VEML6031X00
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Vishay Semiconductors
High Accuracy Ambient Light Sensor With I2C Interface
FEATURES
• Package type: surface-mount
• Dimensions (L x W x H in mm): 2.67 x 2.45 x 0.6
• AEC-Q100 qualified
• Integrated modules: ambient light sensor (ALS)
• Supply voltage range VDD: 2.5 V to 3.6 V
• Communication via I2C interface
• I2C bus H-level range: 1.7 V to 3.6 V
• Floor life: 4 weeks, MSL 2a, according to
J-STD-020
• Low shut
typ. 0.5 μA
LINKS TO ADDITIONAL RESOURCES
3D 3D
Design Tools
Related
Documents
3D Models
down
current
consumption:
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Application
Notes
DESCRIPTION
AMBIENT LIGHT FUNCTION
VEML6031X00 is a high accuracy ambient light digital 16-bit
resolution sensor in a miniature opaque 2.67 mm x 2.45 mm
package. It includes a high sensitive photodiode, a low
noise amplifier, a 16-bit A/D converter and supports an
easy to use I2C bus communication interface and additional
interrupt feature.
• FiltronTM technology adaption: close to real human eye
response
The ambient light result is as digital value available.
• Typical ALS output tolerance of ≤ 10 % under different
light sources
• 16-bit dynamic range for ambient light detection from
0 lx to about 228 klx with resolution down to 0.0034 lx/ct,
supports low transmittance (dark) lens design
APPLICATIONS
• Excellent temperature compensation
Ambient light sensor in automotive for
• High dynamic detection resolution
• Display backlight controls
• Infotainment systems
• Rear view mirror dimming
• Interior lighting control systems
• Head-up displays
PRODUCT SUMMARY
PART NUMBER
VEML6031X00
OPERATING
VOLTAGE
RANGE
(V)
I2C BUS
VOLTAGE
RANGE
(V)
AMBIENT LIGHT
RANGE
(lx)
AMBIENT LIGHT
RESOLUTION
(lx)
OUTPUT
CODE
ADC RESOLUTION
PROXIMITY /
AMBIENT LIGHT
2.5 to 3.6
1.7 to 3.6
0 to 228 000
0.0034
16 bit, I2C
- / 16 bit
ORDERING INFORMATION
ORDERING CODE
PACKAGING
VOLUME (1)
REMARKS
VEML6031X00
Tape and reel
MOQ: 3000
2.67 mm x 2.45 mm x 0.6 mm
VEML6031X00-GS15
Tape and reel
MOQ: 10 000
2.67 mm x 2.45 mm x 0.6 mm
VEML60311X00
Tape and reel
MOQ: 3000
2.67 mm x 2.45 mm x 0.6 mm
VEML60311X00-GS15
Tape and reel
MOQ: 10 000
2.67 mm x 2.45 mm x 0.6 mm
Note
(1) MOQ: minimum order quantity
Rev. 1.3, 26-May-2023
Document Number: 80007
1
For technical questions, contact: sensorstechsupport@vishay.com
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SLAVE ADDRESS OPTIONS
ORDERING CODE
VEML6031X00
VEML60311X00
SLAVE ADDRESS (7 bit)
0x29
0x10
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Supply voltage
Operation temperature range
Storage temperature range
Total power dissipation
Junction temperature
TEST CONDITION
SYMBOL
VDD
Tamb
Tstg
Ptot
Tj
Tamb ≤ 25 °C
MIN.
0
-40
-40
-
MAX.
