TSOP753.., TSOP755..
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IR Receiver Modules for Remote Control Systems
FEATURES
• Very low supply current
• Photo detector and preamplifier in one package
• Compatible also with short burst dataformats
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against ambient light
4
3
• Capable of side or top view
2
• Two lenses for high sensitivity and wide
receiving angle
1
• Insensitive to supply voltage ripple and noise
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
20953
LINKS TO ADDITIONAL RESOURCES
MECHANICAL DATA
3D 3D
Product Page
3D Models
Pinning:
Calculators
1, 4 = GND, 2 = VS, 3 = OUT
Marking
DESCRIPTION
ORDERING CODE
The TSOP753.., TSOP755.. series are a two lens
miniaturized receiver module for infrared remote control
systems. One PIN diode per lens and a preamplifier are
assembled on a leadframe, the epoxy lens cap contains an
IR filter.
Taping:
The TSOP753..series is optimized to suppress almost all
spurious pulses from energy saving lamps like CFLs. AGC3
may also suppress some data signals if continuously
transmitted.
BLOCK DIAGRAM
TSOP75...TT - top view taped, 2200 pcs/reel
TSOP75...TR - side view taped, 2300 pcs/reel
2
30 k Ω
VS
3
The TSOP755.. series contain a very robust AGC5. This
series should only be used for critically noisy environments.
Input
This component has not been qualified according to
automotive specifications.
Band
pass
AGC
OUT
Demodulator
1, 4
PIN
GND
Control circuit
20445-1
APPLICATION CIRCUIT
17170-11
R1
IR receiver
VS
Circuit
Transmitter
with
TSALxxxx
+ VS
C1
μC
OUT
GND
VO
GND
R1 and C1 recommended to reduce supply ripple for VS < 2.8 V
Rev. 2.2, 29-Jul-2021
1
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PARTS TABLE
NOISY ENVIRONMENTS
AND SHORT BURSTS (AGC3)
VERY NOISY ENVIRONMENTS
AND SHORT BURSTS (AGC5)
30 kHz
TSOP75330
TSOP75530
33 kHz
TSOP75333
TSOP75533
36 kHz
TSOP75336 (1)
TSOP75536
38 kHz
TSOP75338 (2)(3)(4)(5)
TSOP75538
40 kHz
TSOP75340
TSOP75540
56 kHz
TSOP75356
AGC
Carrier
frequency
TSOP75556
Package
Heimdall
Pinning
1, 4 = GND, 2 = VS, 3 = OUT
Dimensions (mm)
6.8 W x 3.0 H x 3.2 D
Mounting
SMD
Application
Remote control
(1)
Best choice for
Special options
MCIR
(2)
Mitsubishi
(3)
RECS-80 Code
(4)
r-map
(5)
XMP-1, XMP-2
• Extended temperature range: www.vishay.com/doc?82738
• Narrow optical filter: www.vishay.com/doc?81590
• Wide optical flter: www.vishay.com/doc?82726
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VS
-0.3 to +6
V
mA
Supply voltage
Supply current
IS
3
Output voltage
VO
-0.3 to (VS + 0.3)
V
Output current
IO
5
mA
Junction temperature
Storage temperature range
Operating temperature range
Power consumption
Tamb ≤ 85 °C
Tj
100
°C
Tstg
-25 to +85
°C
Tamb
-25 to +85
°C
Ptot
10
mW
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
VS
2.5
-
5.5
V
Ev = 0, VS = 3.3 V
ISD
0.27
0.35
0.45
mA
Ev = 40 klx, sunlight
ISH
-
0.45
-
mA
Ev = 0, test signal see Fig. 1,
IR diode TSAL6200, IF = 50 mA
d
-
24
-
m
Supply voltage
Supply current
Transmission distance
Output voltage low
IOSL = 0.5 mA, Ee = 0.7
mW/m2,
VOSL
-
-
100
mV
Minimum irradiance
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo, test signal see Fig. 1
Ee min.
-
0.12
0.25
mW/m2
Maximum irradiance
tpi - 5/fo < tpo < tpi + 6/fo, test signal see Fig. 1
Ee max.
