VS-60.PF0.PbF Series, VS-60.PF0.-M3 Series
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Vishay Semiconductors
Fast Soft Recovery Rectifier Diode, 60 A
FEATURES
• Glass passivated pellet chip junction
• 150 °C max. operating junction temperature
2
3
1
1
2
3
TO-247AC
TO-247AC modified
Base cathode
2
• Low forward voltage drop and short reverse
recovery time
• Designed and qualified
JEDEC®-JESD 47
according
to
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Base cathode
2
Available
APPLICATIONS
1
Cathode
3
Anode
1
Anode
VS-60EPF...
These devices are intended for use in output rectification
and freewheeling in inverters, choppers and converters as
well as in input rectification where severe restrictions on
conducted EMI should be met.
3
Anode
VS-60APF0...
DESCRIPTION
PRODUCT SUMMARY
Package
TO-247AC modified (2 pins), TO-247AC
IF(AV)
60 A
VR
200 V, 400 V, 600 V
VF at IF
1.3 V
IFSM
830 A
trr
70 ns
TJ max.
150 °C
Diode variation
Single die
Snap factor
0.5
The VS-60EPF0... and VS-60APF0... soft recovery rectifier
series has been optimized for combined short reverse
recovery time and low forward voltage drop.
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
VRRM
IF(AV)
Sinusoidal waveform
VALUES
UNITS
200 to 600
V
60
A
830
IFSM
trr
1 A, 100 A/μs
70
VF
30 A, TJ = 25 °C
1.1
V
-40 to +150
°C
TJ
ns
VOLTAGE RATINGS
VRRM, MAXIMUM PEAK
REVERSE VOLTAGE
V
VRSM, MAXIMUM NON-REPETITIVE
PEAK REVERSE VOLTAGE
V
VS-60EPF02PbF, VS-60APF02PbF,
VS-60EPF02-M3, VS-60APF02-M3
200
300
VS-60EPF04PbF, VS-60APF04PbF,
VS-60EPF04-M3, VS-60APF04-M3
400
500
VS-60EPF06PbF, VS-60APF06PbF,
VS-60EPF06-M3, VS-60APF06-M3
600
700
PART NUMBER
IRRM
AT 150 °C
mA
10
Revision: 11-Feb-16
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VS-60.PF0.PbF Series, VS-60.PF0.-M3 Series
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Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Maximum average forward current
Maximum peak one cycle
non-repetitive surge current
SYMBOL
TEST CONDITIONS
IF(AV)
TC = 106 °C, 180° conduction half sine wave
60
10 ms sine pulse, rated VRRM applied
700
10 ms sine pulse, no voltage reapplied
830
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
I2t
VALUES
10 ms sine pulse, rated VRRM applied
2450
10 ms sine pulse, no voltage reapplied
3460
t = 0.1 ms to 10 ms, no voltage reapplied
UNITS
A
A2s
34 600
A2s
VALUES
UNITS
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
Forward slope resistance
VFM
rt
Threshold voltage
VF(TO)
Maximum reverse leakage current
IRM
TEST CONDITIONS
60 A, TJ = 25 °C
TJ = 150 °C
TJ = 25 °C
V
m
0.88
V
0.1
VR = Rated VRRM
TJ = 150 °C
1.3
5.0
mA
10
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Qrr
Snap factor
S
TEST CONDITIONS
IF at 60 Apk
25 A/μs
25 °C
Typical
VALUES
UNITS
180
ns
3.4
A
0.5
μC
IFM
trr
ta
tb
t
dir
dt
0.5
Qrr
IRM(REC)
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
Maximum thermal resistance,
junction to ambient
RthJA
Typical thermal resistance,
case to heatsink
RthCS
DC operation
UNITS
-40 to +150
°C
0.4
°C/W
40
Mounting surface, smooth and greased
0.2
6
g
0.21
oz.
