TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diode, RoHS-Compliant,
890 nm, Surface Emitter Technology
FEATURES
TSMF1000
TSMF1020
• Package type: surface-mount
• Package form: GW, RGW, yoke
• Dimensions (L x W x H in mm): 2.5 x 2 x 2.7
• Peak wavelength: λp = 890 nm
• High radiant power
• Angle of half intensity: ϕ = ± 11°
TSMF1030
• Low forward voltage
• Suitable for high pulse current operation
16758-5
• Package matches with detector TEMD1000
• Floor life: 168 h, MSL 3, according to J-STD-020
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
APPLICATIONS
TSMF1000 series are infrared, 890 nm emitting diodes
based on surface emitter chip technology with high radiant
power and high speed, molded in clear, untinted plastic
packages (with lens) for surface mounting (SMD).
• IrDA compatible data transmission
• Miniature light barrier
• Photointerrupters
• Optical switch
• Control and drive circuits
• Shaft encoders
PRODUCT SUMMARY
Ie (mW/sr)
ϕ (°)
λP (nm)
tr (ns)
TSMF1000
27
± 11
890
15
TSMF1020
27
± 11
890
15
TSMF1030
27
± 11
890
15
COMPONENT
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
TSMF1000
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Reverse gullwing
TSMF1020
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Gullwing
TSMF1030
Tape and reel
MOQ: 1000 pcs, 1000 pcs/reel
Yoke
Note
• MOQ: minimum order quantity
Rev. 1.9, 22-Oct-2021
Document Number: 81061
1
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VR
5
V
Reverse voltage
Forward current
IF
100
mA
Peak forward current
tp/T = 0.5, tp = 100 μs
IFM
200
mA
Surge forward current
tp = 100 μs
IFSM
1
A
PV
190
mW
°C
Power dissipation
Junction temperature
Tj
100
Ambient temperature range
Tamb
-40 to +85
°C
Storage temperature range
Tstg
-40 to +100
°C
t≤5s
Tsd
260
°C
JESD51
RthJA
250
K/W
Soldering temperature
Thermal resistance junction to ambient
Axis Title
Axis Title
220
10000
110
RthJA = 250 K/W
160
1000
1st line
2nd line
140
120
100
80
100
60
40
100
90
RthJA = 250 K/W
80
1000
70
1st line
2nd line
180
2nd line
IF - Forward Current (mA)
200
2nd line
PV - Power Dissipation (mW)
10000
120
60
50
100
40
30
20
20
10
0
10
0
10
20
30
40
50
60
70
80
10
0
90 100
0
10
TA - Ambient Temperature (°C)
20
30
40
50
60
70
80
90 100
TA - Ambient Temperature (°C)
Fig. 1 - Power Dissipation vs. Ambient Temperature
Fig. 2 - Forward Current vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
IF = 20 mA
VF
-
1.3
1.5
V
IF = 100 mA, tp = 100 μs
VF
-
1.5
-
V
IF = 1 A, tp = 100 μs
VF
-
2.6
-
V
IF = 20 mA
TKVF
-
-1.4
-
mV/K
VR = 0 V, f = 1 MHz, E = 0
Cj
-
56
-
pF
IF = 20 mA
Ie
15
27
40
mW/sr
IF = 100 mA, tp = 100 μs
Ie
-
155
-
mW/sr
IF = 20 mA, tp = 20 ms
φe
-
10
-
mW
IF = 20 mA
TKφe
-
-0.3
-
%/K
ϕ
-
± 11
-
°
Peak wavelength
IF = 20 mA
λp
-
890
-
nm
Forward voltage
Temperature coefficient of VF
Reverse current
Junction capacitance
