VS-3EYH01HM3, VS-3EYH02HM3
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Vishay Semiconductors
Hyperfast Rectifier, 3 A FRED Pt®
FEATURES
eSMP® Series
• Low profile package
• Ideal for automated placement
• Low forward voltage drop, low power losses
• Low leakage current
• Meets MSL level 1, per
LF maximum peak of 260 °C
Top View
Bottom View
• AEC-Q101 qualified, class 2 whisker test
• Compatible to SOD-128 package case outline
SlimSMAW (DO-221AD)
Cathode
J-STD-020,
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Anode
DESCRIPTION / APPLICATIONS
LINKS TO ADDITIONAL RESOURCES
For use in high frequency, freewheeling, DC/DC converters,
PFC, and in snubber industrial, and automotive
applications.
3D 3D
3D Models
MECHANICAL DATA
PRIMARY CHARACTERISTICS
IF(AV)
3A
VR
100 V, 200 V
VF at IF
0.71 V
Case: SlimSMAW (DO-221AD)
Molding compound meets UL 94 V-0 flammability rating
Halogen-free, RoHS-compliant
matte
tin
plated
leads,
IFSM
70 A
Terminals:
J-STD-002
trr (typ.)
16 ns
Polarity: color band denotes cathode end
TJ max.
175 °C
Package
SlimSMAW (DO-221AD)
Circuit configuration
Single
solderable
per
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Peak repetitive reverse voltage
SYMBOL
VS-3EYH01HM3
VS-3EYH02HM3
VALUES
IF(AV) (1)
Non-repetitive peak surge current
IFSM
UNITS
100
VRRM
Average rectified forward current
Operating junction and storage temperatures
TEST CONDITIONS
V
200
TC = 137 °C
3
TJ = 25 °C, 10 ms sine pulse wave
70
TJ, TStg
A
-55 to +175
°C
Note
(1) Mounted on infinite heatsink
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking
voltage
SYMBOL
VS-3EYH01HM3
VBR, VR
VS-3EYH02HM3
Forward voltage, per diode
VF
Reverse leakage current, per diode
IR
Junction capacitance
CT
TEST CONDITIONS
IR = 100 μA
MIN.
TYP.
MAX.
100
-
-
200
-
-
IF = 3 A
-
0.86
0.95
0.79
IF = 3 A, TJ = 150 °C
-
0.71
VR = VR rated
-
-
2
TJ = 150 °C, VR = VR rated
-
-
20
VR = 200 V
-
16
-
UNITS
V
μA
pF
Revision: 28-Jan-2021
Document Number: 96384
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-3EYH01HM3, VS-3EYH02HM3
www.vishay.com
Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
trr
TEST CONDITIONS
MIN.
TYP.
MAX.
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V
-
22
-
IF = 1.0 A, dIF/dt = 100 A/μs, VR = 30 V
-
16
-
IF = 0.5 A, IR = 1A, Irr = 0.25 A
-
-
30
TJ = 25 °C
-
18
-
TJ = 125 °C
Peak recovery current
IRRM
Reverse recovery charge
Qrr
UNITS
ns
-
30
-
-
2.5
-
-
4
-
TJ = 25 °C
-
23
-
TJ = 125 °C
-
60
-
MIN.
TYP.
MAX.
