TSSP93038DF1PZA
www.vishay.com
Vishay Semiconductors
IR Sensor Module for Reflective Sensor, Light Barrier,
and Fast Proximity Applications
DESCRIPTION
The TSSP93038DF1PZA device is the latest generation of
compact infrared detector module for presence, proximity,
or light curtain applications. They provide an active low
output in response to infrared bursts at 940 nm. The
frequency of the burst should correspond to the carrier
frequency shown in the parts table for presence sensing.
This component has not been qualified according to
automotive specifications.
FEATURES
• Constant sensitivity in dark and bright ambient,
up to direct sunlight level
• Presence sensor: up to 2 m distance, find more
info at: www.vishay.com/doc?49009
• Light barrier: up to 12 m distance, TSAL6200
with IF = 50 mA, find more info at:
www.vishay.com/doc?49650
• Fast proximity: up to 2 m range at 5 ms
response
time,
find
more
info
at:
www.vishay.com/doc?82746
• Supply voltage: 2.0 V to 3.6 V
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
22911
LINKS TO ADDITIONAL RESOURCES
DESIGN SUPPORT TOOLS
Product Page
Marking
Packages
• 3D models
• Window size calculator
APPLICATIONS
• Reflective sensors for hand dryers, towel or soap
dispensers, water faucets, toilet flush
• Vending machine fall detection
• Security and pet gates
• Person or object vicinity switch
• Fast proximity sensors for toys, robotics, drones, and
other consumer and industrial uses
BLOCK DIAGRAM
16833_8
3
33 kΩ
VS
1
Input
AMP
Band
pass
Demodulator
OUT
2
PIN
Rev. 1.1, 21-Mar-2023
1
GND
Document Number: 82909
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MECHANICAL DATA
PRESENCE SENSING
Pinning for TSSP93...:
1 = OUT, 2 = GND, 3 = VS
+3 V
IR emitter
Envelope
signal
38 kHz
+3 V
Out to
μC
1
2
3
23197
PARTS TABLE
Carrier frequency
38 kHz
TSSP93038DF1PZA
Package
Minimold
Pinning
1 = OUT, 2 = GND, 3 = VS
Dimensions (mm)
5.4 W x 6.35 H x 4.9 D
Mounting
Leaded
Application
Presence sensors, fast proximity sensors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VALUE
Supply voltage (pin 3)
TEST CONDITION
VS
-0.3 to +3.6
V
Supply current (pin 3)
IS
5
mA
Output voltage (pin 1)
Voltage at output to supply
UNIT
VO
-0.3 to +3.6
V
VS - VO
-0.3 to (VS + 0.3)
V
mA
Output current (pin 1)
IO
5
Junction temperature
Tj
100
°C
Tstg
-25 to +85
°C
Tamb
-25 to +85
°C
Ptot
10
mW
Storage temperature range
Operating temperature range
Power consumption
Tamb ≤ 85 °C
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
Rev. 1.1, 21-Mar-2023
2
Document Number: 82909
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Vishay Semiconductors
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Supply current (pin 3)
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
Ev = 0, VS = 3.3 V
ISD
0.25
0.37
0.45
mA
Ev = 40 klx, sunlight
ISH
-
0.8
-
mA
VS
2.0
-
3.6
V
VOSL
-
-
100
mV
Supply voltage
mW/m2,
IOSL = 0.5 mA, Ee = 2
test signal see Fig. 1
Output voltage low (pin 1)
Minimum irradiance
Pulse width tolerance:
tpi - 5/f0 < tpo < tpi + 6/f0,
test signal see Fig. 1
Ee min.
0.9
1.3
1.8
mW/m2
Maximum irradiance
tpi - 5/f0 < tpo < tpi + 6/f0,
test signal see Fig. 1
Ee max.
