VS-30CTH03-M3
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Vishay Semiconductors
Hyperfast Rectifier, 2 x 15 A FRED Pt®
FEATURES
Base
common
cathode
2
• Hyperfast recovery time
• Low forward voltage drop
• 175 °C operating junction temperature
• Low leakage current
1
3
TO-220AB 3L
• Designed and qualified according to JEDEC®-JESD 47
2
Common
cathode
2
Anode
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Anode
1
3
DESCRIPTION / APPLICATIONS
300 V series are the state of the art hyperfast recovery
rectifiers designed with optimized performance of forward
voltage drop and hyperfast recovery time.
PRIMARY CHARACTERISTICS
IF(AV)
2 x 15 A
VR
300 V
VF at IF
0.85 V
trr typ.
See Recovery table
TJ max.
175 °C
The planar structure and the platinum doped life time
control, guarantee the best overall performance,
ruggedness and reliability characteristics.
Package
TO-220AB 3L
Circuit configuration
Common cathode
These devices are intended for use in the output rectification
stage of SMPS, UPS, DC/DC converters as well
as freewheeling diodes in low voltage inverters and chopper
motor drives.
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Peak repetitive reverse voltage
TEST CONDITIONS
VALUES
UNITS
300
V
VRRM
per diode
Average rectified forward current
per device
Non-repetitive peak surge current
IF(AV)
IFSM
Operating junction and storage temperatures
TC = 153 °C
15
TC = 25 °C
150
30
TJ, TStg
A
-65 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
MIN.
TYP.
MAX.
300
-
-
IF = 15 A
-
1.0
1.25
0.95
IR = 100 μA
IF = 15 A, TJ = 125 °C
-
0.85
VR = VR rated
-
-
40
TJ = 125 °C, VR = VR rated
-
8
200
UNITS
V
Reverse leakage current
IR
Junction capacitance
CT
VR = 300 V
-
38
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8
-
nH
μA
Revision: 13-Jan-2022
Document Number: 96198
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VS-30CTH03-M3
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Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
TEST CONDITIONS
trr
MIN.
TYP.
MAX.
IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V
-
-
36
IF = 1 A, dIF/dt = 100 A/μs, VR = 30 V
-
-
30
TJ = 25 °C
-
33
-
-
48
-
-
2.8
-
-
6.5
-
TJ = 125 °C
Peak recovery current
IRRM
Reverse recovery charge
IF = 15 A
dIF/dt = 200 A/μs
VR = 200 V
TJ = 25 °C
TJ = 125 °C
Qrr
TJ = 25 °C
-
46
-
TJ = 125 °C
-
160
-
UNITS
ns
A
nC
THERMAL MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
TJ, TStg
-65
-
175
°C
RthJC
-
-
1.4
°C/W
Maximum junction and storage temperature range
Thermal resistance, junction to case per diode
Marking device
Case style TO-220AB 3L
UNITS
30CTH03
100
100
TJ = 175 °C
TJ = 125 °C
TJ = 25 °C
10
1
0.4
TJ = 150 °C
IR - Reverse Current (µA)
IF - Instantaneous Forward
Current (A)
TJ = 175 °C
10
TJ = 125 °C
TJ = 100 °C
1
TJ = 75 °C
0.1
TJ = 50 °C
TJ = 25 °C
0.01
0.001
0.6
0.8
1.0
1.2
1.4
0
1.6
50
100
150
200
250
300
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
CT - Junction Capacitance (pF)
1000
100
TJ = 25 °C
10
0
50
100
150
200
250
300
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Revision: 13-Jan-2022
Document Number: 96198
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VS-30CTH03-M3
ZthJC - Thermal Impedance (°C/W)
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10
1
PDM
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
0.001
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.01
0.1
.
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
100
IF = 15 A
170
TJ = 125 °C
DC
trr (ns)
Allowable Case Temperature (°C)
180
160
TJ = 25 °C
Square wave (D = 0.50)
Rated VR applied
150
VR = 200 V
See note (1)
140
0
5
10
15
20
10
100
25
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
20
1000
16
RMS limit
TJ = 125 °C
12
D = 0.01
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50
8
4
Qrr (nC)
Average Power Loss (W)
IF = 15 A
DC
5
TJ = 25 °C
VR = 200 V
0
0
100
10
15
20
25
10
100
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 6 - Forward Power Loss Characteristics
Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
Revision: 13-Jan-2022
Document Number: 96198
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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VS-30CTH03-M3
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(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(4) Qrr - area under curve defined by trr
and IRRM
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
Qrr =
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
ORDERING INFORMATION TABLE
Device code
VS-
30
C
T
H
03
-M3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (30 = 30 A)
3
-
Circuit configuration:
C = common cathode
4
4
-
Package:
T = 3L TO-220AB
4
5
-
H = hyperfast recovery
6
-
Voltage rating (03 = 300 V)
7
-
Environmental digit:
-M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
BASE QUANTITY
PACKAGING DESCRIPTION
VS-30CTH03-M3
50
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96154
Part marking information
www.vishay.com/doc?95028
Revision: 13-Jan-2022
Document Number: 96198
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
TO-220AB 3L
DIMENSIONS in millimeters and inches
A
0.014 M B A M
(6)
E
A
ØP
Q
B
A
(6)
(E)
A1
Thermal pad
1
D
(H1)
H1
C
D2
(6) D
2 3
D
L1 (2)
C
(6)
c
3xb
D1
3 x b2
Detail B
Detail B
A2
L
E1 (6)
C
(b, b2)
Base metal
A
c1 (4)
c
2x e
Plating
View A - A
e1
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead tip
Conforms to JEDEC® outline TO-220AB
SYMBOL
A
A1
A2
b
b1
b2
b3
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.25
4.65
1.14
1.40
2.50
2.92
0.69
1.01
0.38
0.97
1.20
1.73
1.14
1.73
0.36
0.61
0.36
0.56
14.85
15.35
8.38
9.02
INCHES
MIN.
MAX.
0.167
0.183
0.045
0.055
0.098
0.115
0.027
0.040
0.015
0.038
0.047
0.068
0.045
0.068
0.014
0.024
0.014
0.022
0.585
0.604
0.330
0.355
NOTES
4
4
4
3
SYMBOL
D2
E
E1
e
e1
H1
L
L1
ØP
Q
MILLIMETERS
MIN.
MAX.
11.68
13.30
10.11
10.51
6.86
8.89
2.41
2.67
4.88
5.28
6.09
6.48
13.52
14.02
3.32
3.82
3.54
3.91
2.60
3.00
INCHES
MIN.
MAX.
0.460
0.524
0.398
0.414
0.270
0.350
0.095
0.105
0.192
0.208
0.240
0.255
0.532
0.552
0.131
0.150
0.139
0.154
0.102
0.118
NOTES
6, 7
3, 6
6
6
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3, and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2, and E1
(7) Outline conforms to JEDEC® TO-220, except D2
Revision: 14-Mar-2022
Document Number: 96154
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Document Number: 91000