VS-30.PF0.PbF Series, VS-30.PF0.-M3 Series
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Vishay Semiconductors
Fast Soft Recovery Rectifier Diode, 30 A
FEATURES
• Glass passivated pellet chip junction
• 150 °C max. operating junction temperature
2
3
1
1
3
2
• Designed and qualified
JEDEC®-JESD 47
TO-247AC
TO-247AC modified
2
2
according
to
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Base
cathode
Base
cathode
• Low forward voltage drop and short reverse
recovery time
Available
APPLICATIONS
1
Cathode
3
Anode
Anode
1
VS-30EPF0...
Anode
3
VS-30APF0...
DESCRIPTION
PRODUCT SUMMARY
Package
TO-247AC modified (2 pins), TO-247AC
IF(AV)
30 A
VR
200 V, 400 V, 600 V
VF at IF
1.41 V
IFSM
320 A
trr
60 ns
TJ max.
150 °C
Diode variation
Single die
Snap factor
0.6
These devices are intended for use in output rectification
and freewheeling in inverters, choppers and converters as
well as in input rectification where severe restrictions on
conducted EMI should be met.
The VS-30EPF0... and VS-30APF0... soft recovery rectifier
series has been optimized for combined short reverse
recovery time and low forward voltage drop.
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
IF(AV)
CHARACTERISTICS
Sinusoidal waveform
VALUES
UNITS
30
A
VRRM
200 to 600
V
IFSM
320
A
VF
10 A, TJ = 25 °C
1.2
V
trr
1 A, 100 A/μs
60
ns
-40 to +150
°C
TJ
VOLTAGE RATINGS
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
VS-30EPF02PbF, VS-30APF02PbF
VS-30EPF02-M3, VS-30APF02-M3
200
300
VS-30EPF04PbF, VS-30APF04PbF
VS-30EPF04-M3, VS-30APF04-M3
400
500
VS-30EPF06PbF, VS-30APF06PbF
VS-30EPF06-M3, VS-30APF06-M3
600
700
PART NUMBER
IRRM
AT 150 °C
mA
5
Revision: 11-Feb-16
Document Number: 93693
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VS-30.PF0.PbF Series, VS-30.PF0.-M3 Series
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Maximum average forward current
Maximum peak one cycle
non-repetitive surge current
SYMBOL
TEST CONDITIONS
IF(AV)
TC = 98 °C, 180° conduction half sine wave
30
10 ms sine pulse, rated VRRM applied
270
10 ms sine pulse, no voltage reapplied
320
10 ms sine pulse, rated VRRM applied
365
10 ms sine pulse, no voltage reapplied
515
t = 0.1 ms to 10 ms, no voltage reapplied
5150
A2s
VALUES
UNITS
1.41
V
12.5
m
0.9
V
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
I2t
VALUES
UNITS
A
A2s
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
Forward slope resistance
VFM
rt
Threshold voltage
VF(TO)
Maximum reverse leakage current
IRM
TEST CONDITIONS
30 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
0.1
VR = Rated VRRM
TJ = 150 °C
mA
5.0
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Qrr
Snap factor
S
TEST CONDITIONS
IF at 20 Apk
100 A/μs
25 °C
Typical
VALUES
UNITS
160
ns
10
A
1.25
μC
IFM
trr
ta
tb
t
dir
dt
0.6
Qrr
IRM(REC)
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
Maximum thermal resistance,
junction to ambient
RthJA
Maximum thermal resistance,
case to heatsink
RthCS
DC operation
UNITS
-40 to +150
°C
0.8
°C/W
40
Mounting surface, smooth and greased
Approximate weight
Mounting torque
VALUES
0.2
6
g
0.21
oz.
