VS-2EQH01HM3, VS-2EQH02HM3
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Vishay Semiconductors
Ultrafast Rectifier, 2 A FRED Pt®
FEATURES
eSMP® Series
• Very low profile - typical height of 0.65 mm
• Ideal for automated placement
• Low forward voltage drop, low power losses
• Low leakage current
Top View
• Meets MSL level 1, per
LF maximum peak of 260 °C
Bottom View
• For PFC, CRM snubber operation
MicroSMP (DO-219AD)
Anode
J-STD-020,
• AEC-Q101 qualified
Cathode
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
3D 3D
TYPICAL APPLICATIONS
3D Models
For use in high frequency, freewheeling, DC/DC converters,
PFC, and in snubber industrial and automotive applications.
PRIMARY CHARACTERISTICS
MECHANICAL DATA
IF(AV)
2A
VR
100 V, 200 V
VF at IF
0.82 V
trr (typ.)
33 ns
Case: MicroSMP (DO-219AD)
Molding compound meets UL 94 V-0 flammability rating
Terminals: matte tin plated leads, solderable
J-STD-002, meets JESD 201 class 2 whisker test
IFSM
30 A
TJ max.
175 °C
Package
MicroSMP (DO-219AD)
Circuit configuration
Single
per
Polarity: color band denotes cathode end
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Peak repetitive reverse voltage
SYMBOL
VS-2EQH01HM3
VS-2EQH02HM3
TEST CONDITIONS
VALUES
UNITS
100
V
VRRM
200
Average rectified forward current
IF(AV)
TM = 137 °C
2
Non-repetitive peak surge current
IFSM
TJ = 25 °C, 10 ms sine pulse
30
Operating junction and storage temperatures
TJ, TStg
A
-55 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
Forward voltage
SYMBOL
VS-2EQH01HM3
VS-2EQH02HM3
VBR,
VR
VF
Reverse leakage current
IR
Junction capacitance
CT
TEST CONDITIONS
IR = 100 μA
MIN.
TYP.
MAX.
100
-
-
200
IF = 2 A
-
0.96
1.05
0.84
IF = 2 A, TJ = 150 °C
-
0.82
VR = VR rated
-
-
1
TJ = 150 °C, VR = VR rated
-
-
25
VR = 200 V
-
6
-
UNITS
V
μA
pF
Revision: 08-Nov-2021
Document Number: 96564
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-2EQH01HM3, VS-2EQH02HM3
www.vishay.com
Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V
Reverse recovery time
trr
IRRM
Reverse recovery charge
Qrr
TYP.
MAX.
-
33
-
IF = 0.5 A, IR = 1 A, Irr = 0.25 A
-
-
23
TJ = 25 °C
-
19
-
-
33
-
-
1.7
-
-
2.5
-
TJ = 125 °C
Peak recovery current
MIN.
IF = 2 A
dIF/dt = 200 A/μs
VR = 100 V
TJ = 25 °C
TJ = 125 °C
UNITS
ns
A
TJ = 25 °C
-
15
-
TJ = 125 °C
-
34
-
MIN.
TYP.
MAX.
UNITS
-55
-
175
°C
-
16
20
-
160
-
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage temperature
range
TJ, TStg
Thermal resistance, junction to mount
RthJM (1)
Thermal resistance, junction to ambient
RthJA
VS-2EQH01HM3
Marking device
TEST CONDITIONS
Device mounted on FR4 PCB, 2 oz.
standard footprint
2H1
Case style MicroSMP (DO-219AD)
VS-2EQH02HM3
°C/W
2H2
100
10
175 °C
IR - Reverse Current (μA)
IF - Instantaneous Forward Current (A)
Note
(1) Thermal resistance junction to mount follows JEDEC® 51-14 transient dual interface test method (TDIM)
10
TJ = 175 °C
1
TJ = 150 °C
TJ = 125 °C
150 °C
1
125 °C
0.1
25 °C
TJ = 25 °C
TJ = -40 °C
0.01
0.1
0.2
0.7
1.2
1.7
2.2
2.7
0
25
50
75
100
125
150
175
200
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Revision: 08-Nov-2021
Document Number: 96564
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-2EQH01HM3, VS-2EQH02HM3
www.vishay.com
Vishay Semiconductors
CT - Junction Capacitance (pF)
100
10
1
0
50
100
150
200
VR - Reverse Voltage (V)
ZthJM - Thermal Impedance
Junction to Mount (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
0.50
0.20
0.10
0.05
0.02
0.01
DC
1
0.1
0.00001
0.0001
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Transient Thermal Impedance, Junction to Mount
2.5
170
Average Power Loss (W)
Allowable Mount Temperature (°C)
180
160
DC
150
Square wave (D = 0.50)
Rated VR applied
140
130
2
RMS limit
1.5
D = 0.01
D = 0.05
D = 0.1
D = 0.2
D = 0.5
DC
1
0.5
0
120
0
0.5
1
1.5
2
2.5
0
0.5
1
1.5
2
2.5
3
3.5
IF(AV) - Average Forward Current (A)
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Mount Temperature
vs. Average Forward Current
Fig. 6 - Forward Power Loss Characteristics
Note
Formula used: TM = TJ - (Pd + PdREV) x RthJM;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 5);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
Revision: 08-Nov-2021
Document Number: 96564
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-2EQH01HM3, VS-2EQH02HM3
www.vishay.com
Vishay Semiconductors
45
50
40
45
35
35
25
Qrr (nC)
30
trr (ns)
125 °C
40
125 °C
20
30
25 °C
25
20
15
15
25 °C
10
10
5
5
100
100
1000
1000
dIF/dt (A/μs)
dIF/dt (A/μs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 8 - Typical Stored Charge vs. dIF/dt
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
Revision: 08-Nov-2021
Document Number: 96564
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-2EQH01HM3, VS-2EQH02HM3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
2
E
Q
H
02
H
M3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Current rating (2 = 2 A)
3
-
Circuit configuration:
E = single diode
4
-
Q = MicroSMP package
5
-
Process type,
H = ultrafast recovery
6
-
Voltage code (02 = 200 V)
7
-
H = AEC-Q101 qualified
8
-
M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
PREFERRED PACKAGE CODE
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-2EQH01HM3/H
H
4500
7" diameter plastic tape and reel
VS-2EQH02HM3/H
H
4500
7" diameter plastic tape and reel
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96591
Part marking information
www.vishay.com/doc?96590
Packaging information
www.vishay.com/doc?88869
SPICE model
www.vishay.com/doc?96595
Revision: 08-Nov-2021
Document Number: 96564
5
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
MicroSMP (DO-219AD), FRED Pt®
DIMENSIONS in inches (millimeters)
0.059 (1.50)
0.043 (1.10)
Cathode Band
0.055 (1.40)
0.047 (1.20)
0.030 (0.75)
0.022 (0.55)
0.039 (0.98)
0.031 (0.78)
0.030 (0.75)
0.022 (0.55)
0.091 (2.30)
0.083 (2.10)
0.106 (2.70)
0.091 (2.30)
Mounting Pad Layout
0.029 (0.73)
0.025 (0.63)
0.079
(2.00)
0.011 (0.27)
0.005 (0.12)
0.043
(1.10)
0.032
(0.80)
0.032
(0.80)
0.020 (0.50)
Revision: 13-Feb-2019
Document Number: 96591
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Vishay
Disclaimer
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Revision: 09-Jul-2021
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Document Number: 91000