30
-
-
W/m2
Angle of half transmission distance
ϕ1/2
-
± 50
-
°
Directivity
Rev. 2.2, 29-Jul-2021
test signal see Fig. 1
UNIT
2
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TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Optical Test Signal
(IR diode TSAL6200, IF = 0.4 A, N = 6 pulses, f = f0, t = 10 ms)
0.8
t
tpi *)
T
*) tpi ≥ 6/f0 is recommended for optimal function
Output Signal
VO
1)
2)
VOH
VOL
14337
3/f0 < td < 9/f0
tpi - 4/f0 < tpo < tpi + 6/f0
td 1)
ton
ton, toff - Output Pulse Width (ms)
Ee
0.7
0.6
0.5
toff
0.4
0.3
0.2
0
0.1
t
tpo 2)
λ = 950 nm,
optical test signal, fig. 3
0.1
20744
Ee min./Ee - Relative Responsivity
tpo - Output Pulse Width (ms)
0.35
0.30
Output pulse width
0.20
0.15
Input burst length
0.10
λ = 950 nm,
optical test signal, Fig. 1
10 000
1.0
0.8
0.6
0.4
f = f0 ± 5 %
Δf(3 dB) = f0/10
0.2
0.0
1
10
100
1000
10 000
0.7
Ee - Irradiance (mW/m²)
20760
Ee min. - Threshold Irradiance (mW/m²)
t
600 µs
t = 60 ms
94 8134
Output Signal, (see Fig. 4)
VOH
VOL
t on
t off
1.3
4.0
Correlation with ambient light sources:
3.5 10 W/m² = 1.4 klx (std. illum. A, T = 2855 K)
10 W/m² = 8.2 klx (daylight, T = 5900 K)
3.0
2.5
Wavelength of ambient
illumination: λ = 950 nm
2.0
1.5
1.0
0.5
0
0.01
t
20745
0.1
1
10
100
Ee - Ambient DC Irradiance (W/m²)
Fig. 6 - Sensitivity in Bright Ambient
Fig. 3 - Output Function
Rev. 2.2, 29-Jul-2021
1.1
Fig. 5 - Frequency Dependence of Responsivity
Optical Test Signal
600 µs
0.9
f/f0 - Relative Frequency
16925
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
VO
1000
1.2
0
0.1
Ee
100
Fig. 4 - Output Pulse Diagram
0.40
0.05
10
Ee - Irradiance (mW/m²)
Fig. 1 - Output Active Low
0.25
1
3
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Axis Title
1.0
2.5
f = f0
f = 30 kHz
f = 10 kHz
f = 100 Hz
2.0
1.5
1.0
0.5
0
1
10
100
1000
10000
0.9
0.8
0.7
1000
0.6
1st line
2nd line
2nd line
S(λ)rel. - Relative Spectral Sensitivity
Ee min. - Threshold Irradiance (mW/m2)
3.0
0.5
0.4
100
0.3
0.2
0.1
0
750
ΔVS RMS - AC Voltage on DC Supply Voltage (mV)
850
950
1050
10
1150
λ - Wavelength (nm)
21425
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
Axis0°
Title 10°
20°
30°
1.0
f = 38 kHz, Ee = 2 mW/m²
0.8
0.7
40°
1.0
0.5
0.4
0.3
0.9
50°
0.8
60°
TSOP753..
0.2
70°
0.7
0.1
TSOP755..
0
0
22183
20
40
60
80
100
80°
120
0.6
Burst Length (number of cycles/burst)
0.4
0.2
0
0.2
0.4
0.6
drel. - Relative Transmission Distance
21427
Fig. 11 - Horizontal Directivity
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
Axis0°
Title 10°
20°
30°
0.30
0.25
40°
1.0
0.15
0.10
0.9
50°
0.8
2nd line
2nd line
0.20
2nd line
Vertical
Ee min. - Threshold Irradiance (mW/m2)
2nd line
2nd line
0.6
2nd line
Horizontal
Max. Envelope Duty Cycle
0.9
60°
0.05
70°
0.7
80°
0
-30
-10
10
30
50
70
90
0.6
Tamb - Ambient Temperature (°C)
21428
0.2
0
0.2
0.4
0.6
Fig. 12 - Vertical Directivity
Fig. 9 - Sensitivity vs. Ambient Temperature
Rev. 2.2, 29-Jul-2021
0.4
drel. - Relative Transmission Distance
4
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Ee min. - Sensitivity (mW/m2)
0.30
0.25
0.20
0.15
0.10
0.05
0.00
1
2
3
4
5
VS - Supply Voltage (V)
Fig. 13 - Sensitivity vs. Supply Voltage
Rev. 2.2, 29-Jul-2021
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SUITABLE DATA FORMAT
Axis Title
The TSOP753.., TSOP755.. series are designed to suppress
spurious output pulses due to noise or disturbance signals.
Data and disturbance signals can be distinguished by the
devices according to carrier frequency, burst length and
envelope duty cycle. The data signal should be close to the
band-pass center frequency (e.g. 38 kHz) and fulfill the
conditions in the table below.