minimum
6 (5)
maximum
12 (10)
kgf · cm
(lbf · in)
30EPF02
Case style TO-247AC modified
30EPF04
30EPF06
Marking device
30APF02
Case style TO-247AC
30APF04
30APF06
Revision: 11-Feb-16
Document Number: 93693
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-30.PF0.PbF Series, VS-30.PF0.-M3 Series
www.vishay.com
Vishay Semiconductors
45
30.PF.. Series
RthJC (DC) = 0.8 K/W
140
Maximum Average Forward
Power Loss (W)
Maximum Allowable Case
Temperature (°C)
150
130
Ø
Conduction angle
120
110
30°
60°
100
90°
120° 180°
5
0
15
10
25
20
30
30
DC
25
20
RMS limit
15
Ø
Conduction period
10
30.PF.. Series
TJ = 150 °C
5
35
0
5
10
20
15
25
30
35
Average Forward Current (A)
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
Fig. 4 - Forward Power Loss Characteristics
300
150
30.PF.. Series
RthJC (DC) = 0.8 K/W
140
130
260
Ø
Conduction period
120
30°
110
60°
90°
100
At any rated load condition and with
rated VRRM applied following surge.
Initial TJ = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
280
Peak Half Sine Wave
Forward Current (A)
Maximum Allowable Case
Temperature (°C)
35
0
90
240
220
200
180
160
140
120
100
120°
VS-30.PF.. Series
80
DC
180°
60
90
0
5
10
15
20
25
30
35
40
45
50
1
10
100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
Average Forward Current (A)
Fig. 2 - Current Rating Characteristics
350
35
180°
120°
90°
60°
30°
30
25
RMS limit
20
15
Ø
10
Conduction angle
5
0
5
10
15
20
250
200
150
100
50
30.PF.. Series
TJ = 150 °C
0
Maximum non-repetitive surge current
versus pulse train duration.
Initial TJ = 150 °C
No voltage reapplied
Rated VRRM reapplied
300
Peak Half Sine Wave
Forward Current (A)
Maximum Average Forward
Power Loss (W)
180°
120°
90°
60°
30°
40
25
VS-30.PF.. Series
0
0.01
0.1
1
10
Average Forward Current (A)
Pulse Train Duration (s)
Fig. 3 - Forward Power Loss Characteristics
Fig. 6 - Maximum Non-Repetitive Surge Current
Revision: 11-Feb-16
Document Number: 93693
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-30.PF0.PbF Series, VS-30.PF0.-M3 Series
Instantaneous Forward Current (A)
www.vishay.com
Vishay Semiconductors
1000
100
TJ = 25 °C
TJ = 150 °C
10
30.PF.. Series
1
0
1
2
3
4
5
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
trr - Typical Reverse
Recovery Time (µs)
30.PF.. Series
TJ = 25 °C
0.15
4.0
IFM = 30 A
IFM = 20 A
IFM = 10 A
IFM = 30 A
IFM = 5 A
IFM = 1 A
0.10
0.05
0
IFM = 20 A
3.0
2.5
2.0
IFM = 10 A
1.5
1.0
IFM = 5 A
0.5
IFM = 1 A
0
0
200
400
600
800
1000
0
200
400
800
600
1000
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
10
0.5
30.PF.. Series
TJ = 150 °C
0.4
IFM = 30 A
IFM = 20 A
IFM = 10 A
IFM = 5 A
IFM = 1 A
0.3
0.2
30.PF.. Series
TJ = 150 °C
9
Qrr - Typical Reverse
Recovery Charge (µC)
trr - Typical Reverse
Recovery Time (µs)
30.PF.. Series
TJ = 25 °C
3.5
Qrr - Typical Reverse
Recovery Charge (µC)
0.20
0.1
IFM = 30 A
8
7
IFM = 20 A
6
5
IFM = 10 A
4
3
IFM = 5 A
2
1
IFM = 1 A
0
0
0
200
400
600
800
1000
0
200
400
600
800
1000
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
Revision: 11-Feb-16
Document Number: 93693
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-30.PF0.PbF Series, VS-30.PF0.-M3 Series
www.vishay.com
Vishay Semiconductors
70
100
30.PF.. Series
TJ = 25 °C
30.PF.. Series
TJ = 150 °C
IFM = 30 A
Irr - Typical Reverse
Recovery Current (A)
Irr - Typical Reverse
Recovery Current (A)
60
IFM = 20 A
50
40
IFM = 10 A
30
IFM = 5 A
20
IFM = 1 A
10
IFM = 30 A
80
IFM = 20 A
60
IFM = 10 A
40
IFM = 5 A
20
IFM = 1 A
0
0
0
200
400
600
800
1000
0
200
400
600
800
1000
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
ZthJC - Transient Thermal Impedance (K/W)
dI/dt - Rate of Fall of Forward Current (A/µs)
10
1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Steady state value
