VCUT0505B-HD1-GS08

VCUT0505B-HD1 www.vishay.com Vishay Semiconductors Bidirectional Symmetrical (BiSy) Single Line ESD Protection Diode in LLP1006-2L FEATURES • Ultra compact LLP1006-2L package • Low package profile < 0.4 mm 2 1 • 1-line ESD protection • Working range ± 5 V 21129 • Low leakage current IR < 0.1 μA 20855 • Low load capacitance CD = 18 pF • ESD Immunity acc. IEC 61000-4-2 ± 20 kV contact discharge ± 25 kV air discharge MARKING (example only) XY • Soldering can be checked by standard vision inspection; no X-ray necessary 21121 • Pin plating NiPdAu (e4) no whisker growth Bar = pin 1marking X = date code Y = type code (see table below) • e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn) • PATENT(S): www.vishay.com/patents DESIGN SUPPORT TOOLS • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 click logo to get started   Models Available ORDERING INFORMATION DEVICE NAME VCUT0505B-HD1 ORDERING CODE TAPED UNITS PER REEL (8 mm TAPE on 7" REEL) MINIMUM ORDER QUANTITY VCUT0505B-HD1-GS08 8000 8000 PACKAGE DATA DEVICE NAME PACKAGE NAME VCUT0505B-HD1 LLP1006-2L TYPE MOLDING COMPOUND WEIGHT FLAMMABILITY RATING CODE L 0.72 mg UL 94 V-0 MOISTURE SENSITIVITY LEVEL SOLDERING CONDITIONS MSL level 1 Peak temperature max. 260 °C (according J-STD-020) ABSOLUTE MAXIMUM RATINGS VCUT0505B-HD1 PARAMETER TEST CONDITIONS SYMBOL VALUE UNIT Peak pulse current Acc. IEC 61000-4-5; tp = 8/20 μs; single shot IPPM 3.5 A Peak pulse power Pin 1 to pin 2 Acc. IEC 61000-4-5; tp = 8/20 μs; single shot PPP 56 W ESD immunity Operating temperature Storage temperature Contact discharge acc. IEC 61000-4-2; 10 pulses Air discharge acc. IEC 61000-4-2; 10 pulses Junction temperature ± 20 kV ± 25 kV TJ -40 to +125 °C Tstg -55 to +150 °C VESD PATENT(S): www.vishay.com/patents This Vishay product is protected by one or more United States and international patents. Rev. 2.3, 03-Jan-2019 Document Number: 81852 1 For technical questions, contact: ESDprotection@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VCUT0505B-HD1 www.vishay.com Vishay Semiconductors ELECTRICAL CHARACTERISTICS VCUT0505B-HD1  (Tamb = 25 °C, unless otherwise specified) TEST CONDITIONS/REMARKS SYMBOL MIN. TYP. MAX. UNIT Number of lines which can be protected Nchannel - - 1 lines Max. reverse working voltage VRWM - - 5 V At IR = 0.1 μA VR 5 - - V PARAMETER Protection paths Reverse stand-off voltage Reverse voltage Reverse current At VR = 5 V IR - - 0.1 μA Reverse breakdown voltage At IR = 1 mA VBR 7 - - V V Reverse clamping voltage Capacitance At IPP = 1 A VC - - 12 At IPP = IPPM = 3.5 A VC - - 16 V At VR = 0 V; f = 1 MHz CD - 18 20 pF At VR = 2.5 V; f = 1 MHz CD - 14.5 - pF CUT THE SPIKES WITH VCUT0505B-HD1: The VCUT0505B-HD1 is a bidirectional and symmetrical (BiSy) ESD protection device which clamps positive and negative overvoltage transients to ground. Connected between the signal or data line and the ground the VCUT0505B-HD1 offers a high isolation (low leakage current, low capacitance) within the specified working range. Due to the short leads and small package size of the tiny LLP1006-2L package the line inductance is very low, so that fast transients like an ESD strike can be clamped with minimal