VJ6040M011SXISRA0

VJ 6040 Vishay Vitramon VJ 6040 UHF Chip Antenna for Mobile Devices FEATURES • Small outline (10.5 mm x 15.5 mm x 1.2 mm) • Omni-directional, linear polarization • Complies with MBRAI standard • Complete UHF band coverage (470 MHz to 860 MHz) up to 1.1 GHz • Requires a tuning circuit and ground plane for optimal performance The company’s products are covered by one or more of the following: WO2008250262 (A1), US2008303720 (A1), US2008305750 (A1), WO2008154173 (A1). Other patents pending. • Standard SMT assembly DESCRIPTION • Compliant to RoHS directive 2002/95/EC The VJ 6040 multi-layer ceramic chip antenna is a small form-factor, high-performance, chip-antenna designed for TV reception in mobile devices in the UHF band. It allows mobile TV device manufacturers to design high quality products that do not bear the penalty of a large external antenna. Utilizing Vishay's unique materials and manufacturing technologies, this product complies with the MBRAI standard while maintaining a small outline. Focusing on consumer applications, the antenna is designed to be assembled onto a PC board in the standard reflow process. APPLICATIONS Target customers of the VJ 6040 are mobile phone makers, portable multimedia device makers, notebook OEMs and ODMs, and accessory card OEMs and ODMs. The VJ 6040 is the first of a family of products developed by Vishay, a world leader in manufacturing of discrete and passive components. • 50 Ω unbalanced interface • Operating temperature range (- 40 °C to + 85 °C) • Reference design and evaluation boards available upon request • Mobile UHF TV receivers including DVB-T, DVB-H, ISDB-T, CMMB, ATSC, and MediaFLO devices ANTENNA PERFORMANCE Peak gain The antenna radiation characteristics are influenced by several factors including ground plane dimensions and impedance matching network. The antenna parameters presented hereafter were measured according to the configuration suggested by the VJ 6040 evaluation board, utilizing its four channel active digital tuning circuit. The evaluation board ground plane is 40 mm by 80 mm large. Figure 1 shows peak gain over frequency throughout the UHF band, compared with the MBRAI requirements. 0 Peak Gain (dBi) -2 Measured -4 Simulated -6 Standard -8 - 10 - 12 450 500 550 600 650 700 750 Frequency (MHz) 800 850 900 Fig. 1 - Peak gain vs. Frequency Document Number: 45157 Revision: 15-Jun-10 For technical questions, contact: mlcc@vishay.com www.vishay.com 1 VJ 6040 Vishay Vitramon VJ 6040 UHF Chip Antenna for Mobile Devices Figure 2 displays the measured and simulated radiation efficiency of VJ 6040 over frequency. 40 35 Simulated value Efficiency (%) 30 25 Measured value 20 15 10 5 0 460 510 560 610 660 710 Frequency (MHz) 760 810 860 Fig. 2 - Radiation Efficiency vs. Frequency Applications that do not require full coverage of the UHF band can gain an additional two to three dBi by removing the tuning circuit. In this case the antenna can be fixed to any 150 MHz band within the UHF range. RADIATION PATTERN The 3D planes of VJ 6040 are defined in figure 3. Z X Y Fig. 3 - VJ 6040 3D Plane Definition www.vishay.com 2 For technical questions, contact: mlcc@vishay.com Document Number: 45157 Revision: 15-Jun-10 VJ 6040 VJ 6040 UHF Chip Antenna for Mobile Devices Vishay Vitramon Figure 4. displays the simulated 3D radiation pattern at 650 MHz. Fig. 4 - Simulated Radiation Pattern Figure 5. displays the measured radiation patterns of VJ 6040 evaluation board in the YZ plane as defined in figure 3. Zero degrees is defined at the Z axis, stepping counter clockwise. 