3.6
+110
+110
50
110
UNIT
V
°C
°C
mW
°C
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Supply voltage
Shut down current (1)
Active mode current
I2C clock rate range
TEST CONDITION
SYMBOL
VDD
VDD = VBUS
VDD = VBUS = 3.0 V
VDD is 3.6 V and VBUS = 1.7 V
VDD is 3.3 V
Isd
IDD
fSCL
Vih
Vih
Vil
Vil
Iol
VBUS = VDD
VBUS ≠ VDD
VBUS = VDD
VBUS ≠ VDD
I2C bus input H-level range
I2C bus input L-level range
Digital current out (low, current sink)
Digital resolution (LSB count) (2)
Detectable maximum illuminance
ALS dark offset (1)
IR dark offset (1)
With ALS_GAIN = x 2, ALS_IT = 400 ms,
PD_DIV4 = 4/4 PD
With ALS_GAIN = x 0.5, ALS_IT = 6.25 ms,
PD_DIV4 = 1/4 PD
With ALS_GAIN = x 2, IT = 200 ms,
PD_DIV4 = 4/4 PD
With ALS_GAIN = x 2, IT = 200 ms,
PD_DIV4 = 4/4 PD
MIN.
2.5
10
0.7 x VDD
0.85 x VBUS
-0.3
-0.3
3
TYP.
3.3
0.5
3.1
280
-
MAX.
3.6
1.2
400
3.6
3.6
0.3 x VDD
0.2 x VBUS
-
UNIT
V
-
0.0034
-
lx/step
-
228 000
-
lx
-
4
-
step
-
4
-
step
EV max.
μA
μA
kHz
V
V
V
V
mA
Notes
(1) Light conditions: dark
(2) Light conditions: E = 100 lx with 4300K white LED
V
CIRCUIT BLOCK DIAGRAM
4 GND
VEML6031X00
SCL 5
3 INT
16-bit ADC
IRPD
16-bit ADC
Logic and timing
controller
VDD 6
I2C interface
ALSPD
Command registers
Temperature
compensation
2 SDA
Oscillator
1 GND
Fig. 1 - Block Diagram
Rev. 1.3, 26-May-2023
Document Number: 80007
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I2C TIMING CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
Clock frequency
STANDARD MODE (1)
MIN.
MAX.
f(SMBCLK)
10
t(BUF)
4.7
t(HDSTA)
Repeated start condition setup time
Stop condition setup time
Data hold time
Data setup time
I2C clock (SCK) low period
I2C clock (SCK) high period
UNIT
MAX.
100
10
400
kHz
-
1.3
-
μs
4.0
-
0.6
-
μs
t(SUSTA)
4.7
-
0.6
-
μs
t(SUSTO)
4.0
-
0.6
-
μs
t(HDDAT)
0
3450
0
900
ns
t(SUDAT)
250
-
100
-
ns
t(LOW)
4.7
-
1.3
-
μs
Bus free time between start and stop condition
Hold time after (repeated) start condition;
after this period, the first clock is generated
FAST MODE (1)
MIN.
t(HIGH)
4.0
-
0.6
-
μs
t(TIMEOUT)
25
35
-
-
ms
Clock / data fall time
t(F)
-
300
-
300
ns
Clock / data rise time
t(R)
-
1000
-
300
ns
Detect clock / data low timeout
Note
(1) Data based on standard I2C protocol requirement, not tested in production
t(LOW)
I2C bus
clock
(SLCK)
t(R)
t(F)
VIH
VIL
t(HDSTA)
t(BUF)
t(HIGH)
t(SUSTO)
t(HDDAT)
I2C bus
data
(SDAT)
t(SUSTA)
t(SUDAT)
VIH
Start
{
S
Start condition
{
P
Stop condition
{
{
VIL
S
P
Stop
t(LOSEXT)
SCLKACK
t(LOWMEXT)
SDAACK
t(LOWMEXT)
t(LOWMEXT)
I2C bus
clock
(SLCK)
I2C bus
data
(SDAT)
Fig. 2 - I2C Timing Diagram
Rev. 1.3, 26-May-2023
Document Number: 80007
3
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PARAMETER TIMING INFORMATION
I2C bus
clock
(SCLK)
I2C bus
data
(SDAT)
SA7
SA6
SA5
SA4
SA3
SA2
W
SA1
Start by
master
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
ACK by
slave
I2C
ACK by
slave
Command code
bus slave address byte
I2C bus
clock
(SCLK)
I2C bus
data
(SDAT)
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
ACK by
slave
Stop by
master
Data byte
Fig. 3 - I2C Bus Timing for Sending Word Command Format
I2C bus
clock
(SCLK)
I2C bus
data
(SDAT)
SA7
SA6
SA5
SA4
SA3
SA2
W
SA1
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
ACK by
slave
Start by
master
ACK by
slave
I2C bus slave address byte
Command code
I2C bus
clock
(SCLK)
I2C bus