over- or undershoots. TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Axis Title 20 10000 120 100 16 14 1st line 2nd line 60 53 40 CD (pF) 1000 80 2nd line IESD (%) f = 1 MHz 18 Rise time = 0.7 ns to 1 ns 12 10 8 100 6 27 4 20 2 0 10 -10 0 0 10 20 30 40 50 60 70 80 90 100 0 t (ns) 2nd line 20557 1 2 21122 Fig. 1 - ESD Discharge Current Wave Form acc. IEC 61000-4-2 (330 /150 pF) 3 4 5 6 VR (V) Fig. 3 - Typical Capacitance CD vs. Reverse Voltage VR Axis Title 10000 100 10 8 µs to 100 % 8 Pin 1 to 2 6 80 4 20 µs to 50 % 40 100 20 VR (V) 60 1st line 2nd line 2nd line IPPM (%) 1000 2 0 -2 -4 -6 -8 0 10 0 10 20 30 40 t (µs) 2nd line 20548 Fig. 2 - 8/20 μs Peak Pulse Current Wave Form acc. IEC 61000-4-5 Rev. 2.3, 03-Jan-2019 -10 0.01 21123 0.1 1 10 100 1000 10 000 IR (µA) Fig. 4 - Typical Reverse Voltage VR vs. Reverse Current IR Document Number: 81852 2 For technical questions, contact: ESDprotection@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VCUT0505B-HD1 www.vishay.com Vishay Semiconductors 40 10 Pin 2 to 1 8 Pin 2 to 1 6 4 0 VC-ESD (V) VR (V) Acc. IEC 61000-4-2 -8 kV contact discharge 20 2 0 -2 -20 -40 -4 -6 -60 -8 - 10 0.01 0.1 1 10 -80 -10 0 100 1000 10 000 Fig. 5 - Typical Reverse Voltage VR vs. Reverse Current IR t (ns) Fig. 8 - Typical Clamping Performance at - 8 kV Contact Discharge (acc. IEC 61000-4-2) 200 20 Pin 2 to 1 15 Pin 2 to 1 Positive surge 150 Positive discharge 100 Measured acc. IEC 61000-4-5 (8/20 µs - wave form) 5 0 50 VC-ESD (V) 10 VC (V) 10 20 30 40 50 60 70 80 90 21127 IR (µA) 21124 VC -5 VC-ESD 0 -50 -100 -10 Negative discharge -150 Negative surge Acc. IEC 61000-4-2 contact discharge -200 -15 0 1 21125 2 3 0 4 IPP (A) Fig. 6 - Typical Peak Clamping Voltage VC vs. Peak Pulse Current IPP 21128 5 10 15 20 25 VESD (kV) Fig. 9 - Typical Peak. Clamping Voltage at ESD Contact Discharge (acc. IEC 61000-4-2) 80 70 60 Pin 2 to 1 Acc. IEC 61000-4-2 +8 kV contact discharge VC-ESD (V) 50 40 30 20 10 0 -10 -20 -10 0 21126 10 20 30 40 50 60 70 80 90 t (ns) Fig. 7 - Typical Clamping Performance at + 8 kV Contact Discharge (acc. IEC 61000-4-2) Rev. 2.3, 03-Jan-2019 Document Number: 81852 3 For technical questions, contact: ESDprotection@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VCUT0505B-HD1 www.vishay.com Vishay Semiconductors 0.25 [0.010] 0.15 [0.006] PACKAGE DIMENSIONS in millimeters (Inches): LLP1006-2L 0.65 [0.026] 0.55 [0.022] Orientation identification 0.05 [0.002] 0 [0.000] 0.4 [0.016] 0.33 [0.013] 0.45 [0.018] 0.35 [0.014] 0.125 [0.005] ref. 0.55 [0.022] 0.45 [0.018] 0.3 [0.012] 0.2 [0.008] 1.05 [0.041] 0.95 [0.037] 1 [0.039] Solder resist mask 0.2 [0.008] 0.5 [0.020] 0.6 [0.024] Foot print recommendation: Solder pad 0.5 [0.020] 0.05 [0.002] 0.25 [0.010] Pad Design Patented: ( P US 9.018.537 B2) Document no.: S8-V-3906.04-005 (4) Rev. 7 - Date: 11.May 2016 20812 Unreeling direction LLP1006-2X Orientation identification Top view S8-V-3906.04-017 (4) 02.05.2017 22965 Rev. 2.3, 03-Jan-2019 Pad layout - view from top seen at bottom side Document Number: 81852 4 For technical questions, contact: ESDprotection@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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