VS-3EJH01-M3
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Vishay Semiconductors
Hyperfast Rectifier, 3 A FRED Pt®
FEATURES
eSMP® Series
Top View
• Hyperfast recovery time, reduced Qrr, and soft
recovery
• 175 °C maximum operating junction temperature
• Low forward voltage drop
• Low leakage current
• Specific for output and snubber operation
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
• Meets JESD 201 class 2 whisker test
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Bottom View
SlimSMA (DO-221AC)
Cathode
Anode
DESCRIPTION / APPLICATIONS
LINKS TO ADDITIONAL RESOURCES
State of the art hyperfast recovery rectifiers specifically
designed with optimized performance of forward voltage
drop and hyperfast recovery time.
The planar structure and the platinum doped life time control
guarantee the best overall performance, ruggedness and
reliability characteristics.
These devices are intended for use in snubber, boost,
lighting, as high frequency rectifiers and freewheeling
diodes.
The extremely optimized stored charge and low recovery
current minimize the switching losses and reduce power
dissipation in the switching element.
3D 3D
3D Models
PRIMARY CHARACTERISTICS
IF(AV)
3A
VR
100 V
VF at IF
0.74 V
trr
30 ns
TJ max.
175 °C
Package
SlimSMA (DO-221AC)
Circuit configuration
Single
MECHANICAL DATA
Case: SlimSMA (DO-221AC)
Molding compound meets UL 94 V-0 flammability rating
Terminals: matte tin plated leads, solderable per
J-STD-002
Polarity: color band denotes cathode end
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
100
V
Peak repetitive reverse voltage
VRRM
Average rectified forward current
IF(AV)
TC = 145 °C (1)
3
Non-repetitive peak surge current
IFSM
TJ = 25 °C
85
Operating junction and storage temperatures
TJ, TStg
A
-65 to +175
°C
Note
(1) Device on PCB with 8 mm x 16 mm soldering lands
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking voltage
Forward voltage
SYMBOL
VBR, VR
VF
Reverse leakage current
IR
Junction capacitance
CT
TEST CONDITIONS
MIN.
TYP.
MAX.
100
-
-
IF = 3 A
-
0.86
0.93
0.78
IR = 100 μA
IF = 3 A, TJ = 125 °C
-
0.74
VR = VR rated
-
-
2
TJ = 125 °C, VR = VR rated
-
0.5
8
VR = 100 V
-
13
-
UNITS
V
μA
pF
Revision: 28-Jan-2021
Document Number: 94903
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-3EJH01-M3
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
TEST CONDITIONS
trr
Reverse recovery charge
-
26
-
-
-
30
TJ = 25 °C
-
18
-
-
26
-
-
2.5
-
-
4
-
TJ = 25 °C
-
23
-
TJ = 125 °C
-
50
-
TJ = 125 °C
Qrr
MAX.
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V
TJ = 25 °C
IRRM
TYP.
IF = 0.5 A, IR = 1 A, Irr = 0.25 A
TJ = 125 °C
Peak recovery current
MIN.
IF = 3 A
dIF/dt = 200 A/μs
VR = 160 V
UNITS
ns
A
nC
THERMAL - MECHANICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Maximum junction and
storage temperature range
TEST CONDITIONS
TJ, TStg
MIN.
TYP.
MAX.
UNITS
-65
-
175
°C
Thermal resistance,
junction to mount
RthJM
Device mounted on PCB with
8 mm x 16 mm soldering lands
-
8
10
Thermal resistance,
junction to ambient
RthJA
Device mounted on PCB with
2 mm x 3.5 mm soldering lands
-
91
110
°C/W
Approximate Weight
g
oz.
Case style SlimSMA (DO-221AC)
100
3H1
100
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
Marking device
0.032
0.0011
TJ = 175 °C
10
TJ = 150 °C
1
TJ = 125 °C
TJ = 25 °C
175 °C
10
150 °C
1
125 °C
0.1
25 °C
0.01
TJ = -40 °C
0.1
0.001
0.3
0.5
0.7
0.9
1.1
1.3
1.5
0
20
40
60
80
100
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current
vs. Reverse Voltage
Revision: 28-Jan-2021
Document Number: 94903
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3.5
RMS limit
Average Power Loss (W)
CT - Junction Capacitance (pF)
100
10
3
2.5
2
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
DC
1.5
1
0.5
1
0
0
20
40
60
80
100
0
VR - Reverse Voltage (V)
1.2
1.8
2.4
3
3.6
4.2
4.8
IF(AV) - Average Forward Current (A)
Fig. 5 - Forward Power Loss Characteristics
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
35
180
175
30
170
25
165
trr (ns)
Allowable Case Temperature (°C)
0.6
160
DC
155
15
Square wave (D = 0.50)
80 % rated VR applied
150
125 °C
20
25 °C
10
145
See note (1)
5
140
0
0.5
1
1.5
2
2.5
3
100
3.5
1000
IF(AV) - Average Forward Current (A)
dIF/dt (A/µs)
Fig. 4 - Maximum Allowable Case Temperature
vs. Average Forward Current
Fig. 6 - Typical Reverse Recovery vs. dIF/dt
70
60
125 °C
Qrr (nC)
50
40
25 °C
30
20
10
100
1000
dIF/dt (A/µs)
Fig. 7 - Typical Stored Charge vs. dIF/dt
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see Fig. 6);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
Revision: 28-Jan-2021
Document Number: 94903
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-3EJH01-M3
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Vishay Semiconductors
ZthJL - Thermal Impedance
Junction to Lead (°C/W)
10
1
ZthJL
0.1
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
t1 - Rectangular Pulse Duration (s)
Fig. 8 - Typical Thermal Impedance ZthJL Junction-to-Lead
ZthJA - Thermal Impedance
Junction to Ambient (°C/W)
100
ZthJA
10
1
0.001
0.01
0.1
1
10
100
t1 - Rectangular Pulse Duration (s)
Fig. 9 - Typical Thermal Impedance ZthJA Junction-to-Ambient
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
Revision: 28-Jan-2021
Document Number: 94903
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-3EJH01-M3
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ORDERING INFORMATION TABLE
Device code
VS-
3
E
J
H
01
-M3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (3 = 3 A)
3
-
Circuit configuration:
E = single diode
4
-
J = SlimSMA package
5
-
Process type,
H = hyperfast recovery
6
-
Voltage code (01 = 100 V)
7
-
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER REEL
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-3EJH01-M3/6A
3500
3500
7"diameter plastic tape and reel
VS-3EJH01-M3/6B
14 000
14 000
13"diameter plastic tape and reel
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95771
Part marking information
www.vishay.com/doc?95562
Packaging information
www.vishay.com/doc?88869
Revision: 28-Jan-2021
Document Number: 94903
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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
DO-221AC (SlimSMA)
DIMENSIONS in inches (millimeters)
Cathode Band
0.057 (1.45)
0.049 (1.25)
0.106 (2.70)
0.098 (2.50)
0.171 (4.35)
0.163 (4.15)
0.211 (5.35)
0.199 (5.05)
0.047 (1.20)
0.030 (0.75)
Typ.: 0.019 (0.48)
Mounting Pad Layout
0.039 (1.00)
0.035 (0.90)
0.060 (1.52)
MIN.
0.012 (0.30)
0.006 (0.15)
0.047 (1.20)
MIN.
0.123 (3.12) MAX.
0.217 (5.52) REF.
0.047 (1.20)
MIN.
Revision: 21-Jul-14
Document Number: 95571
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2022
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Document Number: 91000