10000
7
When a data signal is applied to the TSOP753.. and
TSOP755.. in the presence of a disturbance signal, the
sensitivity of the receiver is reduced to insure that no
spurious pulses are present at the output. Some examples
of disturbance signals which are suppressed are:
5
1000
1st line
2nd line
2nd line
IR Signal Amplitude
6
4
3
100
2
1
• DC light (e.g. from tungsten bulb or sunlight)
10
0
0
• Continuous signals at any frequency
5
15
20
Time (ms)
16920
• Strongly or weakly modulated pattern from fluorescent
lamps with electronic ballasts (see Fig. 14 or Fig. 15)
10
Fig. 14 - IR Disturbance from Fluorescent Lamp
With Low Modulation
Axis Title
10000
40
1000
0
1st line
2nd line
2nd line
IR Signal Amplitude
20
-20
100
-40
10
-60
0
5
10
15
20
Time (ms)
16921
Fig. 15 - IR Disturbance from Fluorescent Lamp
With High Modulation
TSOP753..
TSOP755..
Minimum burst length
6 cycles/burst
6 cycles/burst
After each burst of length
a minimum gap time is required of
6 to 35 cycles
≥ 10 cycles
6 to 24 cycles
≥ 10 cycles
35 cycles
24 cycles
> 4 x burst length
> 25 ms
2000
2000
For bursts greater than
a minimum gap time in the data stream is
needed of
Maximum number of continuous short
bursts/second
MCIR code
Preferred
Yes
XMP-1, XMP-2 code
Preferred
Yes
Mild and complex disturbance
patterns are suppressed (example:
signal pattern of Fig. 14 and Fig. 15)
Critical disturbance
patterns are suppressed,
e.g. highly dimmed LCDs
Suppression of interference from fluorescent
lamps
Note
• For data formats with long bursts please see the datasheet for TSOP752.., TSOP754..
Rev. 2.2, 29-Jul-2021
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PACKAGE DIMENSIONS in millimeters
6.8
6.6 ± 0.1
3.2
(3.4)
Mold residue
Mold residue
2.5
(1.8)
1.2 ± 0.2
3
0.8
2.2
(0.635)
(1)
1.27
(3 x)
0.5 ± 0.1
(4 x)
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
Marking area
2.2
Not indicated tolerances ± 0.15
(1.65)
Tool separation line
(2.2)
Proposed pad layout
from component side
(for reference only)
3 x 1.27 = 3.81
1.27
Pick and place area
1.8
(R1.3)
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
0.8
22608
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 2.2, 29-Jul-2021
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
Axis Title
300
10000
max. 260 °C
255 °C
240 °C
2nd line
Temperature (°C)
250
245 °C
217 °C
1000
200
max. 20 s
150
max. 120 s
max. 100 s
100
100
Max. ramp up 3 °C/s
50
Max. ramp down 6 °C/s
Max. 2 cycles allowed
10
0
0
50
100
150
200
250
300
Time (s)
19800
0.3
3.6
TAPING VERSION TSOP..TR DIMENSIONS in millimeters
16
7.5
1.75
1.34 ref.
Ø 1.5
4
Direction of feed
8
2
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5337.01-4
Issue: 2; 06.10.15
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3.65
0.3
TAPING VERSION TSOP..TT DIMENSIONS in millimeters
16
1.75
7.5
Ø 1.5
4
8
Direction of feed
2
Ø 1.5
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5338.01-4
Issue: 4; 12.06.13
Rev. 2.2, 29-Jul-2021
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REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
According to DIN EN 60286-3
0.1 N to 1.3 N
300 ± 10 mm/min.
165° to 180° peel angle
Rev. 2.2, 29-Jul-2021
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OUTER PACKAGING
The sealed reel is packed into a pizza box.
CARTON BOX DIMENSIONS in millimeters
Length
Thickness
Width
22127
Pizza box (SMD and heimdall)
(taping in reels)
THICKNESS
WIDTH
LENGTH
50
340
340
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final
packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to
warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
INO
8
Item-number
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
MIXED CODE
-
xxxxxxx+
Company logo
TYPE
LENGTH
LOT-/serial-number
Mixed code indicator
Origin
LONG BAR CODE TOP
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
SHORT BAR CODE BOTTOM
TYPE
LENGTH
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
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DRY PACKING
ESD PRECAUTION
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
Aluminum bag
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
Label
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Reel
BAR CODE PRODUCT LABEL (example)
15973
FINAL PACKING
The sealed reel is packed into a cardboard box.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
22178
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
LEVEL
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
22522
EIA JEDEC standard J-STD-020 level 4 label is included
on all dry bags
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of
any of the products, services or opinions of the corporation, organization or individual associated with the third-party website.
Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website
or for that of subsequent links.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
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Revision: 01-Jan-2022
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Document Number: 91000