VS-20ETS16-M3
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Vishay Semiconductors
High Voltage, Input Rectifier Diode, 20 A
FEATURES
Base cathode
2
• Very low forward voltage drop
2
• 150 °C max. operating junction temperature
• Glass passivated pellet chip junction
• Designed and qualified
JEDEC®-JESD 47
1
3
2L TO-220AC
1
Cathode
3
Anode
according
to
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
PRIMARY CHARACTERISTICS
IF(AV)
20 A
VR
1600 V
• Input rectification
• Vishay Semiconductors switches and output rectifiers
which are available in identical package outlines
VF at IF
1.1 V
DESCRIPTION
IFSM
300 A
High voltage rectifiers optimized for very low forward
voltage drop with moderate leakage.
TJ max.
150 °C
Package
2L TO-220AC
Circuit configuration
Single
These devices are intended for use in main rectification
(single or three phase bridge).
OUTPUT CURRENT IN TYPICAL APPLICATIONS
APPLICATIONS
SINGLE-PHASE BRIDGE
THREE-PHASE BRIDGE
UNITS
16.3
21
A
Capacitive input filter TA = 55 °C, TJ = 125 °C
common heatsink of 1 °C/W
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
IF(AV)
CHARACTERISTICS
UNITS
20
A
VRRM
1600
V
IFSM
300
A
VF
Sinusoidal waveform
VALUES
10 A, TJ = 25 °C
TJ
1.0
V
-40 to +150
°C
VOLTAGE RATINGS
PART NUMBER
VRRM, MAXIMUM
PEAK REVERSE VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
IRRM
AT 150 °C
mA
VS-20ETS16-M3
1600
1700
1
Revision: 16-Oct-17
Document Number: 93405
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VS-20ETS16-M3
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Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
IF(AV)
TC = 105 °C, 180° conduction half sine wave
20
10 ms sine pulse, rated VRRM applied
250
Maximum average forward current
Maximum peak one cycle
non-repetitive surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2√t for fusing
I2√t
VALUES
UNITS
A
10 ms sine pulse, no voltage reapplied
300
10 ms sine pulse, rated VRRM applied
316
10 ms sine pulse, no voltage reapplied
442
t = 0.1 ms to 10 ms, no voltage reapplied
4420
A2√s
VALUES
UNITS
1.1
V
10.4
mΩ
0.85
V
A2s
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
VFM
Forward slope resistance
rt
Threshold voltage
VF(TO)
Maximum reverse leakage current
IRM
TEST CONDITIONS
20 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
0.1
VR = Rated VRRM
TJ = 150 °C
mA
1.0
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
VALUES
UNITS
-40 to +150
°C
Maximum thermal resistance,
junction to case
RthJC
DC operation
1.3
Typical thermal resistance,
case to heatsink
RthCS
Mounting surface, smooth and greased
0.5
°C/W
2
g
0.07
oz.
minimum
6 (5)
maximum
12 (10)
kgf · cm
(lbf · in)
Approximate weight
Mounting torque
Marking device
Case style 2L TO-220AC
150
20ETS16
150
RthJC (DC) = 1.3 °C/W
140
Ø
130
Conduction angle
120
110
100
30°
60°
90° 120°
Maximum Allowable Case
Temperature (°C)
Maximum Allowable Case
Temperature (°C)
RthJC (DC) = 1.3 °C/W
140
130
Ø
Conduction period
120
30°
110
60°
90°
100
120°
180°
180°
DC
90
90
0
2
4
6
8
10 12 14 16 18 20 22
0
5
10
15
20
25
30
Average Forward Current (A)
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
Fig. 2 - Current Rating Characteristics
35
Revision: 16-Oct-17
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETS16-M3
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Vishay Semiconductors
300
180°
120°
90°
60°
30°
25
20
Peak Half Sine Wave
Forward Current (A)
Maxiumum Average Forward
Power Loss (W)
30
RMS limit
15
10
Ø
Conduction angle
5
250
200
150
100
TJ = 150 °C
50
0
0
4
8
12
16
20
1
24
Fig. 3 - Forward Power Loss Characteristics
35
300
25
Peak Half Sine Wave
Forward Current (A)
DC
180°
120°
90°
60°
30°
30
10
20
RMS limit
15
10
Ø
Conduction period
5
100
Number of Equal Amplitude
Half Cycle Current Pulse (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
Average Forward Current (A)
Maxiumum Average Forward
Power Loss (W)
At any rated load condition and with
rated VRRM applied following surge.