30
-
-
W/m2
Directivity
Angle of half transmission
distance
ϕ1/2
-
± 45
-
°
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Ee
Optical Test Signal
Optical Test Signal
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, T = 10 ms)
t
600 µs
tpi (1)
(1)
VO
(2)
VOH
VOL
(3)
t = 60 ms
T
tpi ≥ 10/f0 is recommended for optimal function
Output Signal
VOH
VOL
tpo (3)
t
t on
Fig. 1 - Output Delay and Pulse Width
2nd line
ton, toff - Output Pulse Width (ms)
1000
1st line
2nd line
2nd line
tpo - Output Pulse Width (ms)
0.9
0.8
Input burst length
100
0.6
λ = 950 nm,
optical test signal, Fig. 1
0.4
10
1000
10000
0.8
Output pulse width
0.1
10
100 000
ton
0.7
0.6
1000
0.5
toff
0.4
0.3
100
0.2
0.1
λ = 950 nm,
optical test signal, Fig. 3
0
0.1
1
10
100
1000
Ee - Irradiance (mW/m2)
Ee - Irradiance (mW/m2)
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
Fig. 4 - Output Pulse Diagram
Rev. 1.1, 21-Mar-2023
t
Axis Title
10000
0.5
t off
Fig. 3 - Test Signal
Axis Title
1.0
0.7
94 8134
Output Signal, (see Fig. 4)
VO
16110-13
7/f0 < td < 15/f0
tpi - 5/f0 < tpo < tpi + 6/f0
td (2)
t
600 µs
1st line
2nd line
Ee
3
10
10 000
Document Number: 82909
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Axis0°
Title 10°
20°
30°
Ee min./Ee - Relative Responsivity
1.2
1.0
2nd line
2nd line
0.6
0.9
50°
0.8
0.4
2nd line
2nd line
40°
1.0
0.8
60°
f = f0 ± 5 %
Δf(3 dB) = f0/10
0.2
70°
0.7
80°
0.0
0.7
0.9
1.1
1.3
0.6
0.4
0.2
0.2
0.4
drel. - Relative Transmission Distance
Fig. 5 - Frequency Dependence of Responsivity
Fig. 8 - Directivity
2.0
1.9
1.8
1.7
1000
1st line
2nd line
1.6
1.5
1.4
100
1.3
1.2
1.1
10
1.0
-10
10
30
50
70
10000
1.9
1.8
1.7
1000
1.6
1st line
2nd line
2nd line
Ee min. - Threshold Irradiance (mW/m2)
10000
-30
0.6
Axis Title
Axis Title
2.0
2nd line
Ee min. - Threshold Irradiance (mW/m2)
0
f/f0 - Relative Frequency
16925
1.5
1.4
100
1.3
1.2
1.1
10
1.0
1
90
2
3
Tamb - Ambient Temperature (°C)
VS - Supply Voltage (V)
Fig. 6 - Sensitivity vs. Ambient Temperature
Fig. 9 - Sensitivity vs. Supply Voltage
4
Axis Title
10000
0.9
0.8
0.7
1000
0.6
1st line
2nd line
2nd line
S(λ)rel. - Relative Spectral Sensitivity
1.0
0.5
0.4
100
0.3
0.2
0.1
0
750
850
950
1050
10
1150
λ - Wavelength (nm)
Fig. 7 - Relative Spectral Sensitivity vs. Wavelength
Rev. 1.1, 21-Mar-2023
4
Document Number: 82909
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TSSP93038DF1PZA
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Vishay Semiconductors
The typical application of these devices is a reflective or
beam break sensor with active low “detect” or “no detect”
information contained in its output.
Example for a sensor hardware:
IR detector
Separation to avoid
crosstalk by stray light inside
the housing
IR emitter
There should be no common window in front of the emitter
and detector in order to avoid crosstalk via guided light
through the window.
PACKAGE DIMENSIONS in millimeters
5.4
5
2.25
6.35
Marking area
11.4 `
± 0.3
0.3
c
(3 x)
0.85 max.
