VEMI65A6-FC2-GS08

VEMI65A6-FC2 Vishay Semiconductors 6-channel Flip-Chip EMI Filter with ESD-Protection Features • • • • • • • • ball view Ultra compact Flip-Chip package In-line pinning 3 dB Cut-off frequency = 60 MHz Series resistance 100 Ohms Low leakage current ESD protection to IEC 61000-4-2 ± 30 kV Lead (Pb)-free component Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC IN 6 IN 4 IN 5 GND 3 OUT 6 IN 3 Pin 1 IN 2 GND 1 GND 2 OUT 5 OUT 4 IN 1 OUT 3 OUT 2 OUT 1 19464 Mechanical Data Case: FC2 (FlipChip/BGA) Terminals: High temperature soldering guaranteed: 260 °C/10 sec. at terminals Weight: 5.5 mg Packaging Codes/Options: GS18 = 10 k per 13" reel (8 mm tape), 10 k/box GS08 = 3 k per 7" reel (8 mm tape), 15 k/box Marking: X01 Pin 1 19463_1 Absolute Maximum Ratings (TA = 25 °C unless otherwise specified) Symbol Value Unit ESD Air Discharge per IEC 61000-4-2 Parameter VESD ± 30 kV ESD Contact Discharge per IEC 61000-4-2 VESD ± 30 kV Symbol Value Unit TJ - 40 to + 85 °C TSTG - 55 to + 150 °C Thermal Characteristics (TA = 25 °C unless otherwise specified) Parameter Operating Temperature Storage Temperature Document Number 84746 Rev. 1.0, 07-Okt-05 www.vishay.com 1 VEMI65A6-FC2 Vishay Semiconductors Electrical Characteristics (TA = 25 °C unless otherwise specified) Parameter Test Conditions Synbol Min. Reverse Stand-Off Voltage Input to ground VRWM 5 Typ. Max. Unit Line resistance between input and output RS 90 100 110 Ω Cut-off Frequency 3 dB - attenuation f3dB 60 MHz Attenuation f = 800 MHz - 2 GHz S21 - 30 dB Input current Input to ground at VRWM output not connected IR 1 µA Max. clamping output voltage Output to ground Vin-ESD = 8 kV VC-Out 8 V Max. Peak pulse current each Input to ground See Fig. 1 at IPPM 5 A Reverse Breakdown Voltage at IR = 1 mA each input or output to ground VBR 6.5 V Capacitance at VR = 0 V; f = 1 MHz each input or output to ground CIN V 90 pF 8 8µs to 100% Output not connected 100 % 7 6 80 % VIN in V I PPM 5 60 % 20µs to 50% 4 3 40 % 2 20 % 1 0 0.01 0% 0 19465 10 20 Time in µs 30 40 Figure 1. 8/20 µs Peak Pulse Current wave from IEC 61000-4-5 1 10 100 1000 10000 IIN in µA Figure 3. Typical Input Voltage VIN vs. Input Current IIN 0 12 VC INPUT to Ground 8 VC OUTPUT to Ground 6 Z 0 = 50 Ω -5 Transmission (S21) in dB 10 VC in V 0.1 19473 4 -10 VIN_ = 5V -15 -20 VIN_= 0V -25 -30 2 -35 Measured acc. IEC 61000-4-5 (8/20µs - Waveform) 0 -40 0 1 19474 2 3 4 I PP in A 5 6 1 10 100 1000 10000 Frequency in MHz 19475 Figure 2. Typical Clamping Voltage vs. Peak Pulse Current IPP www.vishay.com 2 Figure 4. Typical small signal transmission (S21) at Z0 = 50 Ohm Document Number 84746 Rev. 1.0, 07-Okt-05 VEMI65A6-FC2 Vishay Semiconductors 90 f = 1MHz 80 70 CIN in pF 60 50 40 30 20 10 0 0 1 19471 2 3 4 5 VIN in V Figure 5. Typical Input Capacitance CIN vs. Input Voltage VIN Document Number 84746 Rev. 1.0, 07-Okt-05 www.vishay.com 3 VEMI65A6-FC2 Vishay Semiconductors Application Note: a) With the VEMI65A6-FC2 6 different signal or data lines can be filtered and clamped to ground. Due to the different clamping levels in forward and reverse direction the clamping behavior is Bidirectional and Asymmetric (BiAs). L1IN L1OUT L2IN L2OUT L3IN L3OUT L4IN L4OUT L5IN L5OUT L6OUT L6IN 19466 Circuit diagram of one EMI-Filter-Channel RS Output Input C C Ground 19467 Each filter is symmetrical so that both ports can be used as Input or Output. www.vishay.com 4 Document Number 84746 Rev. 1.0, 07-Okt-05 VEMI65A6-FC2 Vishay Semiconductors Package Dimensions in mm (Inches) 500µm 315µm ±50µm 870µm 1330µm ±45µm 2960µm ±45µm 400µm 650µm ±50µm ±70µm 19468 Foot print recommendation: Opening solder mask & solder stencil diameter = 0.38 mm Non-Solder Mask defined Pad diameter = 0.28 mm 19469 Document Number 84746 Rev. 1.0, 07-Okt-05 www.vishay.com 5 VEMI65A6-FC2 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany www.vishay.com 6 Document Number 84746 Rev. 1.0, 07-Okt-05 Legal Disclaimer Notice Vishay Notice Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. Document Number: 91000 Revision: 08-Apr-05 www.vishay.com 1