Radiant intensity
Radiant power
Temperature coefficient of φe
IR
Angle of half intensity
Not designed for reverse operation
UNIT
μA
Spectral bandwidth
IF = 20 mA
Δλ
-
35
-
nm
Temperature coefficient of λp
IF = 20 mA
TKλp
-
0.3
-
nm/K
Rise time
IF = 20 mA
tr
-
15
-
ns
Fall time
IF = 20 mA
tf
-
15
-
ns
Rev. 1.9, 22-Oct-2021
Document Number: 81061
2
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Axis Title
Axis Title
10000
100
10
1
80
IF = 20 mA
70
1000
60
50
40
100
30
20
10
10
0
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
700
750
800
850
950
VF - Forward Voltage (V)
λ - Wavelength (nm)
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 6 - Relative Radiant Intensity vs. Wavelength
Axis Title
Axis0°
Title 10°
10000
1000
1000
10
100
1
2nd line
Ie, rel. - Relative Radiant Intensity
100
20°
10000
30°
tp = 100 μs
1st line
2nd line
2nd line
Ie -FRadiant Intensity (mW/sr)
900
1000
40°
1.0
0.9
50°
0.8
100
60°
70°
0.7
φ - Angular Displacement
2nd line
10
10000
90
1st line
2nd line
1st line
2nd line
1000
2nd line
Ie, rel. - Relative Radiant Intensity (%)
tp = 100 μs
1000
2nd line
I - Forward Current (mA)
100
80°
10
0.1
1
10
100
10
1000
0.6
0.4
0.2
0
IF - Forward Current (mA)
1st line
Fig. 4 - Radiant Intensity vs. Forward Current
Fig. 7 - Relative Radiant Intensity vs. Angular Displacement
Axis Title
10000
IF = 20 mA
1.2
1.0
1000
1st line
2nd line
2nd line
Ie, rel. - Relative Radiant Intensity
1.4
0.8
0.6
100
0.4
0.2
10
0
-60
-40
-20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 5 - Relative Radiant Intensity vs. Ambient Temperature
Rev. 1.9, 22-Oct-2021
Document Number: 81061
3
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
PRECAUTIONS FOR USE
Vishay Semiconductors
REFLOW SOLDER PROFILE
1. Over-Current-Proof
260
Customer must apply resistors for protection, otherwise
slight voltage shift will cause big current change (burn out
will happen).
240
• Storage temperature and rel. humidity conditions are:
5 °C to 35 °C, R.H. 60 %.
• Floor life must not exceed 168 h, according to JEDEC®
level 3, J-STD-020.
Once the package is opened, the products should be
used within a week. Otherwise, they should be kept in a
damp proof box with desiccant.
Considering tape life, we suggest to use products within
one year from production date.
Temperature (°C)
2. Storage
220
200
- 5 °C/s
+ 5 °C/s
180
160
140
120
60 s to 120 s
5s
100
80
60
0
17172
• If opened more than one week in an atmosphere 5 °C to
35 °C, R.H. 60 %, devices should be treated at 60 °C
± 5 °C for 15 h.
20 40 60 80 100 120 140 160 180 200 220
Time (s)
Fig. 8 - Lead Tin (SnPb) Reflow Solder Profile
• If humidity indicator in the package shows pink color
(normal blue), then devices should be treated with the
same conditions as 2.3.
Temperature
1 °C/s to 5 °C/s
Pre-heating
180 °C to 200 °C
260 °C max.
10 s max.
60 s max.
above 220 °C
120 s max.
