VS-30CTH02S-M3, VS-30CTH02-1-M3
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Vishay Semiconductors
Hyperfast Rectifier, 30 A FRED Pt®
FEATURES
• Hyperfast recovery time
• Low forward voltage drop
• Low leakage current
2
• 175 °C operating junction temperature
1
1
3
D2PAK (TO-263AB)
2
Base
Common
Cathode
2
Base
Common
Cathode
2
2
Common
Cathode
2
Common
Cathode
3
Anode
1
Anode
• Meets MSL level 1, per J-STD-020, LF maximum peak of
245 °C
TO-262AA
3
DESCRIPTION / APPLICATIONS
Vishay Semiconductors 200 V series are the state of the art
hyperfast
recovery
rectifiers
designed
with
optimized performance of forward voltage drop and
hyperfast recovery time.
The planar structure and the platinum doped life
time control,
guarantee
the
best
overall
performance, ruggedness and reliability characteristics.
These devices are intended for use in the output rectification
stage of SMPS, UPS, DC/DC converters as well as
freewheeling diode in low voltage inverters and chopper
motor drives.
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
3
Anode
1
Anode
VS-30CTH02S-M3
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
VS-30CTH02-1-M3
PRIMARY CHARACTERISTICS
IF(AV)
2 x 15 A
VR
200 V
VF at IF
0.78 V
trr typ.
30 ns
TJ max.
175 °C
Package
D2PAK (TO-263AB), TO-262AA
Circuit configuration
Common cathode
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Peak repetitive reverse voltage
TEST CONDITIONS
VRRM
per diode
Average rectified forward current
per device
Non-repetitive peak surge current
IF(AV)
IFSM
Operating junction and storage temperatures
MAX.
UNITS
200
V
TC = 159 °C
15
TC = 25 °C
200
30
TJ, TStg
A
-65 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
SYMBOL
VBR, VR
Forward voltage
VF
Reverse leakage current
IR
Junction capacitance
Series inductance
TEST CONDITIONS
IR = 100 μA
MIN.
TYP.
MAX.
UNITS
200
-
-
V
IF = 15 A
-
0.92
1.05
IF = 15 A, TJ = 125 °C
-
0.78
0.85
V
VR = VR rated
-
-
10
TJ = 125 °C, VR = VR rated
-
5
300
CT
VR = 200 V
-
57
-
pF
LS
Measured lead to lead 5 mm from package body
-
8
-
nH
μA
Revision: 21-Dec-2021
Document Number: 96234
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VS-30CTH02S-M3, VS-30CTH02-1-M3
www.vishay.com
Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
trr
TEST CONDITIONS
Reverse recovery charge
Qrr
MAX.
-
-
35
IF = 1 A, dIF/dt = 100 A/μs, VR = 30 V
-
-
30
TJ = 25 °C
-
26
-
IF = 15 A
dIF/dt = 200 A/μs
VR = 160 V
-
40
-
-
2.8
-
TJ = 125 °C
-
6.0
-
TJ = 25 °C
-
37
-
TJ = 125 °C
-
120
-
TJ = 25 °C
IRRM
TYP.
IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V
TJ = 125 °C
Peak recovery current
MIN.
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and storage temperature range
Thermal resistance, junction to case per diode
SYMBOL
MIN.
TYP.
MAX.
TJ, TStg
-65
-
175
°C
RthJC
-
-
1.1
°C/W
-
2.0
-
g
-
0.07
-
oz.
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
Weight
Mounting torque
Marking device
UNITS
Case style D2PAK (TO-263AB)
30CTH02S
Case style TO-262
30CTH02-1
100
100
TJ = 175 °C
TJ = 125 °C
TJ = 25 °C
10
1
0.4
IR - Reverse Current (µA)
IF - Instantaneous Forward
Current (A)
TJ = 175 °C
TJ = 150 °C
10
TJ = 125 °C
1
TJ = 100 °C
TJ = 75 °C
0.1
TJ = 50 °C
0.01
TJ = 25 °C
0.001
0.0001
0.6
0.8
1.0
1.2
1.4
1.6
0
50
100
150
200
VFM - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
Revision: 21-Dec-2021
Document Number: 96234
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-30CTH02S-M3, VS-30CTH02-1-M3
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Vishay Semiconductors
CT - Junction Capacitance (pF)
1000
100
TJ = 25 °C
10
0
50
100
150
200
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
10
1
PDM
Single pulse
(thermal resistance)
0.01
0.00001
t1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.1
0.0001
0.001
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.01
0.1
1
.
