VS-65EPF12LHM3, VS-65APF12LHM3
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Vishay Semiconductors
Fast Soft Recovery Rectifier Diode, 65 A
FEATURES
• Very low forward voltage drop
• Glass passivated pellet chip junction
2
• AEC-Q101 qualified meets JESD 201 class 1A
whisker test
1
1
2
TO-247AD 2L
TO-247AD 3L
• Flexible solution for reliable AC power
rectification
Base cathode
2
Base cathode
2
• High surge, low VF rugged blocking diode for DC charging
stations
3
3
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
Cathode
3
Anode
VS-65EPF12LHM3
3
Anode
1
Anode
VS-65APF12LHM3
APPLICATIONS
• On-board and off-board EV / HEV battery chargers
• Renewable energy inverters
DESCRIPTION
PRIMARY CHARACTERISTICS
IF(AV)
65 A
VR
1200 V
VF at IF
1.42 V
IFSM
830 A
trr
95 ns
High voltage rectifiers optimized for very low forward
voltage drop with moderate leakage, and short reverse
recovery time.
These devices are intended for use in main rectification
(single or three phase bridge).
TJ max.
150 °C
Package
TO-247AD 2L, TO-247AD 3L
Circuit configuration
Single
Snap factor
0.6
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
IF(AV)
CHARACTERISTICS
Sinusoidal waveform
VALUES
UNITS
65
A
VRRM
1200
V
IFSM
830
A
95
ns
trr
1 A, 100 A/μs
VF
30 A, TJ = 25 °C
TJ
1.20
V
-40 to +150
°C
VOLTAGE RATINGS
PART NUMBER
VRSM, MAXIMUM
VRRM, MAXIMUM
NON-REPETITIVE PEAK REVERSE
PEAK REVERSE VOLTAGE
VOLTAGE
V
V
VS-65EPF12LHM3
1200
1300
VS-65APF12LHM3
1200
1300
IRRM
AT 150 °C
mA
16
Revision: 22-Feb-18
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
Maximum average forward current
IF(AV)
TC = 113 °C, 180° conduction half sine wave
65
Maximum peak one cycle
non-repetitive surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
I2t
10 ms sine pulse, rated VRRM applied
700
10 ms sine pulse, no voltage reapplied
830
10 ms sine pulse, rated VRRM applied
2450
10 ms sine pulse, no voltage reapplied
3460
t = 0.1 ms to 10 ms, no voltage reapplied
UNITS
A
A2s
34 600
A2s
VALUES
UNITS
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
VFM
Forward slope resistance
rt
Threshold voltage
VF(TO)
Maximum reverse leakage current
IRM
TEST CONDITIONS
65 A, TJ = 25 °C
1.42
V
4.6
m
0.9
V
TJ = 150 °C
TJ = 25 °C
TJ = 150 °C
0.1
VR = rated VRRM
mA
16
RECOVERY CHARACTERISTICS
PARAMETER
SYMBOL
Reverse recovery time
trr
Reverse recovery current
Irr
Reverse recovery charge
Qrr
Snap factor
S
TEST CONDITIONS
IF at 60 Apk
25 A/μs
25 °C
Typical
VALUES
UNITS
480
ns
8
A
2.7
μC
IFM
trr
ta
tb
dir
dt
t
Qrr
IRM(REC)
0.6
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Maximum thermal resistance,
unction to case
RthJC
Maximum thermal resistance,
junction to ambient
RthJA
Typical thermal resistance,
case to heatsink
RthCS
DC operation
Marking device
UNITS
-40 to +150
°C
0.25
°C/W
40
Mounting surface, smooth, and greased
0.25
6
g
0.21
oz.
minimum
6 (5)
maximum
12 (10)
kgf · cm
(lbf · in)
Approximate weight
Mounting torque
VALUES
Case style TO-247AD 2L
65EPF12LH
Case style TO-247AD 3L
65APF12LH
Revision: 22-Feb-18
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VS-65EPF12LHM3, VS-65APF12LHM3
150
RthJC (DC) = 0.25 °C/W
140
Conduction
130
120
110
60°
100
30°
120°
90°
180°
90
0
10
20
30
40
50
60
70
Max. Average On-state Power Loss (W)
Vishay Semiconductors
150
120
90
RMS limit
60
Conduction Angle
30
Tj = 150°C
0
0
20
40
60
80
100
120
Fig. 1 - Current Rating Characteristics
Fig. 4 - Forward Power Loss Characteristics
800
RthJC (DC) = 0.25 °C/W
At any rated load condition and with
rated VRRM applied following surge.