500 MHz - Gain (dBi) vs. Angle (°) 0 30 18 12 24 60 342 -5 36 336 330 - 15 48 54 60 - 20 - 25 66 18 12 60 354 348 342 336 -5 - 10 42 330 324 318 312 306 300 - 15 48 54 60 288 - 35 24 36 294 - 30 72 30 324 318 312 306 300 - 10 42 600 MHz - Gain (dBi) vs. Angle (°) 0 354 348 - 20 - 25 66 294 - 30 72 288 - 35 78 - 40 282 78 - 40 282 84 - 45 - 50 276 84 - 45 276 270 90 - 50 96 264 96 102 258 102 90 252 108 246 114 120 126 132 138 144 150 156 162 168 174 180 186 192 204 198 258 108 252 114 240 234 228 222 216 210 246 240 234 120 126 228 222 216 132 138 144 150 156 700 MHz - Gain (dBi) vs. Angle (°) 162 168 174 180 186 192 30 36 42 24 0 354 348 342 6 0 -5 336 - 10 - 15 - 20 48 54 60 - 25 66 78 30 330 324 318 312 306 300 24 18 12 204 210 54 - 45 - 50 330 324 318 312 306 - 20 60 282 336 - 15 48 - 40 354 348 342 - 10 42 288 60 -5 36 294 - 30 - 35 72 198 800 MHz - Gain (dBi) vs. Angle (°) 0 18 12 270 264 300 - 25 66 294 - 30 72 288 - 35 78 - 40 282 276 84 - 45 276 270 90 - 50G 96 264 96 102 258 102 84 90 108 252 114 246 240 120 126 132 138 144 150 156 162 168 174 180 198 186 192 204 234 228 222 216 210 270 264 258 108 252 114 246 120 240 234 228 222 216 126 132 138 144 150 156 162 168 174 180 186 192 198 204 210 Fig. 5 - Measured Radiation Pattern Document Number: 45157 Revision: 15-Jun-10 For technical questions, contact: mlcc@vishay.com www.vishay.com 3 VJ 6040 VJ 6040 UHF Chip Antenna for Mobile Devices Vishay Vitramon FOOTPRINT AND MECHANICAL DIMENSIONS The antenna footprint and mechanical dimensions are presented in figure 6. For mechanical support, it is recommended to add one or two drops of heat curing epoxy glue. The glue dot should not overlap with any of the soldering pads. It is recommended to apply the glue dot at the center of the antenna, as shown by the diagonal pattern. For more details see “VJ 6040 Assembly Guidelines” section below. 0.5 0.35 3.6 1.0 0.35 0.5 3.6 4.6 1.0 ` 0.35 0.35 1.0 4.65 0.5 Glue dot area 4.65 1.0 0.35 0.35 1.0 All dimensions in mm Figure not in scale RF feed connects here Fig. 6 - VJ 6040 Footprint VJ 6040 ASSEMBLY GUIDELINES 1. Mounting of antennas on a printed circuit board should be done by reflow soldering. The reflow soldering profiles are shown below. 2. In order to provide the adequate strength between the antenna and the PCB the application of a dot of heat cured epoxy glue in the center of the footprint of the antenna prior to the antenna's soldering to the board should be done. An example for such glue could be Heraeus PD 860002 SA. The weight of the dot should be 5 mg to 10 mg. 300 T (°C) Max. temperature 250 > 215 °C: 20 s to 40 s 200 150 Min. temperature 100 Sn-Pb eutectic solder paste 50 0 30 s to 60 s 30 s to 60 s 30 s to 60 s Time Fig. 7 - Soldering IR Reflow with SnPb Solder www.vishay.com 4 For technical questions, contact: mlcc@vishay.com Document Number: 45157 Revision: 15-Jun-10 VJ 6040 VJ 6040 UHF Chip Antenna for Mobile Devices 300 T (°C) 250 Vishay Vitramon 10 s 260 °C ˜ 245 °C 10 s 215 °C 200 40 s 180 °C 150 130 °C 100 2 K/s 50 0 50 100 150 200 t (s) 250 Fig. 8 - Soldering Reflow with Sn Solder 300 T (°C) 250 200 Max. temperature Sn-Ag-Cu solder paste 150 Min. temperature 100 50 0 60 s to 120 s 60 s to 120 s 30 s to 60 s 60 s to 120 s Time Fig. 9 - Soldering IR Reflow with SnAgCu Solder ORDERING INFORMATION VISHAY MATERIAL PACKAGING QUANTITY VJ 6040 VJ6040M011SXISRA0 1000 pieces Document Number: 45157 Revision: 15-Jun-10 For technical questions, contact: mlcc@vishay.com www.vishay.com 5