VS-16CDH02HM3
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Vishay Semiconductors
Hyperfast Rectifier, 2 x 8 A FRED Pt®
FEATURES
eSMP® Series
SMPD (TO-263AC)
• Hyperfast recovery time, reduced Qrr, and
soft recovery
• 175 °C maximum operating junction
temperature
• Specified for output and snubber operation
• Low forward voltage drop
• Low leakage current
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
• AEC-Q101 qualified, meets JESD 201 class 2 whisker test
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
K
1
2
Top View
Bottom View
Anode 1
Anode 2
K
Cathode
DESCRIPTION / APPLICATIONS
LINKS TO ADDITIONAL RESOURCES
State of the art hyperfast recovery rectifiers specifically
designed with optimized performance of forward voltage
drop and hyperfast recovery time.
The planar structure and the platinum doped life time control
guarantee the best overall performance, ruggedness, and
reliability characteristics.
These devices are intended for use in the output rectification
stage of SMPS, telecom, DC/DC converters as well as
freewheeling diode in low voltage inverters and chopper
motor drives.
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce power
dissipation in the switching element.
3D 3D
3D Models
PRIMARY CHARACTERISTICS
IF(AV)
2x8A
VR
200 V
VF at IF
0.77 V
trr
27 ns
TJ max.
175 °C
Package
SMPD (TO-263AC)
Circuit configuration
Common cathode
MECHANICAL DATA
Case: SMPD (TO-263AC)
Molding compound meets UL 94 V-0 flammability rating
Halogen-free, RoHS-compliant
Terminals: matte tin plated leads, solderable per
J-STD-002
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Peak repetitive reverse voltage
Average rectified forward current
Non-repetitive peak surge current
TEST CONDITIONS
VALUES
UNITS
200
V
VRRM
per device
per diode
per device
per diode
16
Tsolder pad = 155 °C
IF(AV)
IFSM
8
A
190
TJ = 25 °C, 6 ms square pulse
100
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking voltage
SYMBOL
VBR, VR
Forward voltage, per diode
VF
Reverse leakage current, per diode
IR
Junction capacitance, per diode
CT
TEST CONDITIONS
MIN.
TYP.
MAX.
200
-
-
IF = 8 A
-
0.93
1.03
IF = 8 A, TJ = 150 °C
-
0.77
0.87
IR = 100 μA
VR = VR rated
-
-
2
TJ = 150 °C, VR = VR rated
-
6
100
VR = 200 V
-
23
-
UNITS
V
μA
pF
Revision: 21-Jan-2021
Document Number: 95813
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
-
27
-
IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V
Reverse recovery time
trr
IF = 0.5 A, IR = 1 A, Irr = 0.25 A
-
-
25
TJ = 25 °C
-
23
-
-
35
-
-
2.8
-
-
5
-
TJ = 25 °C
-
30
-
TJ = 125 °C
-
90
-
MIN.
TYP.
MAX.
UNITS
TJ = 125 °C
Peak recovery current
IRRM
Reverse recovery charge
Qrr
UNITS
IF = 8 A,
dIF/dt = 200 A/μs,
VR = 160 V
TJ = 25 °C
TJ = 125 °C
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum junction and storage
temperature range
TJ, TStg
-55
-
+175
°C
Thermal resistance, per diode
junction to mount
RthJM
-
1.8
2.5
°C/W
Approximate weight
Case style SMPD (TO-263AC)
100
oz.
16CDH02
TJ = 175 °C
TJ = 175 °C
10
TJ = 150 °C
TJ = 125 °C
1
TJ = 25 °C
TJ = -40 °C
0.1
g
0.02
100
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
Marking device
0.55
10
TJ = 150 °C
1
TJ = 125 °C
0.1
0.01
TJ = 25 °C
0.001
0.0001
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
50
100
150
200
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Revision: 21-Jan-2021
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CT - Junction Capacitance (pF)
100
10
0
50
100
150
200
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Impedance
Junction to Case (°C/W)
10
1
0.50
0.20
0.10
0.05
0.02
0.01
DC
0.1
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
180
12
175
10
Average Power Loss (W)
Allowable Case Temperature (°C)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
170
165
DC
160
Square wave (D = 0.50)
80 % rated VR applied
155
150
RMS limit
8
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
DC
6
4
2
See note (1)
0
145
0
1
2
3
4
5
6
7
8
9
0
2
4
6
8
10
12
14
IF(AV) - Average Forward Current (A)
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 6 - Forward Power Loss Characteristics
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 5);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
Revision: 21-Jan-2021
Document Number: 95813
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-16CDH02HM3
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Vishay Semiconductors
45
180
40
160
140
35
125 °C
125 °C
120
Qrr (nC)
trr (ns)
30
25
20
100
80
25 °C
60
25 °C
15
40
10
20
5
0
100
1000
100
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 8 - Typical Stored Charge vs. dIF/dt
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
Revision: 21-Jan-2021
Document Number: 95813
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-16CDH02HM3
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ORDERING INFORMATION TABLE
Device code
VS-
16
C
D
H
02
H
M3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Current rating (16 A)
3
-
Circuit configuration:
C = common cathode
4
-
5
-
D = SMPD package
Process type,
H = hyperfast recovery
6
-
Voltage code (02 = 200 V)
7
-
H = AEC-Q101 qualified
8
-
M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER REEL
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-16CDH02HM3/I
2000
2000
13" diameter plastic tape and reel
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95604
Part marking information
www.vishay.com/doc?95566
Packaging information
www.vishay.com/doc?88869
Revision: 21-Jan-2021
Document Number: 95813
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
TO-263AC (SMPD)
DIMENSIONS in inches (millimeters)
TO-263AC (SMPD)
5()
WR
WR
120
Mounting Pad Layout
0,1
5()
120
5()
0,1
Revision: 02-Jun-14
Document Number: 95604
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Document Number: 91000