data
(SDAT)
SA7
SA6
SA5
SA4
SA3
SA2
SA1
R
SA7
SA6
SA5
SA4
SA3
ACK by
slave
Start by
master
I2C bus slave address byte
SA2
SA1
SA0
NACK by
master
Stop by
master
Data byte
Fig. 4 - I2C Bus Timing for Receive Word Command Format
Rev. 1.3, 26-May-2023
Document Number: 80007
4
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BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Axis Title
Axis Title
V(λ)
100
0.4
0.2
0
400
500
600
700
800
900
10
1000
Illuminance 3000 lux,
White LED 4300K
1000
Upper deviation
Typical
100
Lower deviation
10
-40
-20
0
20
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 5 - Relative Sensitivity, ALS Channel vs. Wavelength
Fig. 8 - Relative Deviation, ALS Channel vs. Temperature
(at lux levels lower than ~200 lux, dark current effects
should be taken into account, ref. Fig. 9)
Axis Title
Axis Title
10000
40
Illuminance 240 lux,
White LED 4300K
30
0.6
2nd line
1000
0.8
100
0.4
Dark Current Offset (lx)
1.0
1000
20
Upper deviation
10
Typical
100
0
-10
0.2
0
400
500
600
700
800
900
1st line
2nd line
10000
1st line
2nd line
Lower deviation
10
-20
10
1000
-40
-20
0
20
40
60
80
100
λ - Wavelength (nm)
Tamb - Ambient Temperature (°C)
Fig. 6 - Relative Sensitivity, IR Channel vs. Wavelength
Fig. 9 - Dark Current Offset vs. Ambient Temperature
0°
Axis Title
20°
70
40°
0.8
0.7
60°
0.6
80°
2nd line
0.9
- Angular Displacement
2nd line
1.0
Relative Deviation, IR Channel (%)
10000
60
10000
850 nm IR LED
50
40
1000
30
1st line
2nd line
2nd line
Srel. - Relative Sensitivity, IR Channel
40
λ - Wavelength (nm)
1.2
2nd line
Srel - Relative Sensitivity
1st line
2nd line
0.6
2nd line
Relative Deviation, ALS Channel (%)
1000
0.8
1st line
2nd line
2nd line
Srel. - Relative Sensitivity, ALS Channel
VEML6031X00
1.0
10000
20
18
16
14
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
10000
1.2
20
10
0
100
-10
-20
-30
10
-40
0.5 0.4 0.3 0.2 0.1 0
-40
-20
0
20
40
60
80
100
2nd line
Tamb - Ambient Temperature (°C)
Fig. 7 - Relative Sensitivity vs. Angular Displacement
Fig. 10 - Relative Deviation IR Channel vs. Ambient Temperature
Rev. 1.3, 26-May-2023
Document Number: 80007
5
For technical questions, contact: sensorstechsupport@vishay.com
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VEML6031X00
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APPLICATION INFORMATION
Special care must be taken into consideration when handling the VEML6031X00. VEML6031X00 is sensitive to dust and
scratches, proper optical device handling procedures are recommended.
The optical surface of the device must be kept clean for optimal performance in both prototyping with the device and mass
production manufacturing procedures. Tweezers with plastic or rubber contact surfaces are recommended to avoid scratches
on the optical surface. Avoid manipulation with metal tools when possible. The optical surface must be kept clean of fingerprints,
dust, and other optical-inhibiting contaminants.
If the device optical surface requires cleaning, the use of isopropyl alcohol is recommended. A few gentle brushes with a soft
swab are appropriate. Avoid potentially abrasive cleaning and manipulating tools and excessive force that can scratch the
optical surface.
If the VEML6031X00 performs less than optimally, inspect the optical surface for dirt, scratches, or other optical artifacts.
