TSML1020

TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors High Power Infrared Emitting Diode, 940 nm, GaAlAs, MQW FEATURES TSML1020 TSML1000 • Package type: surface mount • Package form: GW, RGW, yoke, axial • Dimensions (L x W x H in mm): 2.5 x 2 x 2.7 TSML1030 • Peak wavelength: λp = 940 nm • High radiant power • High radiant intensity • Angle of half intensity: ϕ = ± 12° TSML1040 • Low forward voltage • Suitable for high pulse current operation • Good spectral matching with Si photodetectors 16852 • Versatile terminal configurations • Package matches with detector TEMT1000 • Floor life: 168 h, MSL 3, acc. J-STD-020 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION TSML1000 is an infrared, 940 nm emitting diode in GaAlAs multi quantum well (MQW) technology with high radiant power and high speed molded in a clear, untinted plastic package (with lens) for surface mounting (SMD). APPLICATIONS • For remote control • Punched tape readers • Encoder • Photointerrupters PRODUCT SUMMARY Ie (mW/sr) ϕ (deg) λP (nm) tr (ns) TSML1000 11 ± 12 940 15 TSML1020 11 ± 12 940 15 TSML1030 11 ± 12 940 15 TSML1040 11 ± 12 940 15 COMPONENT Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM TSML1000 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Reverse gullwing TSML1020 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Gullwing TSML1030 Tape and reel MOQ: 1000 pcs, 1000 pcs/reel Yoke TSML1040 Bulk MOQ: 1000 pcs, 1000 pcs/bulk Axial leads Note • MOQ: minimum order quantity Rev. 2.1, 13-Mar-14 Document Number: 81033 1 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1.0 A PV 190 mW Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C Storage temperature range Tstg -40 to +100 °C t≤5s Tsd < 260 °C Soldered on PCB, pad dimensions: 4 mm x 4 mm RthJA 400 °C Soldering temperature Thermal resistance junction/ambient 120 180 100 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 200 140 120 100 80 60 40 20 0 80 60 40 20 0 0 16187 10 20 30 40 50 60 70 80 90 100 0 T amb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 10 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 16188 Fig. 2 - Forward Current vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL TYP. MAX. UNIT IF = 20 mA, tp = 20 ms VF 1.2 1.5 V IF = 1 A, tp = 100 μs VF 2.2 Temperature coefficient of VF IF = 1 mA TKVF -1.8 Reverse current VR = 5 V IR VR = 0 V, f = 1 MHz, E = 0 Cj Radiant intensity IF = 20 mA, tp = 20 ms Ie Radiant power IF = 100 mA, tp = 20 ms φe 40 mW IF = 20 mA TKφe -0.6 %/K ϕ ± 12 deg IF = 100 mA λp 940 nm Forward voltage Junction capacitance Temperature coefficient of φe Angle of half intensity Peak wavelength MIN. V mV/K 10 μA 15 mW/sr 40 3 11 pF Spectral bandwidth IF = 100 mA Δλ 30 nm Temperature coefficient of λp IF = 100 mA TKλp 0.2 nm/K Rise time IF = 100 mA tr 15 ns Fall time IF = 100 mA tf 15 ns Rev. 2.1, 13-Mar-14 Document Number: 81033 2 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 0.1 0.05 1000 0.02 tp / T = 0.01 0.2 0.5 100 1.0 10 0.01 tp = 100 μs Phie - Radiant Power (mW) I F - Forward Current (mA) 10 000 100 10 1 0.1 0.10 1.00 10.00 100.00 1 1000 Fig. 6 - Radiant Power vs. Forward Current 1000 IF - Forward Current (mA) 100 IF - Forward Current (mA) Fig. 3 - Pulse Forward Current vs. Pulse Duration 1.6 1.2 IF = 20 mA Ie rel; Φe rel 100 0.8 10 0.4 tp = 100 µs tp/T= 0.001 0 -10 0 10 1 0 1 2 3 VF - Forward Voltage (V) 21534 94 7993 Fig. 4 - Forward Current vs. Forward Voltage 50 100 140 T amb - Ambient Temperature (°C) Fig. 7 - Relative Radiant Intensity/Power vs. Ambient Temperature 1000 100 Φe rel - Relative Radiant Power (%) Ie - Radiant Intensity (mW/sr) 10 t p - Pulse Duration (ms) 14335 tp = 100 μs 100 10 1 0.1 1 10 100 Fig. 5 - Radiant Intensity vs. Forward Current Rev. 2.1, 13-Mar-14 80 21445 IF = 30 mA 70 60 50 40 30 20 10 0 840 1000 IF - Forward Current (mA) 90 880 920 960 1000 1040 λ - Wavelength (nm) Fig. 8 - Relative Radiant Power vs. Wavelength Document Number: 81033 3 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors REFLOW SOLDER PROFILE 0° 10° 20° 30° 260 220 40° Temperature (°C) Ie rel - Relative Intensity 240 1.0 0.9 50° 0.8 60° 0.7 70° 200 - 5 °C/s + 5 °C/s 180 160 140 120 60 s to 120 s 5s 100 80° 80 0.6 0.4 0.2 0 0.2 0.4 0.6 60 18234 0 17172 20 40 60 80 100 120 140 160 180 200 220 Time (s) Fig. 9 - Relative Radiant Intensity vs. Angular Displacement Fig. 10 - Lead Tin (SnPb) Reflow Solder Profile PRECAUTIONS FOR USE 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (burn out will happen). 1 °C/s to 5 °C/s Pre-heating 180 °C to 200 °C 2. Storage • Storage temperature and rel. humidity conditions are: °C to 35 °C, R.H. 60 %. 5 • Floor life must not exceed 168 h, acc. to JEDEC level 3, J-STD-020. Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with desiccant. Considering tape life, we suggest to use products within one year from production date. 260 °C max. 10 s max. 60 s max. above 220 °C 120 s max. 22566 1 °C/s to 5 °C/s Fig. 11 - Lead (Pb)-Free Reflow Solder Profile acc. J-STD-020 • If opened more than one week in an atmosphere 5 °C to 35 °C, R.H. 60 %, devices should be treated at 60 °C ± 5 °C for 15 h. • If humidity indicator in the package shows pink color (normal blue), then devices should be treated with the same conditions as 2.3. Rev. 2.1, 13-Mar-14 Document Number: 81033 4 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: TSML1000 16159 PACKAGE DIMENSIONS in millimeters: TSML1020 3.8 ± 0.2 2.7 ± 0.2 0.75 0.15 ± 0.05 1.4 0.85 Ø 1.9 ± 0.2 0.3 0.4 0.5 2 ± 0.2 C Rev. 2.1, 13-Mar-14 4.5 ± 0.1 A 2.3 ± 0.1 1 ± 0.1 2.5 ± 0.2 1.1 16160 Document Number: 81033 5 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: TSML1030 16228 PACKAGE DIMENSIONS in millimeters: TSML1040 16760 Rev. 2.1, 13-Mar-14 Document Number: 81033 6 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors 16 ±0.2 Unreel direction X 2. 60.2 ±0.5 REEL DIMENSIONS in millimeters 5 ±0 178 ±1 .5 0. 5 Tape position coming out from reel 13 ± X 13.2 ±1.5 Label posted here Leader and trailer tape: Empty leader (400 mm, min.) Parts mounted Drawing-No.: 9.800-5080.01-4 Direction of pulling out Issue: 3; 11.06.08 Empty trailer (200 mm, min.) 18033 TAPING DIMENSIONS in millimeters: TSML1000 3.05 ± 0.1 Top tape Anode Feed direction 12 ± 0.3 1.75 ± 0.1 2 ± 0.05 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 4 ± 0.1 Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs Rev. 2.1, 13-Mar-14 18030 Document Number: 81033 7 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors TAPING DIMENSIONS in millimeters: TSML1020 3.05 ± 0.1 4 ± 0.1 Feed direction Top tape 12 ± 0.3 2 ± 0.05 1.75 ± 0.1 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 Anode Push pin through hole Quantity per reel: 1000 pcs or 5000 pcs 18031 TAPING DIMENSIONS in millimeters: TSML1030 3.05 ± 0.1 Feed direction Top tape 4 ± 0.1 Anode Push pin through hole Rev. 2.1, 13-Mar-14 12 ± 0.3 1.75 ± 0.1 2 ± 0.05 Ø 1.55 ± 0.05 5.5 ± 0.05 0.3 4 ± 0.1 18032 Quantity per reel: 1000 pcs or 5000 pcs Document Number: 81033 8 For technical questions, contact: emittertechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer  ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 08-Feb-17 1 Document Number: 91000