]
[0.75 ± 0.05]
M
8 mm
0.041 ± 0.002 0.071 ± 0.002 0.06 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.069 ± 0.004 0.0138 ± 0.002 0.315 ± 0.008 0.037 ± 0.002
[1.05 ± 0.05] [1.8 ± 0.05] [1.5 ± 0.1]
[4.0 ± 0.1]
[4.0 ± 0.1]
[2.0 ± 0.05]
[1.75 ± 0.1]
[3.5 ± 0.05]
[8.0 ± 0.2]
[0.95 ± 0.05]
Note
(1) A , B are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
0
0
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation
of the component within the cavity of not more than 20°
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RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.
TP
tp
Max. Ramp Up Rate = 3 °C/s
Max. Ramp Down Rate = 6 °C/s
TL
Temperature
TSmax.
tL
Preheat Area
TSmin.
tS
25
Time 25 °C to Peak
Time
PROFILE FEATURE
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
Temperature min. (TSmin.)
100 °C
150 °C
Temperature max. (TSmax.)
150 °C
200 °C
60 s to 90 s
60 s to 150 s
PREHEAT AND SOAK
Time (tS) from (TSmin. to TSmax.)
RAMP UP
Ramp-up rate (TL to Tp)
3 °C/s maximum
Liquidus temperature (TL)
183 °C
217 °C
Time (tL) maintained above TL
60 s to 150 s
Peak package body temperature (Tp) max.
Time (tp) within 5 °C of the peak max. temperature
235 °C
260 °C
20 s
30 s
RAMP DOWN
Ramp-down rate (Tp to TL)
6 °C/s maximum
Time from 25 °C to peak temperature
6 min maximum
8 min maximum
PAD DIMENSIONS in inches [millimeters]
B
D
C
A
CASE CODE
A (NOM.)
B (MIN.)
C (NOM.)
D (MIN.)
K
0.021 [0.53]
0.016 [0.41]
0.022 [0.55]
0.054 [1.37]
0.080 [2.03]
M, G
0.024 [0.61]
0.027 [0.70]
0.025 [0.64]
R, W9, S
0.035 [0.89]
0.029 [0.74]
0.041 [1.05]
0.099 [2.52]
W
0.035 [0.89]
0.029 [0.74]
0.037 [0.95]
0.095 [2.41]
P
0.035 [0.89]
0.029 [0.74]
0.054 [1.37]
0.112 [2.84]
A, Q, A0
0.047 [1.19]
0.042 [1.06]
0.065 [1.65]
0.148 [3.76]
B, B0
0.094 [2.39]
0.044 [1.11]
0.072 [1.82]
0.159 [4.03]
N, T
0.094 [2.39]
0.044 [1.11]
0.065 [1.65]
0.152 [3.86]
M2
0.315 [8.00]
0.098 [2.50]
0.197 [5.00]
0.394 [10.0]
Revision: 26-Jan-2022
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TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“M” Case
“M” Case
ESR
Impedance
▬▬▬
▬▬▬
1000
1st line
2nd line
2nd line
Impedance / ESR (Ω)
▬▬▬
10
100
2nd line
Impedance / ESR (Ω)
▬▬▬
10000
100
10000
ESR
Impedance
1000
10
1st line
2nd line
100
47 μF, 4 V
100
1
22 μF, 4 V
1
0.1
1
10
100
0.1
10
1000
0.1
1
100
10
1000
Frequency (kHz)
Frequency (kHz)
“M” Case
“M” Case
10000
1000
10000
▬▬▬
ESR
Impedance
▬▬▬
1000
1st line
2nd line
100
100
10
ESR
Impedance
100
1000
1st line
2nd line
▬▬▬
1000
2nd line
Impedance / ESR (Ω)
▬▬▬
2nd line
Impedance / ESR (Ω)
10
10
4.7 μF, 10 V
100
1
10 μF, 6 V
1
0.1
1
10
100
10
1000
0.1
0.1
1
Frequency (kHz)
100
10
1000
Frequency (kHz)
“M” Case
“M” Case
10000
1000
10000
▬▬▬
ESR
Impedance
▬▬▬
1000
1st line
2nd line
100
100
10
ESR
Impedance
1000
1000
1st line
2nd line
▬▬▬
10 000
2nd line
Impedance / ESR (Ω)
▬▬▬
2nd line
Impedance / ESR (Ω)
10
100
1 μF, 16 V
100
10
10 μF, 10 V
1
0.1
1
10
Frequency (kHz)
Revision: 26-Jan-2022
100
10
1000
1
0.1
1
10
100
10
1000
Frequency (kHz)
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TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“P” Case
“P” Case
1000
▬▬▬
100
1st line
2nd line
1000
10
100
1
100
1000
10
100
1
4.7 μF, 25 V
33 μF, 10 V
0.1
0.1
1
10
100
10
1000
0.1
0.1
1
Frequency (kHz)
100
10000
10000
ESR
Impedance
▬▬▬
▬▬▬
1000
1st line
2nd line
10
100
1
1000
1
100
47 μF, 10 V
0.1
10
Frequency (kHz)
Revision: 26-Jan-2022
100
10
1000
ESR
Impedance
1st line
2nd line
▬▬▬
10
2nd line
Impedance / ESR (Ω)
▬▬▬
1
10
1000
“P” Case
“P” Case
2nd line
Impedance / ESR (Ω)
10
Frequency (kHz)
100
0.1
ESR
Impedance
1st line
2nd line
▬▬▬
10000
▬▬▬
ESR
Impedance
2nd line
Impedance / ESR (Ω)
▬▬▬
2nd line
Impedance / ESR (Ω)
1000
10000
220 μF, 4 V
0.1
0.1
1
10
100
10
1000
Frequency (kHz)
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GUIDE TO APPLICATION
1.
AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
I RM S =
2.
P
-----------R ESR
where,
P=
power dissipation in watts at +25 °C (see
paragraph number 5 and the table Power
Dissipation as given in the tables in the
product datasheets)
RESR = the capacitor equivalent series resistance at
the specified frequency
AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
P
V R MS = Z -----------R ESR
or, from the formula:
V RMS = I RM S x Z
2.1
2.2
3.
4.
where,
P=
power dissipation in watts at +25 °C (see
paragraph number 5 and the table Power
Dissipation as given in the tables in the
product datasheets)
RESR = the capacitor equivalent series resistance at
the specified frequency
Z=
the capacitor impedance at the specified
frequency
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+25 °C.
Reverse Voltage: these capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at +25 °C, 5 % of the
DC rating at +25 °C, 5 % of the DC rating at +85 °C,
and 1 % of the DC rating at +125 °C.
Temperature Derating: if these capacitors are to be
operated at temperatures above +25 °C, the
permissible RMS ripple current shall be calculated
using the derating factors as shown:
TEMPERATURE
+25 °C
+85 °C
+125 °C
5.
DERATING FACTOR
1.0
0.9
0.4
Power Dissipation: power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
be established when calculating permissible
operating levels. (Power Dissipation calculated using
+25 °C temperature rise.)
Revision: 26-Jan-2022
6.
Printed Circuit Board Materials: molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7.
Attachment:
7.1
Solder Paste: the recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
7.2
Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 3 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
For details see www.vishay.com/doc?40214.
7.2.1 Backward and Forward Compatibility: capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8.
Cleaning (Flux Removal) After Soldering: molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC / ODS products are not used in the production
of these devices and are not recommended.
Solvents containing methylene chloride or other
epoxy solvents should be avoided since these will
attack the epoxy encapsulation material.
8.1
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
9.
Recommended Mounting Pad Geometries: proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and /
or circuit board design.
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Typical Performance Characteristics
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Solid Tantalum Chip Capacitors MICROTAN®
Leadframeless Molded Capacitors 298D, 298W, TR8 and TL8
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
Category temperature range
Capacitance tolerance
Dissipation factor
ESR
Leakage current
Reverse voltage
Ripple current and
Temperature derating
Maximum working
(operating) voltage
PERFORMANCE CHARACTERISTICS
-55 °C to +85 °C (to +125 °C with voltage derating)
± 20 %, ± 10 %, tested via bridge method, at 25 °C, 120 Hz
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz.
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz.
After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 kΩ
resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in
Standard Ratings table. Note that the leakage current varies with temperature and applied voltage. See
graph below for the appropriate adjustment factor.
Capacitors are capable of withstanding peak voltages in the reverse direction equal to:
10 % of the DC rating at +25 °C
5 % of the DC rating at +85 °C
1 % of the DC rating at +125 °C
Vishay does not recommend intentional or repetitive application of reverse voltage.