VEML6031X00 is a cost effective solution of ambient light sensor with I2C bus interface. The standard serial digital interface is
easy to access “Ambient Light Signal” without complex calculation and programming by external controller. Beside the digital
output also a flexible programmable interrupt pin is available.
1. Application Circuit
1.7 V to 3.6 V
R1 R2 R3
GND (1)
2.5 V to 3.6 V
R4
10R
C1
C2
10 µF 100 nF
C1 and R4
are optional
for a noisy
supply
VDD (6)
VEML6031X00
GND (4)
Host
Micro Controller
SDA (2)
I2C bus data SDA
SCL (5)
I2C bus clock SCL
INT (3)
GPIO (interrupt)
Fig. 11 - Application Circuit
(x) = Pin Number
Notes
• The interrupt pin is an open drain output. Proposed values for the pull-up resistors should be > 1 kΩ, e.g. 2.2 kΩ to 4.7 kΩ for the R1 and
R2 (at SDA and SCL) and 10 kΩ to 100 kΩ for R3 (at interrupt).
Normally just one decoupling capacitor is needed. This should be ≥ 100 nF and placed close to the VDD pin.
For detailed description about set-up and use of the interrupt as well as more application related information see AN: “Designing
VEML6031X00 into an Application”.
Rev. 1.3, 26-May-2023
Document Number: 80007
6
For technical questions, contact: sensorstechsupport@vishay.com
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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2. I2C Interface
The VEML6031X00 has eighteen register addresses responsible for operation control, parameter setup and result buffering.
All registers are accessible via I2C communication. Fig. 9 shows the basic I2C communication with VEML6031X00.
The built in I2C interface is compatible with I2C modes “standard” and “fast”: 10 kHz to 400 kHz.
Please refer to the I2C specification from NXP for details.
Send byte
Block write byte mode
1
S
7
Slave address
Receive byte
1
S
S
P
A
Sr
1
Wr
1
8
A
Command code
(address = M)
1
8
1
8
A
Data byte
(address = M)
A
Data byte
(address = M + 1)
8
1
8
1
A
Data byte
(address = M + 2)
A
1
8
1
1
Data byte
(address = M + 3)
A
Data byte
(address = M + N)
A
P
1
7
1
8
1
8
1
Sr
Slave
address
R
A
Data byte
(address = M)
A
Data byte
(address = M + 1)
A
8
1
8
1
1
Data byte
(address = M + 2)
A
Data byte
(address = M + N)
N
P
Block read byte mode
7
Slave address
= start condition
= stop condition
= acknowledge
= reapeated start condition
1
Wr
1
8
A
Command code
(address = M)
1
A
1
Host action
VEML6031X00 response
Fig. 12 - Send Byte / Receive Byte Protocol
Register Addresses
Device Address
different
The VEML6031X00 has eighteen registers, accessible
through there respective 8-bit command codes.
For one version the predefined 7 bit I2C bus address is set
to 0101001 = 0x29. The least significant bit (LSB) defines
read or write mode. Accordingly the bus address is set to
0101 0010 = 0x52 for write and 0101 0011 = 0x53 for read.
The second version comes with predefined 7 bit I2C bus
address of 0010000 = 0x10, so, here the write address is
0010 0000 = 0x20 for write and 0010 0001 = 0x21 for read.
The registers are 0x00 to 0x17 (0x02 and 0x03, 0x08 to 0x0F
and 0x16 are not defined / reserved). Note that due to the
location of the two shutdown bits (SD and ALS_IR_SD), one
in register 0x00 and the other in 0x01, it is necessary to
always write to both registers at once when configuring the
device.
The VEML6031X00 is available
pre-configured slave addresses.
in
two
Auto-Memorization
The VEML6031X00 stores the last measured ambient data
before the device is shutdown, keeping the data accessible.
When VEML6031X00 is in shutdown mode, the host can
freely read this data via read command directly.
