VS-30CPH03-N3
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Vishay Semiconductors
Ultrafast Rectifier, 2 x 15 A FRED Pt®
FEATURES
Common
cathode
2, Base
• Ultrafast recovery time
• Low forward voltage drop
• 175 °C operating junction temperature
• Low leakage current
1
• Designed and qualified according to
JEDEC®-JESD 47
2
3
TO-247AC 3L
1
Anode
1
3
Anode
2
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION / APPLICATIONS
300 V series are the state of the art ultrafast recovery
rectifiers designed with optimized performance of forward
voltage drop and ultrafast recovery time.
The planar structure and the platinum doped life time control
guarantee the best overall performance, ruggedness and
reliability characteristics.
These devices are intended for use in the output
rectification stage of SMPS, UPS, DC/DC converters as well
as freewheeling diodes in low voltage inverters and chopper
motor drives.
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
PRIMARY CHARACTERISTICS
IF(AV)
2 x 15 A
VR
300 V
VF at IF
0.85 V
trr typ.
See Recovery table
TJ max.
175 °C
Package
TO-247AC 3L
Circuit configuration
Common cathode
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Repetitive peak reverse voltage
Average rectified forward current
TEST CONDITIONS
VALUES
UNITS
300
V
VRRM
per leg
total device
Non-repetitive peak surge current per leg
Operating junction and storage temperatures
IF(AV)
TC = 142 °C
IFSM
TJ = 25 °C, tp = 10 ms
15
30
A
140
TJ, TStg
-65 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
SYMBOL
VBR,
VR
TEST CONDITIONS
MIN.
TYP.
MAX.
300
-
-
IF = 15 A
-
1.05
1.25
IF = 15 A, TJ = 125 °C
-
0.85
1.00
VR = VR rated
-
0.05
40
TJ = 125 °C, VR = VR rated
-
12
400
IR = 100 μA
UNITS
V
Forward voltage
VF
Reverse leakage current
IR
Junction capacitance
CT
VR = 300 V
-
45
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8
-
nH
μA
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
TYP.
MAX.
-
-
40
-
32
-
-
45
-
-
2.4
-
-
6.1
-
TJ = 25 °C
-
38
-
TJ = 125 °C
-
137
-
MIN.
TYP.
MAX.
UNITS
TJ, TStg
-65
-
175
°C
Thermal resistance,
junction to case per leg
RthJC
-
0.9
2.0
Thermal resistance,
junction to ambient per leg
RthJA
Typical socket mount
-
-
40
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth,
and greased
-
0.4
-
-
6.0
-
-
0.21
-
oz.
-
12
(10)
kgf · cm
(lbf ·in)
Reverse recovery time
SYMBOL
trr
TEST CONDITIONS
MIN.
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V
TJ = 25 °C
TJ = 125 °C
Peak recovery current
Reverse recovery charge
IRRM
Qrr
TJ = 25 °C
TJ = 125 °C
IF = 15 A
dIF/dt = - 200 A/μs
VR = 200 V
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and
storage temperature range
SYMBOL
TEST CONDITIONS
Weight
6.0
(5.0)
Mounting torque
Marking device
Case style TO-247AC 3L
°C/W
g
30CPH03
Revision: 15-Oct-2018
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1000
TJ = 175 °C
TJ = 125 °C
TJ = 25 °C
10
1
0.4
TJ = 175 °C
100
IR - Reverse Current (µA)
IF - Instantaneous Forward
Current (A)
100
TJ = 150 °C
TJ = 125 °C
10
1
TJ = 100 °C
0.1
0.01
TJ = 25 °C
0.001
0.6
0.8
1.0
1.2
1.4
0
1.6
50
100
150
200
250
300
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
CT - Junction Capacitance (pF)
1000
TJ = 25 °C
100
10
0
50
100
150
200
250
300
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Impedance (°C/W)
10
1
PDM
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
t1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.001
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
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100
IF = 30 A , TJ = 25 °C
IF = 30 A , TJ = 125 °C
170
160
trr (ns)
Allowable Case Temperature (°C)
180
DC
150
Square wave (D = 0.50)
Rated VR applied
140
130
See note (1)
120
0
5
10
15
20
10
100
25
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
22
1000
18
RMS limit
16
IF = 30 A , TJ = 125 °C
14
D = 0.01
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50
12
10
8
6
4
Qrr (nC)
Average Power Loss (W)
20
DC
100
IF = 30 A , TJ = 25 °C
2
0
0
5
10
15
20
25
10
100
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 6 - Forward Power Loss Characteristics
Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
(1)
Revision: 15-Oct-2018
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(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(4) Qrr - area under curve defined by trr
and IRRM
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
Qrr =
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
ORDERING INFORMATION TABLE
Device code
VS-
30
C
P
H
03
-N3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (30 = 30 A)
3
-
Circuit configuration: C = common cathode
4
4
-
Package:
P = TO-247
5
-
H = hyperfast recovery
6
-
Voltage rating (03 = 300 V)
7
-
Environmental digit:
-N3 = halogen-free, RoHS-compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-30CPH03-N3
25
500
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96138
Part marking information
www.vishay.com/doc?95007
SPICE models
www.vishay.com/doc?96568
Revision: 15-Oct-2018
Document Number: 94012
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Outline Dimensions
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Vishay Semiconductors
TO-247AC 3L
DIMENSIONS in millimeters and inches
A
A
E (3)
B
A2
S
R/2 (2)
(Datum B)
Ø P (6)
Ø P1
Ø K M DBM
A
Q
D2
2 x R (2)
D1 (4)
D
Thermal pad
2
1
4
D
3
L1 (5)
C
L
A
See view B
2 x b2
3xb
0.10 M C A M
C
2x e
A1
b4
E1 (4)
0.01 M D B M
(b1, b3, b5)
Plating
View A - A
Base metal
D DE
(c)
c1
(b, b2, b4)
C
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.17
1.37
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
C
(4)
View B
Section C - C, D - D, E - E
SYMBOL
E
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.046
0.054
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
NOTES
3
4
SYMBOL
D2
E
E1
e
ØK
L
L1
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.35
15.29
15.87
13.46
5.46 BSC
0.254
14.20
16.10
3.71
4.29
3.56
3.66
7.39
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.053
0.602
0.625
0.53
0.215 BSC
0.010
0.559
0.634
0.146
0.169
0.14
0.144
0.291
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension Q
Revision: 20-Jun-17
Document Number: 96138
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Revision: 01-Jan-2023
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Document Number: 91000