VS-2EJH02-M3
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Vishay Semiconductors
Hyperfast Rectifier, 2 A FRED Pt®
FEATURES
eSMP® Series
Top View
• Hyperfast recovery time, reduced Qrr, and soft
recovery
• 175 °C maximum operating junction temperature
• Low forward voltage drop
• Low leakage current
• Specific for output and snubber operation
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
• Meets JESD 201 class 2 whisker test
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Bottom View
SlimSMA (DO-221AC)
Cathode
Anode
DESCRIPTION / APPLICATIONS
LINKS TO ADDITIONAL RESOURCES
State of the art hyperfast recovery rectifiers specifically
designed with optimized performance of forward voltage
drop and hyperfast recovery time.
The planar structure and the platinum doped life time control
guarantee the best overall performance, ruggedness and
reliability characteristics.
These devices are intended for use in snubber, boost,
lighting, as high frequency rectifiers and freewheeling
diodes.
The extremely optimized stored charge and low recovery
current minimize the switching losses and reduce power
dissipation in the switching element.
3D 3D
3D Models
PRIMARY CHARACTERISTICS
IF(AV)
2A
VR
200 V
VF at IF
0.72 V
trr
25 ns
TJ max.
175 °C
Package
SlimSMA (DO-221AC)
Circuit configuration
Single
MECHANICAL DATA
Case: SlimSMA (DO-221AC)
Molding compound meets UL 94 V-0 flammability rating
Terminals: matte tin plated leads, solderable per
J-STD-002
Polarity: color band denotes cathode end
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
200
V
Peak repetitive reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 155 °C (1)
2
Non-repetitive peak surge current
IFSM
TJ = 25 °C
65
Operating junction and storage temperatures
TJ, TStg
A
-65 to +175
°C
Note
(1) Device on PCB with 8 mm x 16 mm soldering lands
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking voltage
SYMBOL
VBR, VR
Forward voltage
VF
Reverse leakage current
IR
Junction capacitance
CT
TEST CONDITIONS
MIN.
TYP.
MAX.
200
-
-
IF = 2 A
-
0.85
0.93
IF = 2 A, TJ = 125 °C
-
0.72
0.77
VR = VR rated
-
-
2
TJ = 125 °C, VR = VR rated
-
1
8
VR = 200 V
-
10
-
IR = 100 μA
UNITS
V
μA
pF
Revision: 04-Feb-2021
Document Number: 94881
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-2EJH02-M3
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Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
trr
MIN.
TYP.
MAX.
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V
TEST CONDITIONS
-
25
-
IF = 0.5 A, IR = 1 A, Irr = 0.25 A
-
-
25
TJ = 25 °C
-
17
-
-
24
-
-
2
-
-
3
-
TJ = 125 °C
Peak recovery current
TJ = 25 °C
IRRM
Reverse recovery charge
TJ = 125 °C
Qrr
IF = 2 A
dIF/dt = 200 A/μs
VR = 160 V
TJ = 25 °C
-
17
-
TJ = 125 °C
-
37
-
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Maximum junction and
storage temperature range
TEST CONDITIONS
TJ, TStg
MIN.
TYP.
MAX.
UNITS
-65
-
175
°C
Thermal resistance,
junction to mount
RthJM
Device mounted on PCB with
8 mm x 16 mm soldering lands
-
-
12
Thermal resistance,
junction to ambient
RthJA
Device mounted on PCB with
2 mm x 3.5 mm soldering lands
-
-
115
°C/W
Approximate weight
Case style SlimSMA (DO-221AC)
100
g
oz.
2H2
100
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
Marking device
0.03
0.0011
TJ = 175 °C
10
TJ = 150 °C
1
TJ = 125 °C
TJ = 25 °C
175 °C
10
150 °C
1
125 °C
0.1
25 °C
0.01
0.001
TJ = -40 °C
0.1
0.0001
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
50
100
150
200
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Revision: 04-Feb-2021
Document Number: 94881
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-2EJH02-M3
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Vishay Semiconductors
2.5
RMS limit
Average Power Loss (W)
CT - Junction Capacitance (pF)
100
10
2
1.5
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
DC
1
0.5
0
1
0
50
100
150
200
0
3
IF(AV) - Average Forward Current (A)
VR - Reverse Voltage (V)
Fig. 5 - Forward Power Loss Characteristics
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
180
35
175
30
170
25
DC
trr (ns)
Allowable Case Temperature (°C)
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
165
160
125 °C
20
15
Square wave (D = 0.50)
80 % rated VR applied
155
25 °C
10
See note (1)
150
5
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
100
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 4 - Maximum Allowable Case Temperature
vs. Average Forward Current
Fig. 6 - Typical Reverse Recovery Time vs. dIF/dt
55
50
45
125 °C
Qrr (nC)
40
35
30
25
25 °C
20
15
100
1000
dIF/dt (A/µs)
Fig. 7 - Typical Stored Charge vs. dIF/dt
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see Fig. 6);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
Revision: 04-Feb-2021
Document Number: 94881
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-2EJH02-M3
www.vishay.com
Vishay Semiconductors
(3)
trr
IF
ta
tb
0
(4)
Qrr
(2)
IRRM
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(4) Qrr - area under curve defined by trr
and IRRM
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
Qrr =
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 8 - Reverse Recovery Waveform and Definitions
ORDERING INFORMATION TABLE
Device code
VS-
2
E
J
H
02
-M3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (2 = 2 A)
3
-
Circuit configuration:
E = single diode
4
-
J = SlimSMA package
5
-
Process type,
6
-
Voltage code (02 = 200 V)
7
-
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
H = hyperfast recovery
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER REEL
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-2EJH02-M3/6A
3500
3500
7"diameter plastic tape and reel
VS-2EJH02-M3/6B
14 000
14 000
13"diameter plastic tape and reel
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95571
Part marking information
www.vishay.com/doc?95562
Packaging information
www.vishay.com/doc?88869
SPICE model
www.vishay.com/doc?96861
Revision: 04-Feb-2021
Document Number: 94881
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
DO-221AC (SlimSMA)
DIMENSIONS in inches (millimeters)
Cathode Band
0.057 (1.45)
0.049 (1.25)
0.106 (2.70)
0.098 (2.50)
0.171 (4.35)
0.163 (4.15)
0.211 (5.35)
0.199 (5.05)
0.047 (1.20)
0.030 (0.75)
Typ.: 0.019 (0.48)
Mounting Pad Layout
0.039 (1.00)
0.035 (0.90)
0.060 (1.52)
MIN.
0.012 (0.30)
0.006 (0.15)
0.047 (1.20)
MIN.
0.123 (3.12) MAX.
0.217 (5.52) REF.
0.047 (1.20)
MIN.
Revision: 21-Jul-14
Document Number: 95571
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2022
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Document Number: 91000