VS-20TQ035S-M3, VS-20TQ040S-M3, VS-20TQ045S-M3
www.vishay.com
Vishay Semiconductors
High Performance Schottky Rectifier, 20 A
FEATURES
Base
cathode
2
•
•
•
•
150 °C TJ operation
Low forward voltage drop
High frequency operation
High
purity,
high
temperature
epoxy
encapsulation for enhanced mechanical
strength and moisture resistance
• Guard ring for enhanced ruggedness and long term
reliability
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 245 °C
2
1
1
N/C
3
D2PAK (TO-263AB)
3
Anode
LINKS TO ADDITIONAL RESOURCES
3D 3D
• Designed and qualified according to JEDEC®-JESD 47
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
3D Models
DESCRIPTION
PRIMARY CHARACTERISTICS
IF(AV)
20 A
VR
35 V, 40 V, 45 V
VF at IF
0.51 V
IRM typ.
105 mA at 125 °C
TJ max.
150 °C
EAS
Package
The VS-20TQ... Schottky rectifier series has been optimized
for very low forward voltage drop, with moderate leakage.
The proprietary barrier technology allows for reliable
operation up to 150 °C junction temperature. Typical
applications are in switching power supplies, converters,
freewheeling diodes, and reverse battery protection.
MECHANICAL DATA
27 mJ
D2PAK
Circuit configuration
(TO-263AB)
Case: D2PAK (TO-268AB)
Molding compound meets UL 94-V0 flammability rating
Single
Terminals:
J-STD-002
matte
tin
plated
leads,
solderable
per
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
IF(AV)
Rectangular waveform
VRRM
Range
IFSM
tp = 5 μs sine
VF
20 Apk, TJ = 125 °C
TJ
Range
VALUES
UNITS
20
A
35 to 45
V
1800
A
0.51
V
-55 to +150
°C
VOLTAGE RATINGS
PARAMETER
SYMBOL
Maximum DC reverse voltage
VR
Maximum working peak reverse voltage
VRWM
VS-20TQ035S-M3
VS-20TQ040S-M3
VS-20TQ045S-M3
UNITS
35
40
45
V
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum average forward current
See fig. 5
IF(AV)
Maximum peak one cycle non-repetitive
surge current, see fig. 7
IFSM
Non-repetitive avalanche energy
EAS
TJ = 25 °C, IAS = 4 A, L = 3.40 mH
27
mJ
IAR
Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum VA = 1.5 x VR typical
4
A
Repetitive avalanche current
50 % duty cycle at TC = 116 °C, rectangular waveform
5 μs sine or 3 μs rect. pulse
10 ms sine or 6 ms rect. pulse
Following any rated load
condition and with rated
VRRM applied
20
1800
A
400
Revision: 21-Dec-2021
Document Number: 94931
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20TQ035S-M3, VS-20TQ040S-M3, VS-20TQ045S-M3
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Vishay Semiconductors
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
20 A
Maximum forward voltage drop
See fig. 1
VFM (1)
VALUES
TJ = 25 °C
40 A
20 A
0.73
TJ = 25 °C
0.67
2.7
Maximum reverse leakage current
IRM (1)
Typical reverse leakage current
IRM (1)
Maximum junction capacitance
CT
VR = 5 VDC (test signal range 100 kHz to 1 MHz), 25 °C
Typical series inductance
LS
Measured lead to lead 5 mm from package body
Maximum voltage rate of change
dV/dt
VR = Rated VR
TJ = 125 °C
TJ = 125 °C
V
0.51
TJ = 125 °C
40 A
UNITS
0.57
mA
150
VR = Rated VR
105
mA
1400
pF
8.0
nH
10 000
V/μs
VALUES
UNITS
-55 to 150
°C
Rated VR
Note
(1) Pulse width < 300 μs, duty cycle < 2 %
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
DC operation
See fig. 4
1.50
Typical thermal resistance,
case to heatsink
RthCS
Mounting surface, smooth, and greased
0.50
°C/W
2
g
0.07
oz.
minimum
6 (5)
maximum
12 (10)
kgf ⋅ cm
(lbf ⋅ in)
Approximate weight
Mounting torque
1000
IR - Reverse Current (mA)
1000
IF - Instantaneous
Forward Current (A)
20TQ035S
20TQ040S
20TQ045S
Case style D2PAK (TO-263AB)
Marking device
100
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
10
1
0.1
TJ = 150 °C
100
TJ = 125 °C
10
TJ = 100 °C
1
TJ = 75 °C
TJ = 50 °C
0.1
TJ = 25 °C
0.01
0.001
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
5
10
15
20
25
30
35
40
45
VFM - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Revision: 21-Dec-2021
Document Number: 94931
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20TQ035S-M3, VS-20TQ040S-M3, VS-20TQ045S-M3
www.vishay.com
Vishay Semiconductors
CT - Junction Capacitance (pF)
10 000
TJ = 25 °C
100
0
10
20
30
50
40
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
1
PDM
0.1
t1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
0.01
Single pulse
(thermal resistance)
0.001
0.00001
0.0001
0.001
0.01
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
0.1
10
1
100
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
18
D = 0.08
D = 0.17
D = 0.25
D = 0.33
D = 0.50
16
20TQ
RthJC (DC) = 1.50 °C/W
Average Power Loss (W)
Allowable Case Temperature (°C)
155
145
135
DC
125
14
12
10
RMS limit
8
6
DC
4
2
0
115
0
5
10
15
20
25
30
0
5
10
15
20
25
30
IF(AV) - Average Forward Current (A)
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 6 - Forward Power Loss Characteristics
Revision: 21-Dec-2021
Document Number: 94931
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20TQ035S-M3, VS-20TQ040S-M3, VS-20TQ045S-M3
www.vishay.com
IFSM - Non-Repetitive Surge Current (A)
Vishay Semiconductors
10 000
At any rated load condition
and with rated VRRM applied
following surge
1000
100
10
100
10 000
1000
tp - Square Wave Pulse Duration (µs)
Fig. 7 - Maximum Non-Repetitive Surge Current
L
High-speed
switch
IRFP460
D.U.T.