UNITS
-55
-
175
°C
Infinite heatsink
-
12
15
Device mounted on FR4 PCB,
2 oz. standard footprint
-
120
150
TJ = 25 °C
TJ = 125 °C
IF = 3 A,
dIF/dt = 200 A/μs,
VR = 100 V
A
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage temperature range
Thermal resistance, junction to mount
Thermal resistance, junction to ambient
Marking device
VS-3EYH01HM3
VS-3EYH02HM3
TEST CONDITIONS
TJ, TStg
RthJM
(1)
RthJA
Case style SlimSMAW (DO-221AD)
°C/W
3H1
3H2
Note
(1) Thermal resistance junction to mount follows JEDEC® 51-14 transient dual interface test method (TDIM)
Revision: 28-Jan-2021
Document Number: 96384
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-3EYH01HM3, VS-3EYH02HM3
Vishay Semiconductors
100
100
175 °C
IR - Reverse Current (μA)
IF - Instantaneous Forward Current (A)
www.vishay.com
10
TJ = 175 °C
1
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
10
150 °C
1
125 °C
0.1
25 °C
0.01
0.001
TJ = -40 °C
0.1
0.0001
0.4
0.6
0.8
1.0
1.2
1.4
50
100
VF - Forward Voltage Drop (V)
150
200
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
CT - Junction Capacitance (pF)
100
10
1
0
25
50
75
100
125
150
175
200
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
1000
Junction to Ambient
100
Junction to Mount
10
1
0.1
0.001
0.01
0.1
1
10
100
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Revision: 28-Jan-2021
Document Number: 96384
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-3EYH01HM3, VS-3EYH02HM3
Vishay Semiconductors
180
40
170
35
160
30
trr (ns)
Allowable Case Temperature (°C)
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DC
150
140
125 °C
25
25 °C
20
Square wave (D = 0.50)
rated VR applied
130
15
See note (1)
120
10
0
0.5
1
1.5
2
2.5
3
3.5
100
200
300
400
500
IF(AV) - Average Forward Current (A)
dIF/dt (A/μs)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
3.5
80
125 °C
70
3
60
2.5
2
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
DC
1.5
1
0.5
0
Qrr (nC)
Average Power Loss (W)
RMS limit
50
40
25 °C
30
20
10
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
100
200
300
400
500
IF(AV) - Average Forward Current (A)
dIF/dt (A/μs)
Fig. 6 - Forward Power Loss Characteristics
Fig. 8 - Typical Stored Charge vs. dIF/dt
Note
Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 5);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
(1)
Revision: 28-Jan-2021
Document Number: 96384
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-3EYH01HM3, VS-3EYH02HM3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
3
E
Y
H
02
H
M3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Current rating (3 = 3 A)
3
-
Circuit configuration:
E = single diode
4
-
Y = SlimSMAW (DO-221AD)
5
-
Process type,
6
-
Voltage code (02 = 200 V)
7
-
H = AEC-Q101 qualified
8
-
M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
H = hyperfast recovery
ORDERING INFORMATION (Example)
UNIT WEIGHT
(g)
PREFERRED PACKAGE CODE
VS-3EYH01HM3/H
0.033
H
3500
7"diameter plastic tape and reel
VS-3EYH01HM3/I
0.033
I
14 000
13"diameter plastic tape and reel
VS-3EYH02HM3/H
0.033
H
3500
7"diameter plastic tape and reel
VS-3EYH02HM3/I
0.033
I
14 000
13"diameter plastic tape and reel
PREFERRED P/N
BASE QUANTITY
PACKAGING DESCRIPTION
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96582
Part marking information
www.vishay.com/doc?95562
Packaging information
www.vishay.com/doc?88869
SPICE model
www.vishay.com/doc?96586
Revision: 28-Jan-2021
Document Number: 96384
5
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
SlimSMAW (DO-221AD)
DIMENSIONS in inches (millimeters)
SlimSMAW (DO-221AD)
Cathode band
0.106 (2.70)
0.091 (2.30)
0.075 (1.90)
0.063 (1.60)
0.032 (0.81)
0.014 (0.36)
0.158 (4.00)
0.142 (3.60)
0.024 (0.60)
0.012 (0.30)
0.197 (5.00)
0.173 (4.40)
0.043 (1.10)
0.035 (0.90)
0.009 (0.22)
0.004 (0.10)
0.083 (2.10) min.
0.055 (1.40) min.
0.118 (3.00) max.
0.055 (1.40) min.
0.228 (5.80) ref.
Mounting pad layout
Revision: 11-Dec-2018
Document Number: 96582
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Vishay
Disclaimer
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
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to the warranty expressed therein.
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Revision: 01-Jan-2023
1
Document Number: 91000