VS-80TPS16L-M3
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Vishay Semiconductors
Thyristor High Voltage, Phase Control SCR, 80 A
FEATURES
2
(A)
• Designed and qualified according to
JEDEC®-JESD 47
• 150 °C maximum
temperature
1
2
1 (K)
junction
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
3
TO-247AD 3L
operating
(G) 3
APPLICATIONS
PRIMARY CHARACTERISTICS
IT(AV)
80 A
VDRM/VRRM
1600 V
VTM (typ.)
1.16 V
IGT
100 mA
TJ
-40 °C to +150 °C
Package
TO-247AD 3L
Circuit configuration
Single SCR
Typical usage is in input rectification crowbar (soft start) and
AC switch motor control, UPS, welding, and battery charge.
DESCRIPTION
The VS-80TPS16L high voltage series of silicon controlled
rectifiers are specifically designed for medium power
switching, and phase control applications. The glass
passivation technology used, has reliable operation up to
150 °C junction temperature.
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
SYMBOL
Peak repetitive reverse voltage
VRRM/VDRM
On-state voltage
VT
TEST CONDITIONS
VALUES
80 A, TJ = 125 °C, typical
80
IT(AV)
Maximum continuous RMS on-state current
IRMS
126
Non-repetitive peak surge current
ITSM
1000
Maximum operating junction and storage temperature range
V
1.16
Average rectified forward current
Maximum rate of rise
UNITS
1600
A
dV/dt
1000
V/μs
TJ, TStg
-40 to +150
°C
VOLTAGE RATINGS
PART NUMBER
VS-80TPS16L-M3
VRRM/VDRM, MAXIMUM
REPETITIVE PEAK AND
OFF-STATE VOLTAGE
V
VRSM, MAXIMUM
NON-REPETITIVE PEAK
REVERSE VOLTAGE
V
TYP. IRRM/IDRM
AT 125 °C
mA
1600
1700
10
Revision: 19-Dec-2018
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average on-state current
IT(AV)
Maximum continuous RMS on-state
current as AC switch
IT(RMS)
Peak, one-cycle non-repetitive surge current
ITSM
I2t for fusing
I2t
I2√t for fusing
I2√t
On-state voltage
VT
Low level value of threshold voltage
VT01
High level value of threshold voltage
VT02
Low level value of on-state slope resistance
rt1
High level value of on-state slope resistance
rt2
Rate of rise of turned-on current
dI/dt
Holding current
IH
Latching current
IL
Reverse and direct leakage current
Rate of rise of off-state voltage
IRRM/IDRM
dV/dt
TEST CONDITIONS
TYP.
TC = 113 °C, 180° conduction half sine wave
10 ms sine pulse, rated VRRM applied
10 ms sine pulse, no voltage reapplied
MAX. UNITS
-
80
-
126
-
840
-
1000
-
3536
10 ms sine pulse, no voltage reapplied
-
5000
t = 0.1 ms to 10 ms, no voltage reapplied, TJ = 125 °C
-
50 000
80 A, TJ = 25 °C
1.22
1.40
160 A, TJ = 25 °C
1.48
1.66
80 A, TJ = 125 °C
1.16
1.24
160 A, TJ = 125 °C
1.49
1.62
10 ms sine pulse, rated VRRM applied
Initial TJ =
TJ maximum
A
A2s
A2√s
V
-
0.80
-
0.89
-
4.82
-
4.51
-
500
-
200
-
400
TJ = 25 °C
50
200
TJ = 125 °C
10
60
mA
-
1000
V/μs
TYP.
MAX.