Rev. 1.3, 26-May-2023
Document Number: 80007
7
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COMMAND REGISTER FORMAT
COMMAND CODE
REGISTER NAME
BIT
DEFAULT VALUE
FUNCTION / DESCRIPTION
R/W
0x00
ALS_CONF 0
0:7
0x01
ALS integration time, measurement mode, shutdown
R/W
0x01
ALS_CONF 1
0:7
0x00
ALS and IR shutdown, ALS gain, interrupt persistance
R/W
0x04
ALS_WH_L
0:7
0x00
ALS high threshold window setting (LSB)
R/W
0x05
ALS_WH_H
0:7
0x00
ALS high threshold window setting (MSB)
R/W
0x06
ALS_WL_L
0:7
0x00
ALS low threshold window setting (LSB)
R/W
R/W
0x07
ALS_WL_H
0:7
0x00
ALS low threshold window setting (MSB)
0x10
ALS_DATA_L
0:7
0x00
Low byte of 16-bit ALS result DATA
R
0x11
ALS_DATA_H
0:7
0x00
High byte of 16-bit ALS result DATA
R
0x12
IR_DATA_L
0:7
0x00
Low byte of 16-bit IR result DATA
R
0x13
IR_DATA_H
0:7
0x00
High byte of 16-bit IR result DATA
R
0x14
ID_L
0:7
0x01
ID code
R
0x15
ID_H
0:7
0x00
Package and version code
R
0x17
ALS_INT
0:7
0x00
ALS INT trigger event
R
Notes
• Command code 0x00 default value is 0x01 = device is shutdown
• Command 0x00 and command 0x01 must be executed together, they cannot be executed independently
TABLE 1 - REGISTER: ALS_CONF_0 - 0x00
REGISTER NAME
BIT
Reserved
7
FUNCTION / DESCRIPTION
R/W
Must be set to “0”
R/W
ALS integration time setting
000 = 3.125 ms
001 = 6.25 ms
010 = 12.5 ms
011 = 25 ms
100 = 50 ms
101 = 100 ms
110 = 200 ms
111 = 400 ms
R/W
3
Active force mode enable setting
0 = AF disable
1 = AF enable
Once enabled, a single measurement can be triggered with the “ALS_TRIG” bit
R/W
ALS_TRIG
2
ALS active force trigger setting
0 = no active force mode trigger
1 = trigger active force mode
This bit resets to “0” automatically after every trigger
R/W
ALS_INT_EN
1
ALS interrupt setting
0 = interrupt disable
1 = interrupt enable
R/W
SD
0
Band gap and LDO shutdown setting
0 = band gap and LDO on
1 = band gap and LDO shutdown (default)
R/W
ALS_IT
ALS_AF
6:4
Note
• Command code 0x00 default value is 0x01 = device is shutdown
Rev. 1.3, 26-May-2023
Document Number: 80007
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TABLE 2 - REGISTER: ALS_CONF_1 - 0x01
REGISTER NAME
BIT
FUNCTION / DESCRIPTION
R/W
ALS_IR_SD
7
ALS and IR channel shutdown setting
0 = ALS and IR channels on
1 = ALS and IR channels shutdown
PD_DIV4
6
Effective photodiode size ALS and IR
0 = 4/4 PD used
1 = 1/4 PD used
R/W
Reserved
5
Reserved
R/W
4:3
Gain selection
00 = ALS gain x1
01 = ALS gain x2
10 = ALS gain x 0.66
11 = ALS gain x 0.5
R/W
ALS_PERS
2:1
ALS persistence protect number setting
Number of persistent measurements above threshold to trigger the interrupt
00 = 1
01 = 2
10 = 4
11 = 8
R/W
ALS_CAL
0
Must be set to “1” when power on ready
R/W
ALS_GAIN
R/W
TABLE 3 - REGISTER: ALS_WH - 0x04, 0x05
COMMAND CODE
REGISTER NAME
BIT
FUNCTION / DESCRIPTION
R/W
0x04
ALS_WH_L
7:0
ALS high threshold window setting (data byte low)
R/W
0x05
ALS_WH_H
7:0
ALS high threshold window setting (data byte high)
R/W