For maximum permissible ripple current (IRMS) or/and voltage (VRMS) please refer to product datasheet
and Guide to Application. If capacitors are to be used at temperatures above +25 °C, the permissible
RMS ripple current or voltage shall be calculated using the derating factors:
1.0 at +25 °C
0.9 at +85 °C
0.4 at +125 °C
298W AND TL8
CATEGORY
VOLTAGE (V) AT TEMPERATURE RANGE
RATED VOLTAGE (V)
-55 °C to +40 °C
+40 °C to +85 °C
+85 °C to +125 °C
4.0
2.5
1.6
6.3
4.0
2.5
10
6.3
4.0
16
10
6.3
20
13
8.0
25
17
10
35
23
14
298D AND TR8
CATEGORY VOLTAGE (V) AT TEMPERATURE RANGE
RATED VOLTAGE (V)
-55 °C to +85 °C
+85 °C to +125 °C
2.5
1.7
4.0
2.7
6.3
4.0
10
7.0
16
10
20
13
25
17
35
23
50
33
Notes
• All information presented in this document reflects typical performance characteristics
• For information about recommended voltage derating see technical note: www.vishay.com/doc?40246
• The voltage derating recommended in technical note (taken as ratio between recommended voltage and full rated voltage) should be applied
with respect to maximum allowed working (operating) voltage in given temperature range
• For product series 298W and TL8:
- in the range from -55 °C to +40 °C maximum allowed working (operating) voltage is equal to rated voltage
- in the ranges +40 °C to +85 °C and +85 °C to +125 °C maximum allowed working (operating) voltages (“category” voltages) are shown in
the table above
• For product series 298D and TR8:
- in the range from -55 °C to +85 °C maximum allowed working (operating) voltage is equal to 100 % of rated voltage
- at temperature +125 °C maximum allowed working (operating) voltage (“category” voltage) is equal to 2/3 (or 67 %) of full rated voltage
- in the range +85 °C to 125 °C “category” voltage linearly decreases from 100 % to 67 %
Revision: 07-Sep-2022
Document Number: 40169
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298D / TR8: CATEGORY TO RATED VOLTAGE RATIO VS. OPERATING TEMPERATURE (°C)
Axis Title
10000
1.0
1000
0.8
1st line
2nd line
2nd line
Category to Rated Voltage Ratio
1.2
0.6
100
0.4
0.2
10
0
-55
0
25
55
85
105
125
Temperature (°C)
298W / TL8: CATEGORY TO RATED VOLTAGE RATIO VS. OPERATING TEMPERATURE (°C)
Axis Title
10000
1.0
1000
0.8
1st line
2nd line
2nd line
Category to Rated Voltage Ratio
1.2
0.6
100
0.4
0.2
▬▬▬
▬▬▬
Rated voltage range
Derated voltage range
10
0
-55
0
40
85
125
Temperature (°C)
TYPICAL LEAKAGE CURRENT FACTOR RANGE
Axis Title
10000
100
+125 °C
+85 °C
+55 °C
+25 °C
1
1000
1st line
2nd line
2nd line
Leakage Current Factor
10
0 °C
0.1
-55 °C
100
0.01
10
0.001
0
10
20
30
40
50
60
70
80
90 100
Percent of Rated Voltage
Notes
• At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table
• At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table
• At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table
Revision: 07-Sep-2022
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Typical Performance Characteristics
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ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Thermal shock
At -55 °C/+125 °C, 30 min each, for 5 cycles.
MIL-STD-202 method 107
Capacitance change
Surge voltage
Life test at +85 °C
Humidity test
± 30 %
Dissipation factor
Not to exceed 150 % of initial
Leakage current
Not to exceed 200 % of initial
85 °C, 1000 successive test cycles at 1.3 of category
voltage in series with a 1 kΩ resistor at the rate of
30 s ON, 30 s OFF, MIL-PRF-55365
Capacitance change
± 30 %
Dissipation factor
Not to exceed 150 % of initial
Leakage current
Not to exceed 200 % of initial
1000 h application of category voltage at 85 °C with
a 3 Ω series resistance, MIL-STD-202 method 108
Capacitance change
± 30 %
At 40 °C/90 % RH 500 h, no voltage applied.
MIL-STD-202 method 103
Dissipation factor
Not to exceed 150 % of initial
Leakage current
Not to exceed 200 % of initial
Capacitance change
± 30 %
Dissipation factor
Not to exceed 150 % of initial
Leakage current
Not to exceed 200 % of initial
MECHANICAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Terminal strength/
Shear stress test
Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body.
AEC-Q200-006
There shall be no visual damage when viewed at 20 x
magnification and the component shall meet the original
electrical requirements.
Vibration
MIL-STD-202, method 204, condition D,
10 Hz to 2000 Hz, 20 g peak
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Shock
(specified pulse)
MIL-STD-202, method 213, condition I,
100 g peak
Capacitance change
± 30 %
Dissipation factor
Initial specified value or less
Leakage current
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Resistance
to solder heat
MIL-STD-202, method 210, condition K
Capacitance change
± 30 %
Dissipation factor
Not to exceed 150 % of initial
Leakage current
Not to exceed 200 % of initial
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Solderability
MIL-STD-202, method 208, ANSI/J-STD-002, test B.
Applies only to solder and tin plated terminations.
Does not apply to gold terminations.
All terminations shall exhibit a continuous solder coating
free from defects for a minimum of 95 % of the critical area
of any individual lead.
Resistance to solvents
MIL-STD-202, method 215
Marking has to remain legible, no degradation of
encapsulation material.
Flammability
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %
Note
• All measurements to be performed after 24 h conditioning at room temperature.
Revision: 07-Sep-2022
Document Number: 40169
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Revision: 01-Jan-2022
1
Document Number: 91000
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