(DC operation)
0.1
30.PF.. Series
Single pulse
0.01
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 11-Feb-16
Document Number: 93693
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-30.PF0.PbF Series, VS-30.PF0.-M3 Series
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
30
E
P
F
06
PbF
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (30 = 30 A)
3
-
Circuit configuration:
E = single diode
A = single diode, 3 pins
4
-
Package:
P = TO-247AC/TO-247AC modified
5
-
Type of silicon:
6
-
Voltage code x 100 = VRRM
7
-
Environmental digit:
F = fast recovery
02 = 200 V
04 = 400 V
06 = 600 V
PbF = lead (Pb)-free and RoHS-compliant
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-30EPF02PbF
25
500
Antistatic plastic tubes
VS-30EPF02-M3
25
500
Antistatic plastic tubes
VS-30APF02PbF
25
500
Antistatic plastic tubes
VS-30APF02-M3
25
500
Antistatic plastic tubes
VS-30EPF04PbF
25
500
Antistatic plastic tubes
VS-30EPF04-M3
25
500
Antistatic plastic tubes
VS-30APF04PbF
25
500
Antistatic plastic tubes
VS-30APF04-M3
25
500
Antistatic plastic tubes
VS-30EPF06PbF
25
500
Antistatic plastic tubes
VS-30EPF06-M3
25
500
Antistatic plastic tubes
VS-30APF06PbF
25
500
Antistatic plastic tubes
VS-30APF06-M3
25
500
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
TO-247AC modified
www.vishay.com/doc?95541
TO-247AC
www.vishay.com/doc?95542
TO-247AC modified PbF
www.vishay.com/doc?95255
TO-247AC modified -M3
www.vishay.com/doc?95442
TO-247AC PbF
www.vishay.com/doc?95226
TO-247AC -M3
www.vishay.com/doc?95007
Revision: 11-Feb-16
Document Number: 93693
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
TO-247 - 50 mils L/F modified
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Ø P
E
B
(2) R/2
N
A2
S
(Datum B)
Ø K M DBM
Ø P1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
A
See view B
2 x b2
3xb
A1
b4
(b1, b3, b5)
Plating
View A - A
C
2x e
0.10 M C A M
(4)
E1
Base metal
D DE
(c)
c1
E
C
C
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.17
1.37
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.046
0.054
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
View B
NOTES
SYMBOL
3
4
D2
E
E1
e
ØK
L
L1
N
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.35
15.29
15.87
13.46
5.46 BSC
0.254
14.20
16.10
3.71
4.29
7.62 BSC
3.56
3.66
7.39
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.053
0.602
0.625
0.53
0.215 BSC
0.010
0.559
0.634
0.146
0.169
0.3
0.14
0.144
0.291
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerance per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension c and Q
Revision: 21-Apr-15
Document Number: 95541
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
TO-247 - 50 mils L/F
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Φ P
E
B
(2) R/2
N
A2
S
(Datum B)
Ø K M DBM
Φ P1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
A
See view B
2 x b2
3xb
0.10 M C A M
0.01 M D B M
View A - A
C
2x e
A1
b4
(b1, b3, b5)
Plating
(4)
E1
Base metal
D DE
(c)
c1
E
C
C
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.17
1.37
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.046
0.054
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
View B
NOTES
SYMBOL
3
4
D2
E
E1
e
ØK
L
L1
N
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.35
15.29
15.87
13.46
5.46 BSC
0.254
14.20
16.10
3.71
4.29
7.62 BSC
3.56
3.66
7.39
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.053
0.602
0.625
0.53
0.215 BSC
0.010
0.559
0.634
0.146
0.169
0.3
0.14
0.144
0.291
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension c and Q
Revision: 21-Apr-15
Document Number: 95542
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000
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