140
Conduction angle
130
120
110
100
60°
90
DC
Average On-state Current (A)
150
DC
120°
90°
30°
700
Initial TJ = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
600
500
400
180°
300
80
1
0
20
40
60
80
100
120
10
100
Number of Equal Amplitude Half Cycle
Current Pulses (N)
Average On-State Current (A)
Fig. 2 - Current Rating Characteristics
Fig. 5 - Maximum Non-Repetitive Surge Current
900
120
180°
120°
90°
60°
30°
100
80
60
800
Peak Half Sine Wave
Forward Current (A)
Max. Average On-state Power Loss (W)
180°
120°
90°
60°
30°
Average On-State Current (A)
Peak Half Sine Wave
Forward Current (A)
Max. Allowable Case Temperature (°C)
Max. Allowable Case Temperature (°C)
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RMS limit
40
Conduction angle
Maximum non-repetitive surge current
versus pulse train duration.
Initial TJ = 150 °C
No voltage reapplied
Rated VRRM reapplied
700
600
500
400
20
TJ = 150 °C
0
0
10
20
30
40
50
60
70
300
0.01
0.1
1
Average On-state Current (A)
Pulse Train Duration (s)
Fig. 3 - Forward Power Loss Characteristics
Fig. 6 - Maximum Non-Repetitive Surge Current
Revision: 22-Feb-18
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VS-65EPF12LHM3, VS-65APF12LHM3
Vishay Semiconductors
12 000
1000
100
TJ = 25 °C
TJ = 150 °C
10
10 000
8000
IFM = 30 A
6000
IFM = 10 A
4000
IFM = 5 A
2000
IFM = 1 A
1
0
0
0.5
1.0
1.5
2.0
2.5
3.0
0
Instantaneous Forward Voltage (V)
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 7 - Forward Voltage Drop Characteristics
Fig. 10 - Recovery Charge Characteristics, TJ = 25 °C
25 000
600
TJ = 25 °C
IFM = 60 A
400
IFM = 30 A
300
IFM = 10 A
200
IFM = 5 A
100
Qrr - Typical Reverse
Recovery Charge (µC)
TJ = 150 °C
500
trr - Typical Reverse
Recovery Time (ns)
IFM = 60 A
TJ = 25 °C
Qrr - Typical Reverse
Recovery Charge (µC)
Instantaneous Forward Current (A)
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IFM = 60 A
20 000
15 000
IFM = 30 A
10 000
IFM = 10 A
5000
IFM = 5 A
IFM = 1 A
IFM = 1 A
0
0
0
40
80
120
160
0
200
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 8 - Thermal Impedance ZthJC Characteristics
Fig. 11 - Recovery Charge Characteristics, TJ = 150 °C
45
1200
Irr - Typical Reverse
Recovery Current (A)
trr - Typical Reverse
Recovery Time (ns)
1000
800
IFM = 60 A
600
IFM = 30 A
400
IFM = 10 A
200
IFM = 5 A
IFM = 1 A
TJ = 25 °C
40
TJ = 150 °C
IFM = 60 A
35
IFM = 30 A
30
25
IFM = 10 A
20
15
IFM = 5 A
10
IFM = 1 A
5
0
0
0
0
40
80
120
160
200
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
dI/dt - Rate of Fall of Forward Current (A/µs)
Fig. 12 - Recovery Current Characteristics, TJ = 25 °C
Fig. 9 - Recovery Time Characteristics, TJ = 150 °C
Revision: 22-Feb-18
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VS-65EPF12LHM3, VS-65APF12LHM3
www.vishay.com
Vishay Semiconductors
60
IFM = 60 A
TJ = 150 °C
Irr - Typical Reverse
Recovery Current (A)
50
IFM = 30 A
40
IFM = 10 A
30
20
IFM = 5 A
10
IFM = 1 A
0
0
40
80
120
160
200
dI/dt - Rate of Fall of Forward Current (A/µs)
Transient Thermal Impedance ZthJC
(°C/W)
Fig. 13 - Recovery Current Characteristics, TJ = 150 °C
1
0.5
0.1
Steady state value
(DC operation)
0.33
0.25
0.17
0.08
0.01
0.001
0.0001
Single pulse
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Fig. 14 - Thermal Impedance ZthJC Characteristics