Freewheel
diode
Rg = 25 Ω
Current
monitor
+ Vd = 25 V
40HFL40S02
Fig. 8 - Unclamped Inductive Test Circuit
ORDERING INFORMATION TABLE
Device code
VS-
20
T
Q
045
S
1
2
3
4
5
6
1
-
Vishay Semiconductors product
2
-
Current rating (20 A)
3
-
Package: T = TO-220
4
-
Schottky “Q” series
5
-
Voltage ratings
6
-
S = D2PAK
7
-
TRL -M3
7
8
035 = 35 V
040 = 40 V
045 = 45 V
None = tube
TRL = tape and reel (left oriented)
TRR = tape and reel (right oriented)
8
-
-M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free
Revision: 21-Dec-2021
Document Number: 94931
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-20TQ035S-M3, VS-20TQ040S-M3, VS-20TQ045S-M3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION
PREFERRED P/N
BASE QUANTITY
VS-20TQ035S-M3
50
PACKAGING DESCRIPTION
Antistatic plastic tubes
VS-20TQ035STRL-M3
800
13" diameter plastic tape and reel
VS-20TQ035STRR-M3
800
13" diameter plastic tape and reel
VS-20TQ040S-M3
50
Antistatic plastic tubes
VS-20TQ040STRL-M3
800
13" diameter plastic tape and reel
VS-20TQ040STRR-M3
800
13" diameter plastic tape and reel
VS-20TQ045S-M3
50
Antistatic plastic tubes
VS-20TQ045STRL-M3
800
13" diameter plastic tape and reel
VS-20TQ045STRR-M3
800
13" diameter plastic tape and reel
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96164
Part marking information
www.vishay.com/doc?95444
Packaging information
www.vishay.com/doc?96424
SPICE model
www.vishay.com/doc?96917
Revision: 21-Dec-2021
Document Number: 94931
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
D2PAK
DIMENSIONS in millimeters and inches
Conforms to JEDEC® outline D2 PAK (SMD-220)
(2)(3)
E
B
Pad layout
A
A
(E)
c2
11.00
MIN.
(0.43)
A
(3) L1
4
9.65
MIN.
(0.38)
(D1) (3)
Detail A
D
H
1
2
17.90 (0.70)
15.00 (0.625)
(2)
3
3.81
MIN.
(0.15)
L2
B
B
2.32
MIN.
(0.08)
A
2 x b2
c
2.64 (0.103)
2.41 (0.096)
(3)
E1
C
View A - A
2xb
± 0.004 M B
0.010 M A M B
Plating
Base
Metal
(4)
b1, b3
H
2x e
Gauge
plane
c1 (4)
(c)
B
0° to 8°
Seating
plane
L3
Lead tip
A1
L
(b, b2)
L4
Section B - B and C - C
Scale: None
Detail “A”
Rotated 90 °CW
Scale: 8:1
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
MAX.
NOTES
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
MAX.
NOTES
A
4.06
4.83
0.160
0.190
D1
6.86
8.00
0.270
0.315
3
A1
0.00
0.254
0.000
0.010
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
4
e
2.54 BSC
0.100 BSC
H
14.61
15.88
0.575
0.625
4
L
1.78
2.79
0.070
0.110
L1
-
1.65
-
0.066
4
L2
1.27
1.78
0.050
0.070
2
L4
L3
0.25 BSC
4.78
5.28
3
0.010 BSC
0.188
0.208
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inch
(7) Outline conforms to JEDEC® outline TO-263AB
Revision: 08-Jul-15
Document Number: 95046
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
D2PAK
DIMENSIONS in millimeters and inches
Conforms to JEDEC® outline D2 PAK (SMD-220)
(2)(3)
E
B
Pad layout
A
A
(E)
c2
11.00
MIN.
(0.43)
A
(3) L1
4
9.65
MIN.
(0.38)
(D1) (3)
Detail A
D
H
1
2
17.90 (0.70)
15.00 (0.625)
(2)
3
3.81
MIN.
(0.15)
L2
B
B
2.32
MIN.
(0.08)
A
2 x b2
C
2xb
2.64 (0.103)
2.41 (0.096)
(3)
E1
c
View A - A
± 0.004 M B
0.010 M A M B
2x e
Plating
Base
Metal
(4)
b1, b3
H
Gauge
plane
L
Seating
plane
L3
A1
Lead tip
(b, b2)
L4
Section B - B and C - C
Scale: None
Detail “A”
Rotated 90 °CW
Scale: 8:1
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
c1 (4)
(c)
B
0° to 8°
MAX.
NOTES
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
MAX.
NOTES
A
4.06
4.83
0.160
0.190
D1
6.86
8.00
0.270
0.315
3
A1
0.00
0.254
0.000
0.010
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
4
4
e
2.54 BSC
0.100 BSC
H
14.61
15.88
0.575
0.625
0.110
L
1.78
2.79
0.070
L1
-
1.65
-
0.066
4
L2
1.27
1.78
0.050
0.070
2
L4
L3
0.25 BSC
4.78
5.28
3
0.010 BSC
0.188
0.208
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inches
(7) Outline conforms to JEDEC® outline TO-263AB
Revision: 13-Jul-17
Document Number: 96164
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
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with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
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parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
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Revision: 01-Jan-2022
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Document Number: 91000