UNITS
-
10
-
2.5
-
2.5
TJ = 150 °C
TJ = 150 °C
TJ = 125 °C, VR = 1000 V, IT = 100 A, Igt = 450 mA,
VGT = 2.5 V
Anode supply = 6 V, resistive load, TJ = 25 °C
TJ = TJ maximum, linear to 80 % VDRM, Rg-k = open
V
mΩ
A/μs
mA
μA
TRIGGERING
PARAMETER
Peak gate power
Average gate power
Peak gate current
Peak negative gate voltage
Required DC gate voltage to trigger
SYMBOL
PGM
PG(AV)
TEST CONDITIONS
10 ms sine pulse, no voltage reapplied
IGM
-VGM
VGT
TJ = 25 °C
Anode supply = 6 V resistive load
Required DC gate to trigger
IGT
TJ = 25 °C
Anode supply = 6 V resistive load
DC gate voltage not to trigger
VGD
DC gate current not to trigger
IGD
TJ = 125 °C, VDRM = 80 % rated value
-
10
-
1.5
W
A
V
-
100
mA
-
0.20
V
-
5
mA
TYP.
MAX.
UNITS
2
-
150
-
SWITCHING
PARAMETER
SYMBOL
Turn-on time
tgt
IT = 80 A, VD = 50 % VDRM, Igt = 300 mA, TJ = 25 °C
TEST CONDITIONS
Turn-off time
tq
IT = 80 A, VD = 80 % VDRM, dV/dt = 20 V/μs, tp = 200 μs
Igt = 100 mA, dI/dt = 10 A/μs, VR = 100 V, TJ = 150 °C
μs
Revision: 19-Dec-2018
Document Number: 96072
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-80TPS16L-M3
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Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum operating junction and storage temperature
range
MIN.
MAX.
UNITS
TJ, TStg
-40
150
°C
RthJC
-
0.23
Maximum thermal resistance, junction to case
Maximum thermal resistance, junction to ambient
RthJA
Typical thermal resistance, case to heatsink
RthCS
TEST CONDITIONS
Mounting surface, smooth, and greased
Approximate weight
Mounting torque
°C/W
40
0.20
6 (0.21)
g (oz.)
minimum
6 (5)
maximum
12 (10)
kgf · cm
(lbf · in)
Marking device
Case style TO-247AD 3L
80TPS16L
ΔRthJ-HS CONDUCTION PER JUNCTION
SINE HALF-WAVE CONDUCTION
90°
60°
30°
180°
120°
90°
60°
30°
0.031
0.036
0.040
0.042
0.044
0.028
0.036
0.038
0.040
0.042
150
RthJC (DC) = 0.23 °C/W
140
130
Conduction Angle
120
110
100
90
80
70
30°
60
60 °
180°
90° 120°
50
0
20
40
60
80
100
120
140
160
RMS limit
125
100
75
50
Conduction Angle
25
TJ = 150 °C
0
0
130
Conduction Angle
110
100
90
80
70
60
30° 60° 90°
120° 180°
DC
40
0
40
80
120
160
200
20
40
60
80
100
Average On-state Current (A)
RthJC (DC) = 0.23 °C/W
50
180°
120°
90°
60°
30°
Fig. 3 - On-State Power Loss Characteristics
150
120
°C/W
150
Average On-state Current (A)
Fig. 1 - Current Rating Characteristics
140
UNITS
120°
240
Max. Average On-state Power Loss (W)
Maximum Allowable Case Temperature (°C)
Maximum Allowable Case Temperature (°C)
VS-80TPS16L-M3
RECTANGULAR WAVE CONDUCTION
180°
Max. Average On-state Power Loss (W)
DEVICE
200
140
180°
120°
90°
60°
30°
120
RMS limit
180
160
DC
100
80
60
Conduction Angle
40
20
TJ = 150 °C
0
0
20
40
60
80
100
120
140
Average On-state Current (A)
Average On-state Current (A)
Fig. 2 - Current Rating Characteristics
Fig. 4 - On-State Power Loss Characteristics
Revision: 19-Dec-2018
Document Number: 96072
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VS-80TPS16L-M3
Vishay Semiconductors
Peak Half Sine Wave On- State Current (A)
Peak Half Sine Wave On-State Current (A)
www.vishay.com
900
At any rated load condition and with
rated Vrrm applied following surge.