Revision: 22-Feb-18
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VS-65EPF12LHM3, VS-65APF12LHM3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
65
E
P
F
12
L
H
M3
1
2
3
4
5
6
7
8
9
1
-
Vishay Semiconductors product
2
-
Current rating (65 = 65 A)
3
-
Circuit configuration:
E = single, 2 pins
A = single, 3 pins
4
-
Package:
P = TO-247AD
5
-
Type of silicon:
F = fast recovery rectifier
6
-
Voltage code x 100 = VRRM
7
-
L = long leads
8
-
H = AEC-Q101 qualified
9
-
12 = 1200 V
Environmental digit:
M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-65EPF12LHM3
25
500
Antistatic plastic tubes
VS-65APF12LHM3
25
500
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
TO-247AD 2L
www.vishay.com/doc?95536
TO-247AD 3L
www.vishay.com/doc?95626
TO-247AD 2L
www.vishay.com/doc?95648
TO-247AD 3L
www.vishay.com/doc?95007
Revision: 22-Feb-18
Document Number: 96497
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
www.vishay.com
Vishay Semiconductors
TO-247AD 2L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) F P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M D BM
F P1
A
D2
Q
2xR
(2)
D1 (4)
D
1, 2
4
D
3
Thermal pad
(5) L1
C
L
See view B
(4)
E1
A
0.01 M D B M
View A - A
C
2 x b2
2xb
2x e
A1
0.10 M C A M
(b1, b3)
Plating
Base metal
D D
(c)
c1
C
C
(b, b2)
(4)
Section C - C, D - D
SYMBOL
MILLIMETERS
View B
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.65
5.31
0.183
0.209
A1
2.21
2.59
0.087
0.102
NOTES
SYMBOL
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
E
15.29
15.87
0.602
0.625
E1
13.46
-
0.53
-
A2
1.50
2.49
0.059
0.098
e
5.46 BSC
b
0.99
1.40
0.039
0.055
ØK
0.254
b1
0.99
1.35
0.039
0.053
L
19.81
20.32
0.780
0.800
b2
1.65
2.39
0.065
0.094
L1
3.71
4.29
0.146
0.169
b3
1.65
2.34
0.065
0.092
ØP
3.56
3.66
0.14
0.144
c
0.38
0.89
0.015
0.035
Ø P1
-
6.98
-
0.275
NOTES
3
0.215 BSC
0.010
c1
0.38
0.84
0.015
0.033
Q
5.31
5.69
0.209
0.224
D
19.71
20.70
0.776
0.815
3
R
4.52
5.49
0.178
0.216
D1
13.08
-
0.515
-
4
S
D2
0.51
1.35
0.020
0.053
5.51 BSC
0.217 BSC
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 28-May-2018
Document Number: 95536
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Outline Dimensions
www.vishay.com
Vishay Semiconductors
TO-247AD 3L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Φ P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M DBM
Φ P1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
(4)
E1
A
0.01 M D B M
View A - A
See view B
2 x b2
3xb
C
2x e
b4
A1
0.10 M C A M
(b1, b3, b5)
Plating
Base metal
D DE
(c)
c1
E
C
C
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.50
2.49
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.059
0.098
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
View B
NOTES
3
4
SYMBOL
D2
E
E1
e
ØK
L
L1
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.30
15.29
15.87
13.46
5.46 BSC
0.254
19.81
20.32
3.71
4.29
3.56
3.66
6.98
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.051
0.602
0.625
0.53
0.215 BSC
0.010
0.780
0.800
0.146
0.169
0.14
0.144
0.275
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 06-Mar-2020
Document Number: 95626
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
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Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
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