10
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
25
Average Power Loss (W)
Allowable Case Temperature (°C)
180
170
DC
160
Square wave (D = 0.50)
Rated VR applied
150
20
RMS limit
15
10
5
DC
See note (1)
140
D = 0.01
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
0
0
5
10
15
20
25
0
5
10
15
20
25
IF(AV) - Average Forward Current (A)
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 6 - Forward Power Loss Characteristics
Revision: 21-Dec-2021
Document Number: 96234
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-30CTH02S-M3, VS-30CTH02-1-M3
www.vishay.com
Vishay Semiconductors
100
1000
IF = 15 A
trr (ns)
Qrr (nC)
IF = 15 A
100
VR = 160 V
TJ = 125 °C
TJ = 25 °C
10
100
VR = 160 V
TJ = 125 °C
TJ = 25 °C
10
100
1000
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
(1)
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
Revision: 21-Dec-2021
Document Number: 96234
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-30CTH02S-M3, VS-30CTH02-1-M3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
30
C
T
H
02
S
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (30 A)
3
-
C = common cathode
4
-
T = TO-220, D2PAK (TO-263AB)
5
-
H = hyperfast rectifier
6
-
Voltage rating (02 = 200 V)
7
-
S = D2PAK (TO-263AB)
TRL -M3
8
9
-1 = TO-262AA
8
-
None = tube (50 pieces)
TRL = tape and reel (left oriented, for D2PAK (TO-263AB) package)
TRR = tape and reel (right oriented, for D2PAK (TO-263AB) package)
9
-
Environmental digit:
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
BASE QUANTITY
VS-30CTH02S-M3
50
PACKAGING DESCRIPTION
Antistatic plastic tubes
VS-30CTH02STRL-M3
800
13" diameter plastic tape and reel
VS-30CTH02STRR-M3
800
13" diameter plastic tape and reel
VS-30CTH02-1-M3
50
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
Packaging information
D2PAK (TO-263AB)
www.vishay.com/doc?96164
TO-262AA
www.vishay.com/doc?96165
D2PAK (TO-263AB)
www.vishay.com/doc?95444
TO-262AA
www.vishay.com/doc?95443
www.vishay.com/doc?96424
Revision: 21-Dec-2021
Document Number: 96234
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
D2PAK
DIMENSIONS in millimeters and inches
Conforms to JEDEC® outline D2 PAK (SMD-220)
(2)(3)
E
B
Pad layout
A
A
(E)
c2
11.00
MIN.
(0.43)
A
(3) L1
4
9.65
MIN.
(0.38)
(D1) (3)
Detail A
D
H
1
2
17.90 (0.70)
15.00 (0.625)
(2)
3
3.81
MIN.
(0.15)
L2
B
B
2.32
MIN.
(0.08)
A
2 x b2
C
2xb
2.64 (0.103)
2.41 (0.096)
(3)
E1
c
View A - A
± 0.004 M B
0.010 M A M B
2x e
Plating
Base
Metal
(4)
b1, b3
H
Gauge
plane
L
Seating
plane
L3
A1
Lead tip
(b, b2)
L4
Section B - B and C - C
Scale: None
Detail “A”
Rotated 90 °CW
Scale: 8:1
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
c1 (4)
(c)
B
0° to 8°
MAX.
NOTES
SYMBOL
MILLIMETERS
MIN.
MAX.
INCHES
MIN.
MAX.
NOTES
A
4.06
4.83
0.160
0.190
D1
6.86
8.00
0.270
0.315
3
A1
0.00
0.254
0.000
0.010
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
4
4
e
2.54 BSC
0.100 BSC
H
14.61
15.88
0.575
0.625
0.110
L
1.78
2.79
0.070
L1
-
1.65
-
0.066
4
L2
1.27
1.78
0.050
0.070
2
L4
L3
0.25 BSC
4.78
5.28
3
0.010 BSC
0.188
0.208
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inches
(7) Outline conforms to JEDEC® outline TO-263AB
Revision: 13-Jul-17
Document Number: 96164
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Disclaimer
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
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Revision: 01-Jan-2023
1
Document Number: 91000