VS-60EPU04LHN3, VS-60APU04LHN3
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Vishay Semiconductors
Ultrafast Soft Recovery Diode, 60 A FRED Pt®
FEATURES
•
•
•
•
Ultrafast recovery time
Low forward voltage drop
175 °C operating junction temperature
AEC-Q101 qualified, meets JESD 201 class 1A
whisker test
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
2
1
1
2
3
3
TO-247AD 3L
TO-247AD 2L
Base cathode
2
1
Cathode
3
Anode
VS-60EPU04LHM3
Base cathode
2
BENEFITS
•
•
•
•
3
Anode
1
Anode
VS-60APU04LHM3
DESCRIPTION / APPLICATIONS
These diodes are optimized to reduce losses and EMI/RFI in
high frequency power conditioning systems.
The softness of the recovery eliminates the need for a
snubber in most applications. These devices are ideally
suited for HF welding, power converters and other
applications where switching losses are not significant
portion of the total losses.
LINKS TO ADDITIONAL RESOURCES
3D 3D
3D Models
PRIMARY CHARACTERISTICS
IF(AV)
60 A
VR
400 V
VF at IF
0.87 V
trr typ.
50 ns
Reduced RFI and EMI
Higher frequency operation
Reduced snubbing
Reduced parts count
MECHANICAL DATA
Case: TO-247AD 2L, TO-247AD 3L
Molding compound meets UL 94 V-0 flammability rating
TJ max.
175 °C
Package
TO-247AD 2L, TO-247AD 3L
Circuit configuration
Single
Terminals:
J-STD-002
matte
tin
plated
leads,
solderable
per
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Cathode to anode voltage
Continuous forward current
SYMBOL
TEST CONDITIONS
VALUES
UNITS
400
V
VR
IF(AV)
TC = 127 °C
Single pulse forward current
IFSM
TC = 25 °C
600
Maximum repetitive forward current
IFRM
Square wave, 20 kHz
120
Operating junction and storage temperatures
TJ, TStg
60
A
-55 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage, blocking voltage
Forward voltage
SYMBOL
VBR, VR
VF
TEST CONDITIONS
MIN.
TYP.
MAX.
400
-
-
IF = 60 A
-
1.05
1.25
IF = 60 A, TJ = 175 °C
-
0.87
1.03
IR = 100 μA
UNITS
V
IF = 60 A, TJ = 125 °C
-
0.93
1.10
VR = VR rated
-
-
50
μA
TJ = 150 °C, VR = VR rated
-
-
2
mA
Reverse leakage current
IR
Junction capacitance
CT
VR = 400 V
-
50
-
pF
LS
Measured lead to lead 5 mm from
package body
-
3.5
-
nH
Series inductance
Revision: 26-May-2021
Document Number: 96846
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VS-60EPU04LHN3, VS-60APU04LHN3
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Vishay Semiconductors
DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
IF = 1 A, dIF/dt = 200 A/μs, VR = 30 V
Reverse recovery time
trr
Peak recovery current
IRRM
Reverse recovery charge
Qrr
MIN.
TYP.
MAX.
-
50
-
TJ = 25 °C
-
85
-
TJ = 125 °C
-
145
-
IF = 60 A
dIF/dt = 200 A/μs
VR = 200 V
TJ = 25 °C
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
-
8.8
-
-
15.4
-
UNITS
ns
A
-
375
-
-
1120
-
MIN.
TYP.
MAX.
-
-
0.70
-
0.2
-
-
5.5
-
g
-
0.2
-
oz.
1.2
(10)
-
2.4
(20)
N·m
(lbf · in)
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Thermal resistance, junction to case
RthJC
Thermal resistance, case to heatsink
RthCS
TEST CONDITIONS
Mounting surface, flat, smooth, and greased
Weight
Mounting torque
Case style TO-247AD 2L
60EPU04LH
Case style TO-247AD 3L
60APU04LH
1000
K/W
1000
IR - Reverse Current (µA)
IF - Instantaneous Forward Current (A)
Marking device
UNITS
100
TJ = 175 °C
TJ = 125 °C
TJ = 25 °C
10
1
100
TJ = 175 °C
10
TJ = 125 °C
1
TJ = 25 °C
0.1
0.01
0.001
0
0.5
1
1.5
2
2.5
0
100
200
300
400
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Revision: 26-May-2021
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VS-60EPU04LHN3, VS-60APU04LHN3
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CT - Junction Capacitance (pF)
1000
TJ = 25 °C
100
10
0
100
10
1000
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
1
PDM
0.1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
0.001
t1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
0.01
0.1
.
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
100
RMS limit
Average Power Loss (W)
Allowable Case Temperature (°C)
180
160
DC
140
Square wave (D = 0.50)
80 % rated VR applied
120
100
80
60
D = 0.01
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50
40
20
DC
See note (1)
0
80
0
20
40
60
80
100
0
20
40
60
80
100
IF(AV) - Average Forward Current (A)
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 6 - Forward Power Loss Characteristics
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = 80 % rated VR
Revision: 26-May-2021
Document Number: 96846
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60EPU04LHN3, VS-60APU04LHN3
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180
140
2500
120
IF = 40 A
IF = 60 A
IF = 120 A
2000
1500
100
1000
80
500
60
100
VR = 400 V
TJ = 125 °C
TJ = 25 °C
3000
IF = 120 A
IF = 60 A
IF = 40 A
160
trr (ns)
3500
VR = 400 V
TJ = 125 °C
TJ = 25 °C
Qrr (nC)
200
Vishay Semiconductors
0
100
1000
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 8 - Typical Stored Charge vs. dIF/dt
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
Revision: 26-May-2021
Document Number: 96846
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
60
E
P
U
04
L
H
N3
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Current rating (60 = 60 A)
3
-
4
-
5
-
Circuit configuration:
E = single diode
A = single diode, 3 pins
Package:
P = TO-247AC (modified)
Type of silicon:
U = ultrafast recovery
6
-
Voltage rating (04 = 400 V)
7
-
L = long lead (TO-247AD)
8
-
H = AEC-Q101 qualified
9
-
Environmental digit:
N3 = halogen-free, RoHS-compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER TUBE
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-60EPU04LHN3
25
500
Antistatic plastic tube
VS-60APU04LHN3
25
500
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
SPICE model
TO-247AD 2L
www.vishay.com/doc?95536
TO-247AD 3L
www.vishay.com/doc?95626
TO-247AD 2L
www.vishay.com/doc?95648
TO-247AD 3L
www.vishay.com/doc?95007
www.vishay.com/doc?96899
Revision: 26-May-2021
Document Number: 96846
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
TO-247AD 3L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Φ P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M DBM
Φ P1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
(4)
E1
A
0.01 M D B M
View A - A
See view B
2 x b2
3xb
C
2x e
b4
A1
0.10 M C A M
(b1, b3, b5)
Plating
Base metal
D DE
(c)
c1
E
C
C
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.50
2.49
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.059
0.098
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
View B
NOTES
3
4
SYMBOL
D2
E
E1
e
ØK
L
L1
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.30
15.29
15.87
13.46
5.46 BSC
0.254
19.81
20.32
3.71
4.29
3.56
3.66
6.98
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.051
0.602
0.625
0.53
0.215 BSC
0.010
0.780
0.800
0.146
0.169
0.14
0.144
0.275
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 06-Mar-2020
Document Number: 95626
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Revision: 09-Jul-2021
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Document Number: 91000