V30DL63CL
www.vishay.com
Vishay General Semiconductor
Dual Low-Voltage TMBS® (Trench MOS Barrier Schottky) Rectifier
Ultra Low VF = 0.31 V at IF = 5.0 A
FEATURES
eSMP® Series
SMPD (TO-263AC)
• Trench MOS Schottky technology
Available
• Very low profile - typical height of 1.7 mm
• Ideal for automated placement
K
• Low forward voltage drop, low power losses
• High efficiency operation
1
• Meets MSL level 1, per
LF maximum peak of 260 °C
2
Top View
Bottom View
• AEC-Q101 qualified available:
- Automotive ordering code: base P/NHM3
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Anode 1
K
Anode 2
Cathode
TYPICAL APPLICATIONS
LINKS TO ADDITIONAL RESOURCES
For use in high frequency DC/DC converters, switching
power supplies, freewheeling diodes, OR-ing diode, and
reverse battery protection in commercial, industrial, and
automotive application.
3D 3D
3D Models
MECHANICAL DATA
PRIMARY CHARACTERISTICS
IF(AV)
J-STD-020,
Case: SMPD (TO-263AC)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant
Base P/NHM3 - halogen-free, RoHS-compliant, and
AEC-Q101 qualified
2 x 15 A
VRRM
60 V
IFSM
200 A
VF at IF = 15 A (TJ = 125 °C)
0.47 V
TJ max.
150 °C
Package
SMPD (TO-263AC)
Circuit configuration
Common cathode
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 and HM3 suffix meet JESD 201 class 2 whisker test
Polarity: as marked
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
UNIT
V30DL63CL
Maximum repetitive peak reverse voltage
Maximum average forward rectified current
(fig. 1)
V30DL63CL
VRRM
per device
per diode
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load per diode
IF(AV) (1)
IFSM
60
30
15
200
Operating junction temperature range
TJ
(2)
-40 to +150
Storage temperature range
TSTG
-55 to +150
V
A
A
°C
Notes
(1) Mounted on infinite heatsink
(2) The heat generated must be less than the thermal conductivity from junction-to-ambient: dP /dT < 1/R
D
J
θJA
Revision: 08-Oct-2021
Document Number: 98248
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V30DL63CL
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TJ = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
IF = 5 A
IF = 7.5 A
Instantaneous forward voltage per diode
TJ = 25 °C
IF = 15 A
VF (1)
IF = 5 A
TJ = 125 °C
IF = 7.5 A
IF = 15 A
Reverse current at rated VR per diode
VR = 60 V
Typical junction capacitance per diode
4.0 V, 1 MHz
TJ = 25 °C
TJ = 125 °C
IR (2)
CJ
TYP.
MAX.
0.42
-
0.45
-
0.52
0.58
0.31
-
0.35
-
0.47
0.55
-
0.5
15
35
3200
-
UNIT
V
mA
pF
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width ≤ 5 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
Typical thermal resistance per device
SYMBOL
V30DL63CL
RθJC(1)
1.6
RθJA (2)(3)
50
UNIT
°C/W
Notes
(1) Mounted on infinite heatsink
(2) The heat generated must be less than the thermal conductivity from junction-to-ambient: dP /dT < 1/R
D
J
θJA - junction-to-ambient
(3) Free air, without heatsink
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
V30DL63CL-M3/I
0.55
I
2000/reel
13" diameter plastic tape and reel
V30DL63CLHM3/I (1)
0.55
I
2000/reel
13" diameter plastic tape and reel
Note
(1) AEC-Q101 qualified
Revision: 08-Oct-2021
Document Number: 98248
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V30DL63CL
www.vishay.com
Vishay General Semiconductor
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Axis Title
Axis Title
10000
25
1000
20
15
100
RthJA = 50 °C/W
10
5
10
0
0
25
50
75
100
125
10
1
TJ = 100 °C
0.1
TJ = 25 °C
100
0.01
0.001
TJ = -40 °C
10
0.0001
150
10
20
30
40
50
60
70
80
90 100
Percent of Rated Peak Reverse Voltage (%)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 4 - Typical Reverse Leakage Characteristics Per Diode
Axis Title
Axis Title
D = 0.8
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
7.0
1000
D = 0.2
6.0
5.0
1st line
2nd line
D = 1.0
D = 0.1
4.0
3.0
100
T
2.0
1.0
D = tp/T
4
6
8
10
12
100
100
14
16
10
10
10
2
1000
tp
0
0
1000
1st line
2nd line
D = 0.3
8.0
10000
10 000
10000
2nd line
Junction Capacitance (pF)
D = 0.5
9.0
2nd line
Average Power Loss (W)
1000
Mount Temperature (°C)
10.0
18
0.1
1
10
100
Average Forward Current (A)
Reverse Voltage (V)
Fig. 2 - Average Power Loss Characteristics Per Diode
Fig. 5 - Typical Junction Capacitance Per Diode
Axis Title
Axis Title
10000
1000
1st line
2nd line
TJ = 125 °C
TJ = 100 °C
1
100
TJ = 25 °C
TJ = -40 °C
10
0.1
0
0.2
0.4
0.6
0.8
1.0
Junction to Ambient
10
1000
1
100
1st line
2nd line
TJ = 150 °C
10
10000
100
2nd line
Transient Thermal Impedance (°C/W)
100
2nd line
Instantaneous Forward Current (A)
TJ = 150 °C
TJ = 125 °C
1st line
2nd line
TM measured at cathode
terminal mount typical values
2nd line
Instantaneous Reverse Current (mA)
RthJM = 1.6 °C/W
30
10000
100
1st line
2nd line
2nd line
Average Forward Rectified Current (A)
35
0.1
0.01
10
0.1
1
10
100
Instantaneous Forward Voltage (V)
t - Pulse Duration (s)
Fig. 3 - Typical Instantaneous Forward Characteristics Per Diode
Fig. 6 - Typical Transient Thermal Impedance
Revision: 08-Oct-2021
Document Number: 98248
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V30DL63CL
www.vishay.com
Vishay General Semiconductor
Axis Title
10000
60
Epoxy printed circuit
board FR4 copper
thickness = 70 µm
50
1000
45
1st line
2nd line
2nd line
Thermal Resistance (°C/W)
55
40
35
100
30
25
S (cm2)
10
20
1
2
3
4
5
6
7
8
9
Copper Pad Areas (cm2)
Fig. 7 - Thermal Resistance Junction-to-Ambient vs. Copper Pad Areas
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
SMPD (TO-263AC)
0.402 (10.20)
0.386 (9.80)
0.059 (1.50) REF.
0.071 (1.80)
0.063 (1.60)
0.020 (0.52)
0.011 (0.27)
0.048 (1.21)
0.032 (0.81)
0.354 (8.99)
0.338 (8.59)
0.509 (12.93)
0.485 (12.33)
0 to 0.01
(0 to 0.254)
0.069 (1.74)
0.053 (1.34)
0.020 (0.52)
0.011 (0.27)
0.052 (1.23)
0.028 (0.72)
0.063 (1.60)
0.047 (1.20)
0.200
NOM.
(5.08)
Mounting Pad Layout
0.420 (10.66) MIN.
0.339 (8.60)
0.323 (8.20)
0.276 (7.00)
0.260 (6.60)
0.330
REF.
(8.38)
0.194
NOM.
(4.93)
0.604 (15.33)
0.525 (13.33)
0.120 (3.05) REF.
0.080 (2.03) MIN.
0.105 (2.67)
0.095 (2.41)
Revision: 08-Oct-2021
Document Number: 98248
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2023
1
Document Number: 91000