TABLE 4 - REGISTER: ALS_WL - 0x06, 0x07
COMMAND CODE
REGISTER NAME
BIT
0x06
ALS_WL_L
7:0
ALS low threshold window setting (data byte low)
FUNCTION / DESCRIPTION
R/W
R/W
0x07
ALS_WL_H
7:0
ALS low threshold window setting (data byte high)
R/W
TABLE 5 - REGISTER: ALS_DATA - 0x10, 0x11
COMMAND CODE
REGISTER NAME
BIT
FUNCTION / DESCRIPTION
R/W
0x10
ALS_DATA_L
7:0
ALS result channel (data byte low)
R
0x11
ALS_DATA_H
7:0
ALS result channel (data byte high)
R
TABLE 6 - REGISTER: IR_DATA - 0x12, 0x13
COMMAND CODE
REGISTER NAME
BIT
0x12
IR_DATA_L
7:0
IR result channel (data byte low)
FUNCTION / DESCRIPTION
R/W
R
0x13
IR_DATA_H
7:0
IR result channel (data byte high)
R
TABLE 7 - REGISTER: ID - 0x14, 0x15
COMMAND CODE
REGISTER NAME
BIT
0x14
ID_L
7:0
ID code: 0x01
R
ID_H
7:6
5:4
3:0
Package code: 00
Slave address: 00 = 0x29; 01 = 0x10
Version code: 0000 = A01
R
0x15
Rev. 1.3, 26-May-2023
FUNCTION / DESCRIPTION
R/W
Document Number: 80007
9
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TABLE 8 - REGISTER: ALS_INT - 0x17
REGISTER NAME
BIT
FUNCTION / DESCRIPTION
R/W
Reserved
7:4
Reserved
R
ALS_AF_DATA_READY
3
ALS active force mode data ready flag
R
ALS_IF_L
2
ALS low threshold INT flag
R
ALS_IF_H
1
ALS high threshold INT flag
R
Reserved
0
Reserved
R
CALCULATING THE LUX LEVEL
Command code 0x10 and 0x11 contain the results of the
ALS measurement. This 16-bit code needs to be converted
to a decimal value to determine the corresponding lux value.
The calculation of the corresponding lux level is dependent
on the programmed gain setting and the chosen integration
time.
The component is most sensitive with ALS_GAIN = x2,
PD_DIV4 = 4/4 and an integration time of 400 ms, specified
to 0.0034 lx/step.
Every time the integration time is halved, the resolution is
doubled but also the possible detection range is doubled.
The same principle is valid for the gain setting. For
ALS_GAIN = x1 it is doubled. For PD_DIV4 = 1/4 the size of
the photodiode is just 1/4, so, also the sensitivity is just 1/4,
resolution and max. possible detection range is times 4, to
allow for higher illuminations up to about 228 klx.
TABLE 9 - RESOLUTION AND MAXIMUM DETECTION RANGE AT PD_DIV4 = 0 (= x 4/4)
GAIN x 2
IT (ms)
GAIN x 1
GAIN x 0.66
GAIN x 0.5
GAIN x 2
TYPICAL RESOLUTION (lx/cnt)
GAIN x 1
GAIN x 0.66
GAIN x 0.5
MAXIMUM POSSIBLE ILLUMINATION (lx)
400
0.0034
0.0068
0.0103
0.0136
223
446
675
891
200
0.0068
0.0136
0.0206
0.0272
446
891
1350
1783
100
0.0136
0.0272
0.0412
0.0544
891
1783
2701
3565
50
0.0272
0.0544
0.0824
0.1088
1783
3565
5402
7130
25
0.0544
0.1088
0.1648
0.2176
3565
7130
10803
14260
12.5
0.1088
0.2176
0.3297
0.4352
7130
14260
21607
28521
6.25
0.2176
0.4352
0.6594
0.8704
14260
28521
43213
57042
3.125
0.4352
0.8704
1.3188
1.7408
(-) (1)
(-) (1)
(-) (1)
(-) (1)
TABLE 10 - RESOLUTION AND MAXIMUM DETECTION RANGE AT PD_DIV4 = 1 (= x 1/4)
GAIN x 2
IT (ms)
GAIN x 1
GAIN x 0.66
GAIN x 0.5
GAIN x 2
TYPICAL RESOLUTION (lx/cnt)
GAIN x 1
GAIN x 0.66
GAIN x 0.5
MAXIMUM POSSIBLE ILLUMINATION (lx)