Initial TJ = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
Maximum non-repetitive surge current
versus pulse train duration.
Initial TJ = 150 °C
No voltage reapplied
Rated VRRM reapplied
250
200
150
100
TJ = 150 °C
50
0
0
5
10
15
20
0.1
0.01
25
1
Pulse Train Duration (s)
Fig. 4 - Forward Power Loss Characteristics
Fig. 6 - Maximum Non-Repetitive Surge Current
Instantaneous Forward Current (A)
Average Forward Current (A)
1000
TJ = 25 °C
TJ = 150 °C
100
10
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
Revision: 16-Oct-17
Document Number: 93405
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20ETS16-M3
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Vishay Semiconductors
ZthJC - Transient Thermal
Impedance (°C/W)
10
Steady state value
(DC operation)
1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
0.1
Single pulse
0.01
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Fig. 8 - Thermal Impedance ZthJC Characteristics
ORDERING INFORMATION TABLE
Device code
VS-
20
E
T
S
16
-M3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (20 = 20 A)
3
-
Circuit configuration:
E = TO-220AC
4
-
Package:
T = TO-220
5
-
Type of silicon:
S = standard recovery rectifier
6
-
Voltage rating (16 = 1600 V)
7
-
Environmental digit:
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
VS-20ETS16-M3
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
50
1000
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96156
Part marking information
www.vishay.com/doc?95391
Revision: 16-Oct-17
Document Number: 93405
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
2L TO-220AC
DIMENSIONS in millimeters and inches
A
0.014 M B A M
(6)
E
A
ØP
Q
B
A
(6)
(E)
A1
Thermal pad
1
(H1)
H1
C
D2
(6) D
2
D
D
L1 (2)
C
(6)
c
2xb
D1
2 x b2
Detail B
Detail B
A2
L
E1 (6)
C
(b, b2)
Base metal
A
c1 (4)
c
2x e
Plating
View A - A
e1
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead tip
Conforms to JEDEC® outline TO-220AC
SYMBOL
A
A1
A2
b
b1
b2
b3
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.25
4.65
1.14
1.40
2.50
2.92
0.69
1.01
0.38
0.97
1.20
1.73
1.14
1.73
0.36
0.61
0.36
0.56
14.85
15.35
8.38
9.02
INCHES
MIN.
MAX.
0.167
0.183
0.045
0.055
0.098
0.115
0.027
0.040
0.015
0.038
0.047
0.068
0.045
0.068
0.014
0.024
0.014
0.022
0.585
0.604
0.330
0.355
NOTES
4
4
4
3
SYMBOL
D2
E
E1
e
e1
H1
L
L1
ØP
Q
MILLIMETERS
MIN.
MAX.
11.68
13.30
10.11
10.51
6.86
8.89
2.41
2.67
4.88
5.28
6.09
6.48
13.52
14.02
3.32
3.82
3.54
3.91
2.60
3.00
INCHES
MIN.
MAX.
0.460
0.524
0.398
0.414
0.270
0.350
0.095
0.105
0.192
0.208
0.240
0.255
0.532
0.552
0.131
0.150
0.139
0.154
0.102
0.118
NOTES
6, 7
3, 6
6
6
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3, and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2, and E1
(7) Outline conforms to JEDEC® TO-220, except D2
Revision: 13-Jun-2019
Document Number: 96156
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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