VS-20ETF10FP-M3, VS-20ETF12FP-M3
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Vishay Semiconductors
Fast Soft Recovery Rectifier Diode, 20 A
FEATURES
• Glass passivated pellet chip junction
• 150 °C max. operation junction temperature
1
Cathode
1
2
Anode
2
• Designed and qualified
JEDEC®-JESD 47
according
to
• Fully isolated package (VINS = 2500 VRMS)
• UL pending
2L TO-220 FullPAK
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
IF(AV)
20 A
VR
1000 V, 1200 V
VF at IF
1.31 V
IFSM
320 A
trr
95 ns
TJ max.
150 °C
Snap factor
0.6
Package
2L TO-220 FullPAK
Circuit configuration
Single
APPLICATIONS
These devices are intended for use in output rectification
and freewheeling in inverters, choppers and converters as
well as in input rectification where severe restrictions on
conducted EMI should be met.
DESCRIPTION
The VS-20ETF...FP... fast soft recovery rectifier series has
been optimized for combined short reverse recovery time
and low forward voltage drop.
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
VRRM
IF(AV)
Sinusoidal waveform
IFSM
VALUES
UNITS
1000, 1200
V
20
320
trr
1 A, 100 A/μs
VF
20 A, TJ = 25 °C
TJ
Range
95
A
ns
1.31
V
-40 to +150
°C
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VRSM, MAXIMUM
NON-REPETITIVE PEAK
REVERSE VOLTAGE
V
IRRM
AT 150 °C
mA
VS-20ETF10FP-M3
1000
1100
VS-20ETF12FP-M3
1200
1300
VOLTAGE RATINGS
PART NUMBER
6
Revision: 15-Sep-17
Document Number: 96297
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VS-20ETF10FP-M3, VS-20ETF12FP-M3
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average forward current
Maximum peak one cycle
non-repetitive surge current
IF(AV)
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
I2t
TEST CONDITIONS
VALUES
TC = 50 °C, 180° conduction half sine wave
20
10 ms sine pulse, rated VRRM applied
270
10 ms sine pulse, no voltage reapplied
320
UNITS
A
10 ms sine pulse, rated VRRM applied
365
10 ms sine pulse, no voltage reapplied
515
t = 0.1 ms to 10 ms, no voltage reapplied
5150
A2s
VALUES
UNITS
1.31
V
11.88
m
0.93
V
A2s
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
Forward slope resistance
VFM
rt
Threshold voltage
VF(TO)
Maximum reverse leakage current
IRM
TEST CONDITIONS
20 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
0.1
VR = Rated VRRM
TJ = 150 °C
mA
6
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Qrr
Snap factor
S
TEST CONDITIONS
IF at 20 Apk
25 A/μs
25 °C
Typical
VALUES
UNITS
400
ns
6.1
A
1.7
IFM
trr
ta
tb
t
dir
dt
μC
Qrr
IRM(REC)
0.6
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
Maximum thermal resistance,
junction to ambient
RthJA
Typical thermal resistance,
case to heatsink
RthCS
DC operation
VALUES
UNITS
-40 to +150
°C
2.5
62
Mounting surface, smooth, and greased
°C/W
0.5
2
g
0.07
oz.
minimum
6 (5)
maximum
12 (10)
kgf · cm
(lbf · in)
Approximate weight
Mounting torque
Marking device
Case style 2L TO-220 FullPAK
20ETF10FP
20ETF12FP
Revision: 15-Sep-17
Document Number: 96297
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VS-20ETF10FP-M3, VS-20ETF12FP-M3
Vishay Semiconductors
160
Maximum Average Forward Power Loss (W)
Maximum Allowable Case Temperature (°C)
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120
80
40
60°
30°
90°
120°
180°
0
0
4
8
12
16
20
Average Forward Current (A)
35
25
20
RMS limit
15
0
0
90°
DC
20
25
30
0
0
5
10
15
35
300
550
Average Forward Current (A)
Maximum Average Forward Power Loss (W)
Fig. 2 - Current Rating Characteristics
35
180°
120°
90°
60°
30°
30
25
20
RMS limit
15
Ø
10
Conduction angle
5
TJ = 150 °C
0
0
5
10
15
20
5
10
20
15
25
Average Forward Current (A)
Peak Half Sine Wave Forward Current (A)
60°
180°
TJ = 150 °C
5
Peak Half Sine Wave Forward Current (A)
Maximum Allowable Case Temperature (°C)
100
120°
Conduction period
Fig. 4 - Forward Power Loss Characteristics
150
30°
Ø
10
Fig. 1 - Current Rating Characteristics
50
180°
120°
90°
60°
30°
30
25
Average Forward Current (A)
Fig. 3 - Forward Power Loss Characteristics
At any rated load condition and with
rated VRRM applied following surge.