minimum
6 (5)
maximum
12 (10)
kgf · cm
(Ibf · in)
Approximate weight
Mounting torque
VALUES
60EPF02
Case style TO-247AC modified
60EPF04
60EPF06
Marking device
60APF02
Case style TO-247AC
60APF04
60APF06
Revision: 11-Feb-16
Document Number: 93710
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60.PF0.PbF Series, VS-60.PF0.-M3 Series
www.vishay.com
Vishay Semiconductors
140
60.PF.. Series
RthJC (DC) = 0.4 K/W
140
130
Ø
Conduction angle
120
110
120°
60°
100
90°
30°
180°
Maximum Average Forward
Power Loss (W)
Maximum Allowable Case
Temperature (°C)
150
0
10
30
20
40
50
DC
80
RMS limit
60
Ø
40
Conduction period
60.PF.. Series
TJ = 150 °C
20
70
60
0
20
40
60
80
100
Average Forward Current (A)
Average Forward Current (A)
Fig. 1 - Current Rating Characteristics
Fig. 4 - Forward Power Loss Characteristics
150
800
60.PF.. Series
RthJC (DC) = 0.4 K/W
140
130
Ø
Conduction period
120
110
60°
100
90°
30°
At any rated load condition and with
rated VRRM applied following surge.
700
Peak Half Sine Wave
Forward Current (A)
Maximum Allowable Case
Temperature (°C)
100
0
90
Initial TJ = 175 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
600
500
400
300
120°
60.PF.. Series
DC
180°
200
90
20
0
40
80
60
100
1
Average Forward Current (A)
10
100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
Fig. 2 - Current Rating Characteristics
900
90
180°
120°
90°
60°
30°
80
70
60
800
Peak Half Sine Wave
Forward Current (A)
Maximum Average Forward
Power Loss (W)
180°
120°
90°
60°
30°
120
RMS limit
50
40
30
Ø
Conduction angle
20
60.PF.. Series
TJ = 150 °C
10
0
10
20
30
40
50
60
70
Initial TJ = 195 °C
No voltage reapplied
Rated VRRM reapplied
700
600
500
400
300
200
0
Maximum non-repetitive surge current
versus pulse train duration.
100
0.01
60.PF.. Series
0.1
1
Average Forward Current (A)
Pulse Train Duration (s)
Fig. 3 - Forward Power Loss Characteristics
Fig. 6 - Maximum Non-Repetitive Surge Current
Revision: 11-Feb-16
Document Number: 93710
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60.PF0.PbF Series, VS-60.PF0.-M3 Series
Instantaneous Forward Current (A)
www.vishay.com
Vishay Semiconductors
1000
100
TJ = 25 °C
TJ = 150 °C
10
60.PF.. Series
1
0.5
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
4
0.20
Qrr - Typical Reverse
Recovery Charge (µC)
trr - Typical Reverse
Recovery Time (µs)
IFM = 60 A
IFM = 30 A
0.15
IFM = 10 A
0.10
IFM = 5 A
60.PF.. Series
TJ = 25 °C
60.PF.. Series
TJ = 25 °C
IFM = 60 A
3
IFM = 30 A
2
IFM = 10 A
1
IFM = 5 A
IFM = 1 A
IFM = 1 A
0.05
0
0
80
40
160
120
200
0
120
200
160
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Recovery Time Characteristics, TJ = 25 °C
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
5
0.45
60.PF.. Series
TJ = 150 °C
0.35
IFM = 60 A
0.30
IFM = 30 A
0.25
IFM = 10 A
0.20
IFM = 5 A
0.15
60.PF.. Series
TJ = 150 °C
Qrr - Typical Reverse
Recovery Charge (µC)
0.40
trr - Typical Reverse
Recovery Time (µs)
80
40
IFM = 60 A
4
IFM = 30 A
3
IFM = 10 A
2
IFM = 5 A
1
IFM = 1 A
IFM = 1 A
0
0.10
10
20
30
40
50
60
70
80
90
100
10
20
30
40
50
60
70
80
90
100
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
Revision: 11-Feb-16
Document Number: 93710
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60.PF0.PbF Series, VS-60.PF0.-M3 Series
www.vishay.com
Vishay Semiconductors
25
60.PF.. Series
TJ = 25 °C
20
60.PF.. Series
TJ = 150 °C
IFM = 60 A
Irr - Typical Reverse
Recovery Current (A)
Irr - Typical Reverse
Recovery Current (A)
25
IFM = 30 A
15
IFM = 10 A
10
IFM = 5 A
IFM = 1 A
5
0
20
IFM = 60 A
IFM = 30 A
IFM = 10 A
IFM = 5 A
IFM = 1 A
15
10
5
0
40
0
80
120
160
200
10
20
30
40
50
60
70
80
90
100
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
ZthJC - Transient Thermal Impedance (K/W)
dI/dt - Rate of Fall of Forward Current (A/µs)
1
Steady state value
(DC operation)
0.1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Single pulse
60.PF.. Series
0.01
0.001
0.01
0.1
1
10
