VLMU3100-GS08

VLMU3100 www.vishay.com Vishay Semiconductors UV SMD LED PLCC-2 FEATURES • UV SMD LED with exceptional brightness • High efficient InGaN technology • Long life time due to silicone casting • Compatible equipment with automatic placement • EIA and ICE standard package 19225 • Compatible with IR reflow and vapor phase • Available in 8 mm tape DESCRIPTION • Low profile package The package of the VLMU3100 series is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear silicone which guarantees long life time. The viewing angle is 120°, package dimensions are 3.2 mm x 2.8 mm x 1.9 mm. • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Preconditioning according to JEDEC® level 2a • ESD-withstand voltage: up to 1 kV according to JESD22-A114-B PRODUCT GROUP AND PACKAGE DATA • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 • Product group: LED • Package: SMD PLCC-2 • Product series: standard APPLICATIONS • Angle of half intensity: ± 60° • Curing of glue and laquer • Lead-finishing: Ag • Recognition of safety features of money bills SAFETY ADVICES Depending on the mode of operation, these devices emit highly concentrated non visible ultraviolet light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 “Safety of Laser Products”. PARTS TABLE PART VLMU3100-GS08 COLOR Ultraviolet RADIANT INTENSITY (mW/sr) MIN. TYP. MAX. 1.8 2.5 3 at IF (mA) WAVELENGTH (nm) MIN. TYP. MAX. 20 400 405 410 at IF (mA) 20 FORWARD VOLTAGE at IF (V) TECHNOLOGY (mA) MIN. TYP. MAX. 2.8 3.2 3.8 20 InGaN ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) VLMU3100 PARAMETER TEST CONDITION Forward current Surge forward current Power dissipation Junction temperature tp ≤ 10 μs SYMBOL VALUE UNIT IF 30 mA IFSM 0.1 A Ptot 120 mW Tj +100 °C Operating temperature range Tamb -40 to +80 °C Storage temperature range Tstg -40 to +100 °C Solder temperature Tsol 260/5 °C/s Document Number: 82556 1 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Rev. 1.2, 26-Jun-17 VLMU3100 www.vishay.com Vishay Semiconductors OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) VLMU3100, ULTRAVIOLET PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Radiant intensity IF = 20 mA le 1.8 2.5 3 mW/sr mW Radiant power IF = 20 mA φe - 6.8 - Peak wavelength IF = 20 mA λp 400 405 410 nm Angle of half intensity IF = 20 mA ϕ - ± 60 - deg Forward voltage IF = 20 mA VF 2.8 3.2 3.8 V Reverse current VR = 5 V IR - - 10 μA TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 0° 30 25 20 15 10 5 0 0 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.6 0.4 0.2 0 95 10319 Fig. 1 - Forward Current vs. Ambient Temperature Fig. 3 - Relative Luminous Intensity vs. Angular Displacement 100 100 90 90 Irel - Relative Intensity (%) IF - Forward Current (mA) 20° 30° 10 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 10° ϕ - Angular Displacement IV rel - Relative Luminous Intensity IF - Forward Current (mA) 35 80 70 60 50 40 30 20 10 80 70 60 50 40 30 20 10 0 0 1 2 3 4 VF - Forward Voltage (V) Fig. 2 - Forward Current vs. Forward Voltage 5 0 375 400 425 450 475 λ - Wavelength (nm) Fig. 4 - Relative Intensity vs. Wavelength Document Number: 82556 2 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Rev. 1.2, 26-Jun-17 VLMU3100 www.vishay.com Vishay Semiconductors 2.4 Ie rel - Relative Radiant Intensity Relative Luminous Intensity (Tamb = 25 °C) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 2 4 6 8 10 12 14 16 18 20 IF - Forward Current (mA) Fig. 5 - Specific Luminous Intensity vs. Forward Current 2.0 1.6 1.2 0.8 0.4 0 -40 -20 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature PACKAGE DIMENSIONS in millimeters SOLDER PAD LAYOUT Document Number: 82556 3 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Rev. 1.2, 26-Jun-17 VLMU3100 www.vishay.com Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL SMD LED (VLM3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO 564) for automatic component insertation. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. ARRANGEMENT OF TAPE FEEDING DIRECTION SOLDERING PROFILE IR Reflow Soldering Profile for Lead (Pb)-Free Soldering Preconditioning according to JEDEC level 2a 300 Temperature (°C) 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s 50 DIMENSIONS OF REEL in millimeters max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 max. ramp down 6 °C/s 0 0 19885 50 100 150 Time (s) 200 250 300 max. 2 cycles allowed Fig. 7 - Vishay Lead (Pb)-Free Reflow Soldering Profile (according to J-STD-020C) Document Number: 82556 4 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Rev. 1.2, 26-Jun-17 VLMU3100 www.vishay.com Vishay Semiconductors BAR CODE PRODUCT LABEL (example only) RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: A B C D • Storage temperature 10 °C to 30 °C L E I G F H M K A. 2D barcode • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: B. Vishay part number C. Quantity D. SEL = selection code (binning) E. Code of manufacturing plant F. Batch = date code: year / week / plant code G. Region code 192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. H. SL = sales location I. Terminations finishing K. Lead (Pb)-free symbol L E V E L CAUTION This bag contains MOISTURE –SENSITIVE DEVICES L. Halogen-free symbol M. RoHS symbol 2a 1. Shelf life in sealed bag 12 months at