1 °C/s to 5 °C/s
22566
Time
Fig. 9 - Lead (Pb)-Free Reflow Solder Profile
According to J-STD-020
Rev. 1.9, 22-Oct-2021
Document Number: 81061
4
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: TSMF1000
3.05 ± 0.2
1.4 ± 0.1
2.7 ± 0.2
1.5 ± 0.1
0.15 ± 0.05
Ø 1.9 ± 0.2
4.3 ± 0.2
Technical drawings
according to DIN
specifications
5.8 ± 0.2
2.5 ± 0.2
Solder pad proposal
0.45 ± 0.1
A
0.6 ± 0.2
6.3 ± 0.2
4.27 ± 0.1
0.7 ± 0.2
2 ± 0.2
0.55 ± 0.1
1.1 ± 0.1
C
Drawing-No.: 6.544-5326.03-4
Issue: 1; 15.09.2021
PACKAGE DIMENSIONS in millimeters: TSMF1020
4 ± 0.2
0.83 ± 0.1
Ø 1.9 ± 0.2
Solder pad proposal
Z 10:1
4.64 ± 0.2
0.45 ± 0.1
A
C
3.49 ± 0.1
0.7 ± 0.2
1.1 ± 0.1
Max. 0.13
0.55 ± 0.1
2 ± 0.2
2.5 ± 0.2
0.6 ± 0.2
0.3 ± 0.1
Technical drawings
according to DIN
specifications
1.4 ± 0.1
0.75 ± 0.1
0.15 ± 0.05
2.7 ± 0.2
Z
Drawing-No.: 6.544-5325.03-4
Issue: 1; 15.09.2021
Rev. 1.9, 22-Oct-2021
Document Number: 81061
5
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
Ø 1.9 ± 0.2
2.7 ± 0.2
R0.4 ± 0.1
4.7 ± 0.1
7.4 ± 0.2
1.4 ± 0.1
0.75 ± 0.1
0.15 ± 0.05
PACKAGE DIMENSIONS in millimeters: TSMF1030
Technical drawings
according to DIN
specifications
Solder pad proposal
0.45 ± 0.1
1.1 ± 0.1
5.49 ± 0.1
C
0.6 ± 0.2
A
7.9 ± 0.2
0.7 ± 0.2
0.55 ± 0.1
2 ± 0.2
2.5 ± 0.2
Drawing-No.: 6.544-5329.03-4
Issue: 1; 15.09.2021
REEL DIMENSIONS in millimeters
Unreel direction
X
2.
60.2
±0.5
16 ±0.2
5
178 ±1
.5
±0
0.
5
Tape position
coming out from reel
13
±
X
13.2
±1.5
Label posted here
Leader and trailer tape:
Parts mounted
Direction of pulling out
Empty leader (400 mm, min.)
Drawing-No.: 9.800-5080.01-4
Issue: 3; 11.06.08
Empty trailer (200 mm, min.)
18033
Rev. 1.9, 22-Oct-2021
Document Number: 81061
6
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
TAPING DIMENSIONS in millimeters: TSMF1000
Dimension of tape:
Polarity and orientation in the tape:
4 ± 0.1
3.05 ± 0.1
0.3
2 ± 0.05
12 ± 0.3
5.5 ± 0.05
1.75 ± 0.1
Ø 1.55 ± 0.05
Cathode
Top tape
Feed direction
4 ± 0.1
Push pin through hole
Quantity per reel: 1000 pieces
Drawing-No.: 9.700-5268.02-4
Issue: 1; 28.09.2021
Rev. 1.9, 22-Oct-2021
Technical drawings
according to DIN
specifications
Document Number: 81061
7
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
TAPING DIMENSIONS in millimeters: TSMF1020
Dimension of tape:
Polarity and orientation in the tape:
Ø 1.55 ± 0.05
5.5 ± 0.05
2 ± 0.05
Cathode
Top tape
Feed direction
12 ± 0.3
0.3
1.75 ± 0.1
4 ± 0.1
3.05 ± 0.1
4 ± 0.1
Push pin through hole
Quantity per reel: 1000 pieces
Drawing-No.: 9.700-5269.02-4
Issue: 1; 28.09.2021
Rev. 1.9, 22-Oct-2021
Technical drawings
according to DIN
specifications
Document Number: 81061
8
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMF1000, TSMF1020, TSMF1030
www.vishay.com
Vishay Semiconductors
TAPING DIMENSIONS in millimeters: TSMF1030
Dimension of tape:
Polarity and orientation in the tape:
Ø 1.55 ± 0.05
5.5 ± 0.05
2 ± 0.05
Cathode
Top tape
Feed direction
12 ± 0.3
0.3
1.75 ± 0.1
4 ± 0.1
3.05 ± 0.1
4 ± 0.1
Push pin through hole
Quantity per reel: 1000 pieces
Drawing-No.: 9.700-5270.02-4
Issue: 1; 28.09.2021
Rev. 1.9, 22-Oct-2021
Technical drawings
according to DIN
specifications
Document Number: 81061
9
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
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Revision: 01-Jan-2022
1
Document Number: 91000