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 11-Feb-16
Document Number: 93710
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-60.PF0.PbF Series, VS-60.PF0.-M3 Series
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
60
E
P
F
06
PbF
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (60 = 60 A)
3
-
Circuit configuration:
E = single diode
A = single diode, 3 pins
4
-
Package:
P = TO-247AC/TO-247AC modified
5
-
Type of silicon:
F = fast recovery
6
-
Voltage code x 100 = VRRM
7
-
Environmental digit:
02 = 200 V
04 = 400 V
06 = 600 V
PbF = lead (Pb)-free and RoHS-compliant
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-60EPF02PbF
25
500
Antistatic plastic tubes
VS-60EPF02-M3
25
500
Antistatic plastic tubes
VS-60APF02PbF
25
500
Antistatic plastic tubes
VS-60APF02-M3
25
500
Antistatic plastic tubes
VS-60EPF04PbF
25
500
Antistatic plastic tubes
VS-60EPF04-M3
25
500
Antistatic plastic tubes
VS-60APF04PbF
25
500
Antistatic plastic tubes
VS-60APF04-M3
25
500
Antistatic plastic tubes
VS-60EPF06PbF
25
500
Antistatic plastic tubes
VS-60EPF06-M3
25
500
Antistatic plastic tubes
VS-60APF06PbF
25
500
Antistatic plastic tubes
VS-60APF06-M3
25
500
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
SPICE model
TO-247AC modified
www.vishay.com/doc?95541
TO-247AC
www.vishay.com/doc?95542
TO-247AC modified PbF
www.vishay.com/doc?95255
TO-247AC modified -M3
www.vishay.com/doc?95442
TO-247AC PbF
www.vishay.com/doc?95226
TO-247AC -M3
www.vishay.com/doc?95007
www.vishay.com/doc?95275
Revision: 11-Feb-16
Document Number: 93710
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
TO-247 - 50 mils L/F modified
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Ø P
E
B
(2) R/2
N
A2
S
(Datum B)
Ø K M DBM
Ø P1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
A
See view B
2 x b2
3xb
A1
b4
(b1, b3, b5)
Plating
View A - A
C
2x e
0.10 M C A M
(4)
E1
Base metal
D DE
(c)
c1
E
C
C
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.17
1.37
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.046
0.054
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
View B
NOTES
SYMBOL
3
4
D2
E
E1
e
ØK
L
L1
N
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.35
15.29
15.87
13.46
5.46 BSC
0.254
14.20
16.10
3.71
4.29
7.62 BSC
3.56
3.66
7.39
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.053
0.602
0.625
0.53
0.215 BSC
0.010
0.559
0.634
0.146
0.169
0.3
0.14
0.144
0.291
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerance per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension c and Q
Revision: 21-Apr-15
Document Number: 95541
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
TO-247 - 50 mils L/F
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Φ P
E
B
(2) R/2
N
A2
S
(Datum B)
Ø K M DBM
Φ P1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
A
See view B
2 x b2
3xb
0.10 M C A M
0.01 M D B M
View A - A
C
2x e
A1
b4
(b1, b3, b5)
Plating
(4)
E1
Base metal
D DE
(c)
c1
E
C
C
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.17
1.37
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.046
0.054
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
View B
NOTES
SYMBOL
3
4
D2
E
E1
e
ØK
L
L1
N
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.35
15.29
15.87
13.46
5.46 BSC
0.254
14.20
16.10
3.71
4.29
7.62 BSC
3.56
3.66
7.39
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.053
0.602
0.625
0.53
0.215 BSC
0.010
0.559
0.634
0.146
0.169
0.3
0.14
0.144
0.291
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension c and Q
Revision: 21-Apr-15
Document Number: 95542
1
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
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contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
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any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000
Mouser Electronics
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