Initial TJ = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
800
700
600
500
400
1
10
100
Number Of Equal Amplitude
Half Cycle Current Pulse (N)
1000
Maximum non repetitive surge current
vs. pulse train duration. Control of
conduction may not be maintanined
900
Initial TJ = 150 °C
No voltage reapplied
Rated Vrrm reapplied
800
700
600
500
400
300
0.01
0.1
1
Pulse Train Duration (s)
Fig. 5 - Maximum Non-Repetitive Surge Current
Fig. 6 - Maximum Non-Repetitive Surge Current
IF - Instantaneous Forward Current (A)
1000
100
10
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
1
0.4
0.8
1.2
1.6
2.0
2.4
VF - Forward Voltage Drop (V)
Z thJC - Thermal Impedance Junction to Case
(°C/W)
Fig. 7 - On-State Voltage Drop Characteristics
1
80TPS16L
Steady state value
(DC operation)
0.50
0.1
0.33
0.25
PDM
0.17
t2
0.08
0.01
0.0001
t1
0.001
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
Single pulse
0.01
0.1
1
10
t 1 - Rectangular Pulse Duration (s)
Fig. 8 - Maximum Thermal Impedance ZthJC Characteristics
Revision: 19-Dec-2018
Document Number: 96072
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-80TPS16L-M3
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Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS-
80
T
P
S
16
L
-M3
1
2
3
4
5
6
7
8
1
-
Vishay Semiconductors product
2
-
Current code (80 = 80 A)
3
-
Circuit configuration:
T = thyristor
4
-
5
-
P = TO-247 package
Type of silicon:
S = standard recovery rectifier
6
-
Voltage code (16 = 1600 V)
7
-
Package L = long lead
8
-
-M3 = halogen-free, RoHS-compliant, and terminations lead (Pb)-free
ORDERING INFORMATION (example)
PREFERRED P/N
QUANTITY PER TUBE
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-80TPS16L-M3
25
500
Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95626
Part marking information
www.vishay.com/doc?95007
Revision: 19-Dec-2018
Document Number: 96072
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
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Vishay Semiconductors
TO-247AD 3L
DIMENSIONS in millimeters and inches
A
A
(3)
(6) Φ P
E
B
(2) R/2
A2
S
(Datum B)
Ø K M DBM
Φ P1
A
D2
Q
2xR
(2)
D1 (4)
D
1
4
D
3
2
Thermal pad
(5) L1
C
L
(4)
E1
A
0.01 M D B M
View A - A
See view B
2 x b2
3xb
C
2x e
b4
A1
0.10 M C A M
(b1, b3, b5)
Plating
Base metal
D DE
(c)
c1
E
C
C
(b, b2, b4)
(4)
Section C - C, D - D, E - E
SYMBOL
A
A1
A2
b
b1
b2
b3
b4
b5
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.65
5.31
2.21
2.59
1.50
2.49
0.99
1.40
0.99
1.35
1.65
2.39
1.65
2.34
2.59
3.43
2.59
3.38
0.38
0.89
0.38
0.84
19.71
20.70
13.08
-
INCHES
MIN.
MAX.
0.183
0.209
0.087
0.102
0.059
0.098
0.039
0.055
0.039
0.053
0.065
0.094
0.065
0.092
0.102
0.135
0.102
0.133
0.015
0.035
0.015
0.033
0.776
0.815
0.515
-
View B
NOTES
3
4
SYMBOL
D2
E
E1
e
ØK
L
L1
ØP
Ø P1
Q
R
S
MILLIMETERS
MIN.
MAX.
0.51
1.30
15.29
15.87
13.46
5.46 BSC
0.254
19.81
20.32
3.71
4.29
3.56
3.66
6.98
5.31
5.69
4.52
5.49
5.51 BSC
INCHES
MIN.
MAX.
0.020
0.051
0.602
0.625
0.53
0.215 BSC
0.010
0.780
0.800
0.146
0.169
0.14
0.144
0.275
0.209
0.224
0.178
0.216
0.217 BSC
NOTES
3
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994
(2) Contour of slot optional
(3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body
(4) Thermal pad contour optional with dimensions D1 and E1
(5) Lead finish uncontrolled in L1
(6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154")
(7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4
Revision: 06-Mar-2020
Document Number: 95626
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