TS8514VA

TS8514VA www.vishay.com Vishay Semiconductors Specification of High Power IR Emitting Diode Chip FEATURES • Package type: chip • Package form: single chip • Technology: surface emitter • Dimensions chip (L x W x H in mm): 0.355 x 0.355 x 0.17 • Peak wavelength: λ = 850 nm • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION TS8514VA is a high power infrared, 850 nm surface emitting diode in GaAlAs technology with high radiant power and high speed. Polarity configuration is “n-up”. GENERAL INFORMATION The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is provided for illustration purpose only. Customers are encouraged to perform testing in actual proposed packaged and used conditions. Vishay optoelectronics die products are tested using Vishay optoelectronics based quality assurance procedures and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore sold die may not perform on an equivalent basis to standard package products. PRODUCT SUMMARY COMPONENT φe (mW) ϕ (deg) λp (nm) tr (ns) 30 55 850 10 PACKAGING REMARKS PACKAGE FORM Wafer sawn on foil MOQ: 25 000 pcs Chip TS8514VA Note • Test condition see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE TS8514VA-SF-F Note • MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER SYMBOL VALUE UNIT Forward current IF 100 mA Reverse voltage VR 5 V IFSM 1 A Surge forward current Junction temperature TEST CONDITION tp/T = 0.1, tp = 100 μs Tj 125 °C Operating temperature range Tamb -40 to +100 °C Storage temperature range chip Tstg1 -40 to +120 °C Storage temperature range on foil Tstg2 -40 to +40 °C Rev. 1.5, 02-Mar-16 Document Number: 83407 1 For technical questions, contact: optochipsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TS8514VA www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT IF = 100 mA VF - 1.6 1.9 V IF = 1000 mA VF - 2.6 3.2 V IF = 100 mA φe 30 - - mW IR = 10 μA VR 10 - - V IF = 100 mA ϕ 50 55 60 deg Forward voltage Radiant power (1) Reverse voltage Angle of half intensity Peak wavelength IF = 100 mA λp 830 850 870 nm Spectral bandwidth IF = 1000 mA λ0.5 - 30 - nm Rise time / fall time IF = 100 mA, RL = 50 Ω tr , tf - 10 - ns Note (1) The measurements are based on samples of die which are mounted on a TO-18 gold header without resin coating BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 0° 10° 20° 0.75 0.5 0.25 0 650 750 850 0.9 50° 0.8 60° 70° 0.7 80° 950 0.6 λ - Wavelength (nm) 21776-1 40° 1.0 ϕ - Angular Displacement 30° IF = 30 mA Ie, rel - Relative Radiant Sensitivity Φe, rel - Relative Radiant Power 1 0.4 0.2 0 94 8013 Fig. 1 - Relative Spectral Emission φe rel = f (λ) Fig. 2 - Radiant Characteristics Irel = f(ϕ) MECHANICAL DIMENSIONS SYMBOL MIN. TYP. MAX. UNIT Length of chip edge (x-direction) PARAMETER Lx - 0.355 - mm Length of chip edge (y-direction) Ly - 0.355 - mm Die height H - 0.17 - mm Diameter of bondpad d - 0.100 - mm ADDITIONAL INFORMATION Frontside metallization, cathode Gold alloy Backside metallization, anode Gold alloy Dicing Die bonding technology Sawing Epoxy bonding Note • All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870. The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip backside is performed with stereo microscope with incident light and 40x to 80x magnification. The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure by QM is not installed. Rev. 1.5, 02-Mar-16 Document Number: 83407 2 For technical questions, contact: optochipsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TS8514VA www.vishay.com Vishay Semiconductors HANDLING AND STORAGE CONDITIONS • The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only. It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment. • Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined in MIL-HDBK-263. • Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used. PACKING Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence (humidity and contamination). Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for packing material that is returned unsorted or which we are not obliged to accept. Rev. 1.5, 02-Mar-16 Document Number: 83407 3 For technical questions, contact: optochipsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer  ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Revision: 13-Jun-16 1 Document Number: 91000