400
0.0136
0.0272
0.0412
0.0544
891
1783
2701
200
0.0272
0.0544
0.0824
0.1088
1783
3565
5402
3565
7130
100
0.0544
0.1088
0.1648
0.2176
3565
7130
10803
14260
50
0.1088
0.2176
0.3297
0.4352
7130
14260
21607
28521
25
0.2176
0.4352
0.6594
0.8704
14260
28521
43213
57042
12.5
0.4352
0.8704
1.3188
1.7408
28521
57042
86427
114083
6.25
0.8704
1.7408
2.6376
3.4816
57042
114083
172854
228167
3.125
1.7408
3.4816
5.2752
6.9632
(-) (1)
(-) (1)
(-) (1)
(-) (1)
Note
(1) For integration time of 3.125 ms the maximum count level is no longer 16 bit, so, half the integration time no longer leads to double the
max. lux level
Example:
If the 16-bit word of the ALS data shows: 0000 0101 1100 1000 = 1480 (dec.), the programmed ALS_GAIN = x1, PD_DIV4 = 4/4
(= x1) and ALS_IT = 100 ms, the corresponding lux level is: light level (lx) = 1480 x 0.0272 = 40.256 lx.
Rev. 1.3, 26-May-2023
Document Number: 80007
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0.1
0.2
0.6
PACKAGE DIMENSIONS in millimeters
0.4
chip surface
0.8
0.8
2.67
0.8
Pinning top view
Pin 5
SCL
Pin 3
INT
Pin 6
VDD
Pin 2
SDA
2.45
0.2
Pin 4
GND
0.2
Pin 1
GND
Active area
Pin 1 marking:
exposed pad offset
Recommended footprint
0.15
0.79
0.85
1.2
1.2
1.28
(0.35)
(0.33)
0.79
0.54
0.85
Technical drawings
according to DIN
specification
Drawing No.: 6.550-5357.01-4
Issue: 1; 14.04.2021
Rev. 1.3, 26-May-2023
1.5
All dimensions in mm incl. burrs
Not indicated tolerances ± 0.1
Document Number: 80007
11
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31A0Y
WWXXX
MARKING AND PIN 1 IDENTIFICATION
31: device type
A: address option (0, 1)
0: qualification (0 = AEC-Q100)
Pin 1 marking
dot marking on top side
elongated feature on bottom side
Y: year
WW: week
XXX: lot number
TAPE AND REEL DIMENSIONS in millimeters
Reel size:
VEML6031: Ø 180 mm ± 2 mm = 3000 pcs.
VEML6031-GS 15: Ø 330 mm ± 2 mm = 10 000 pcs.
Reel design is representative for different types.
Technical drawings
according to DIN
specification
Unreel direction
Not indicated tolerances ± 0.1
0.25
A
1.1
Label posted here
Pin 1
12
2
A (5:1)
4
4
Sensor orientation
Ø 1.5
5.5
1.75
Drawing No.: 9.800-5148.01-4
Issue: prelminary; 16.10.19
Rev. 1.3, 26-May-2023
Document Number: 80007
12
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REFLOW SOLDER PROFILE
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Axis Title
10000
300
Max. 260 °C
255 °C
240 °C
217 °C
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: Tamb < 30 °C, RH < 60 %
2nd line
Temperature (°C)
250
245 °C
1000
200
Max. 30 s
1st line
2nd line
DRYPACK
Vishay Semiconductors
150
Max. 120 s
100
Max. 100 s
Max. ramp down 6 °C/s
Moisture sensitivity level 2a, according to J-STD-020.
100
Max. ramp up 3 °C/s
50
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Rev. 1.3, 26-May-2023
10
0
0
19841
50
100
150
200
250
300
Time (s)
Fig. 13 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
Document Number: 80007
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