250
Initial TJ = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
200
150
100
50
1
10
100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
500
Maximum non-repetitive surge current
versus pulse train duration.
450
Initial TJ = 150 °C
No voltage reapplied
Rated VRRM reapplied
400
350
300
250
200
150
100
50
0.001
0.01
0.1
1
Pulse Train Duration (s)
Fig. 6 - Maximum Non-Repetitive Surge Current
Revision: 15-Sep-17
Document Number: 96297
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VS-20ETF10FP-M3, VS-20ETF12FP-M3
Instantaneous Forward Current (A)
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Vishay Semiconductors
1000
100
TJ = 25 °C
TJ = 150 °C
10
1
0
0.5
1.0
1.5
2.0
2.5
3.5
3.0
4.0
0.7
0.6
IFM = 30 A
IFM = 20 A
IFM = 10 A
0.5
IFM = 5 A
IFM = 1 A
0.4
0.3
0.2
0.1
0
0
50
100
150
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Qrr - Typical Reverse Recovery Charge (µC)
trr - Typical ReverseRecovery Time (µs)
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
1.2
TJ = 150 °C
0.9
IFM = 30 A
IFM = 20 A
IFM = 10 A
IFM = 5 A
IFM = 1 A
0.6
0.3
0
0
50
100
150
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
IFM = 30 A
TJ = 25 °C
5
IFM = 20 A
4
3
IFM = 10 A
2
IFM = 5 A
1
IFM = 1 A
0
0
50
100
150
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
Qrr - Typical ReverseRecovery Charge (µC)
trr - Typical Reverse Recovery Time (µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
6
10
IFM = 30 A
TJ = 150 °C
8
IFM = 20 A
6
IFM = 10 A
4
IFM = 5 A
2
IFM = 1 A
0
0
50
100
150
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
Revision: 15-Sep-17
Document Number: 96297
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETF10FP-M3, VS-20ETF12FP-M3
Vishay Semiconductors
Irr - Typical Reverse Recovery Current (A)
25
IFM = 30 A
TJ = 25 °C
IFM = 20 A
20
IFM = 10 A
15
IFM = 5 A
10
IFM = 1 A
5
0
0
50
100
150
200
35
TJ = 150 °C
IFM = 30 A
30
25
IFM = 20 A
20
IFM = 10 A
15
IFM = 5 A
10
IFM = 1 A
5
0
0
50
100
150
200
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
ZthJC - Transient Thermal Impedance (K/W)
Irr - Typical Reverse Recovery Current (A)
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10
D = 0.5
D = 0.2
1
D = 0.1
D = 0.05
D = 0.02
D = 0.01
0.1
0.01
1E-05
Single Pulse
(Thermal Resistance)
1E-04
1E-03
1E-02
1E-01
1E+00
1E+01
1E+02
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 15-Sep-17
Document Number: 96297
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETF10FP-M3, VS-20ETF12FP-M3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
20
E
T
F
12
FP
-M3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Current rating (20 = 20 A)
3
-
Circuit configuration:
E = single diode
4
-
5
-
Package:
T = TO-220
Type of silicon:
F = fast soft recovery rectifier
6
-
Voltage code x 100 = VRRM
7
-
FullPAK
8
-
Environmental digit:
10 = 1000 V
12 = 1200 V
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-20ETF10FP-M3
50
1000
Antistatic plastic tubes
VS-20ETF12FP-M3
50
1000
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96157
Part marking information
www.vishay.com/doc?95392
Revision: 15-Sep-17
Document Number: 96297
6
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
2L TO-220 FullPAK
DIMENSIONS in millimeters
3.40
Hole Ø 3.10
10.6
10.0
3.7
3.2
2.80
2.44
7.31
6.50
16.0
15.8
Mold flash bleeding
3.3
3.1
Exposed Cu
13.56
12.90
2.54 TYP.
0.61
0.38
0.9
0.7
2.85
2.65
1.20
1.47
1.30
1.05
2.54 TYP.
Bottom view
R 0.7
(2 places)
R 0.5
4.8
4.6
5° ± 0.5°
5° ± 0.5°
Revision: 06-Jul-17
Document Number: 96157
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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