2
0.1
3
(3 x)
0.6 ± 0.1
(3 x) 0.3 ± 0.1
2.54 nom.
2.25 ± 0.3
1
0.95
3.4 ± 0.3
( 5.05)
7.6
R2.5
(1)
5.08 nom.
Not indicated tolerances ± 0.2
Proposed pad layout
from component side
(for reference only)
Technical drawings
according to DIN
specification
R2.5
Optical axis
Drawing-No.: 6.550-5343.01-4
Issue: 2; 02.07.19
Rev. 1.1, 21-Mar-2023
2.5
(3 x)
9
(3 x) 0.8
2.54
5
2.54
Document Number: 82909
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Vishay Semiconductors
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled
off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
Axis Title
10000
300
max. 260 °C
255 °C
240 °C
245 °C
217 °C
1000
200
max. 20 s
1st line
2nd line
2nd line
Temperature (°C)
250
150
max. 120 s
max. 100 s
100
100
Max. ramp up 3 °C/s
50
Max. ramp down 6 °C/s
Max. 2 cycles allowed
10
0
0
19800
Rev. 1.1, 21-Mar-2023
50
100
150
200
250
300
Time (s)
6
Document Number: 82909
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Vishay Semiconductors
PACKAGING DIMENSIONS in millimeters
(11.75)
(0.4)
Drawing-No.: 9.700-5399.01-4
Issue: 2; 29.06.18
Item
Dimensions
A0
B0
K0
P0
P1
P2
T
6.08 ± 0.10
11.75 ± 0.10
5.25 ± 0.10
4.0 ± 0.10
12.0 ± 0.10
2.0 ± 0.10
0.40 ± 0.05
Item
Dimensions
E
F
D0
D1
W
10P0
1.75 ± 0.10
11.50 ± 0.10
1.55 ± 0.05
1.5 min.
24.0 +0.30 / -0.10
40.0 ± 0.20
Rev. 1.1, 21-Mar-2023
7
Document Number: 82909
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TSSP93038DF1PZA
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Vishay Semiconductors
REEL DIMENSIONS in millimeters
+3
-0
Technical drawing
according to DIN
specifications
Form of the leave open of the wheel is supplier specific.
Dimensions according to IEC EN 60 286-3
Ø
12
.8
m
1.5
in.
mi
n.
Ø 60 min.
Ø 330
+0
-4
24.4
Tape width: 24
Ø
20
.2
Reel hub 2:1
Drawing-No.: 9.800-5052.V3-4
Issue: 1; 17.12.02
mi
n.
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
According to DIN EN 60286-3
0.1 N to 1.3 N
300 mm/min. ± 10 mm/min.
165° to 180° peel angle
Rev. 1.1, 21-Mar-2023
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Document Number: 82909
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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ORDERING INFORMATION
T
S
S
P
d
d
d
d
Product series
(2 or 3 digits)
Note
• d =
“digit”,
please
consult
the
list
of
available
d
D
Frequency
series
on
the
previous
F
1
P
Holder type
page
to
create
a
valid
part
number
Example: TSSP93038DF1P
PACKAGING QUANTITY
LABEL
• 1100 pieces per reel
• 1 reel per box
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
LOT-/serial-number
BATCH
10
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
Data-code
Mixed code indicator
Origin
LONG BAR CODE TOP
MIXED CODE
-
xxxxxxx+
Company logo
TYPE
LENGTH
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
TYPE
LENGTH
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
SHORT BAR CODE BOTTOM
Rev. 1.1, 21-Mar-2023
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Document Number: 82909
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DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
Aluminum bag
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
Label
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Reel
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
15973
22522
EIA JEDEC standard J-STD-020 level 4 label
is included on all dry bags
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
Rev. 1.1, 21-Mar-2023
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
22645
10
Document Number: 82909
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Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of
any of the products, services or opinions of the corporation, organization or individual associated with the third-party website.
Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website
or for that of subsequent links.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
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Revision: 01-Jan-2023
1
Document Number: 91000
